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SG83741A1 - Coupling spaced bond pads to a contact - Google Patents

Coupling spaced bond pads to a contact

Info

Publication number
SG83741A1
SG83741A1 SG9903986A SG1999003986A SG83741A1 SG 83741 A1 SG83741 A1 SG 83741A1 SG 9903986 A SG9903986 A SG 9903986A SG 1999003986 A SG1999003986 A SG 1999003986A SG 83741 A1 SG83741 A1 SG 83741A1
Authority
SG
Singapore
Prior art keywords
contact
bond pads
spaced bond
coupling spaced
coupling
Prior art date
Application number
SG9903986A
Inventor
Yang Jicheng
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG9903986A priority Critical patent/SG83741A1/en
Publication of SG83741A1 publication Critical patent/SG83741A1/en
Priority to US10/215,571 priority patent/US6580160B2/en
Priority to US10/426,571 priority patent/US6768187B2/en
Priority to US10/845,983 priority patent/US6909167B2/en
Priority to US11/123,297 priority patent/US7075173B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
SG9903986A 1999-08-17 1999-08-17 Coupling spaced bond pads to a contact SG83741A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SG9903986A SG83741A1 (en) 1999-08-17 1999-08-17 Coupling spaced bond pads to a contact
US10/215,571 US6580160B2 (en) 1999-08-17 2002-08-08 Coupling spaced bond pads to a contact
US10/426,571 US6768187B2 (en) 1999-08-17 2003-04-30 Coupling spaced bond pads to a contact
US10/845,983 US6909167B2 (en) 1999-08-17 2004-05-14 Coupling spaced bond pads to a contact
US11/123,297 US7075173B2 (en) 1999-08-17 2005-05-06 Interposer including adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9903986A SG83741A1 (en) 1999-08-17 1999-08-17 Coupling spaced bond pads to a contact

Publications (1)

Publication Number Publication Date
SG83741A1 true SG83741A1 (en) 2001-10-16

Family

ID=20430410

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9903986A SG83741A1 (en) 1999-08-17 1999-08-17 Coupling spaced bond pads to a contact

Country Status (1)

Country Link
SG (1) SG83741A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5569956A (en) * 1995-08-31 1996-10-29 National Semiconductor Corporation Interposer connecting leadframe and integrated circuit
US5903443A (en) * 1997-04-07 1999-05-11 Micron Technology, Inc. Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5569956A (en) * 1995-08-31 1996-10-29 National Semiconductor Corporation Interposer connecting leadframe and integrated circuit
US5903443A (en) * 1997-04-07 1999-05-11 Micron Technology, Inc. Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die

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