SG82021A1 - Semiconductor mounting apparatus with a chip gripper - Google Patents
Semiconductor mounting apparatus with a chip gripperInfo
- Publication number
- SG82021A1 SG82021A1 SG9904763A SG1999004763A SG82021A1 SG 82021 A1 SG82021 A1 SG 82021A1 SG 9904763 A SG9904763 A SG 9904763A SG 1999004763 A SG1999004763 A SG 1999004763A SG 82021 A1 SG82021 A1 SG 82021A1
- Authority
- SG
- Singapore
- Prior art keywords
- mounting apparatus
- semiconductor mounting
- chip gripper
- gripper
- chip
- Prior art date
Links
Classifications
-
- H10P72/0446—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH200098 | 1998-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG82021A1 true SG82021A1 (en) | 2001-07-24 |
Family
ID=4223557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG9904763A SG82021A1 (en) | 1998-10-01 | 1999-09-23 | Semiconductor mounting apparatus with a chip gripper |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100595881B1 (en) |
| SG (1) | SG82021A1 (en) |
| TW (1) | TW451383B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111790710B (en) * | 2019-04-09 | 2022-07-22 | 北京北方华创微电子装备有限公司 | Position conversion device and cleaning equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09298210A (en) * | 1996-05-07 | 1997-11-18 | Matsushita Electric Ind Co Ltd | Die bonding machine |
| US5768125A (en) * | 1995-12-08 | 1998-06-16 | Asm International N.V. | Apparatus for transferring a substantially circular article |
-
1999
- 1999-09-23 SG SG9904763A patent/SG82021A1/en unknown
- 1999-09-28 TW TW088116626A patent/TW451383B/en not_active IP Right Cessation
- 1999-09-30 KR KR1019990042013A patent/KR100595881B1/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5768125A (en) * | 1995-12-08 | 1998-06-16 | Asm International N.V. | Apparatus for transferring a substantially circular article |
| JPH09298210A (en) * | 1996-05-07 | 1997-11-18 | Matsushita Electric Ind Co Ltd | Die bonding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100595881B1 (en) | 2006-07-03 |
| KR20000028749A (en) | 2000-05-25 |
| TW451383B (en) | 2001-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG93833A1 (en) | Method for forming a semiconductor device | |
| EP0702408A3 (en) | Package for mounting a semiconductor device | |
| SG77227A1 (en) | Semiconductor device its manufacturing method and substrate for manufacturing a semiconductor device | |
| EP1029954A4 (en) | Substrate plating device | |
| IL139532A0 (en) | Semiconductor device | |
| SG81289A1 (en) | Semiconductor device | |
| GB9915672D0 (en) | A semiconductor device | |
| GB2338344B (en) | Semiconductor device | |
| GB2344461B (en) | Semiconductor devices | |
| GB2336945B (en) | Method for forming interconnection structure for a semiconductor device | |
| GB9802105D0 (en) | Semiconductor opto-electronic device packaging | |
| GB9920496D0 (en) | A semiconductor device | |
| GB2341176B (en) | Attitude changing device for electronic chips | |
| GB2354879B (en) | A semiconductor device | |
| GB9820192D0 (en) | Semiconductor device | |
| SG78391A1 (en) | Semiconductor device manufacturing method | |
| GB9820567D0 (en) | Semiconductor device | |
| GB2341275B (en) | Semiconductor devices | |
| SG96203A1 (en) | Apparatus for mounting semiconductor chips on a substrate | |
| GB2337634B (en) | Method for fabricating a semiconductor device | |
| GB2344456B (en) | Semiconductor devices | |
| GB2326024B (en) | Method for manufacturing a semiconductor device | |
| EP1039547A4 (en) | Semiconductor device | |
| GB9827492D0 (en) | A semiconductor laser device | |
| GB2336243B (en) | Method for manufacturing semiconductor device |