[go: up one dir, main page]

SG48868A1 - Connection structure between components for semiconductor apparatus - Google Patents

Connection structure between components for semiconductor apparatus

Info

Publication number
SG48868A1
SG48868A1 SG1996003201A SG1996003201A SG48868A1 SG 48868 A1 SG48868 A1 SG 48868A1 SG 1996003201 A SG1996003201 A SG 1996003201A SG 1996003201 A SG1996003201 A SG 1996003201A SG 48868 A1 SG48868 A1 SG 48868A1
Authority
SG
Singapore
Prior art keywords
components
connection structure
semiconductor apparatus
semiconductor
connection
Prior art date
Application number
SG1996003201A
Other languages
English (en)
Inventor
Akira Sasame
Akira Yamakawa
Hisao Tekeuchi
Hitoshi Akazawa
Hitoyuki Sakanoue
Masaya Miyake
Yasuhisa Yushio
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of SG48868A1 publication Critical patent/SG48868A1/en

Links

Classifications

    • H10W72/071—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H10W70/093—
    • H10W70/457—
    • H10W76/12—
    • H10W76/60—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1025—Metallic discs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576—Boride, carbide or nitride component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
SG1996003201A 1987-07-03 1988-06-28 Connection structure between components for semiconductor apparatus SG48868A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP16519087 1987-07-03
JP17507087 1987-07-14
JP27527787 1987-10-30
JP31533087 1987-12-15

Publications (1)

Publication Number Publication Date
SG48868A1 true SG48868A1 (en) 1998-05-18

Family

ID=27473981

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996003201A SG48868A1 (en) 1987-07-03 1988-06-28 Connection structure between components for semiconductor apparatus

Country Status (6)

Country Link
US (1) US5010388A (fr)
EP (1) EP0297511B1 (fr)
KR (1) KR910007016B1 (fr)
CA (1) CA1308494C (fr)
DE (1) DE3856562T2 (fr)
SG (1) SG48868A1 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5529852A (en) * 1987-01-26 1996-06-25 Sumitomo Electric Industries, Ltd. Aluminum nitride sintered body having a metallized coating layer on its surface
WO1990013914A1 (fr) * 1989-05-01 1990-11-15 Sumitomo Electric Industries, Ltd. Cadre de montage pour dispositifs a semi-conducteur
KR920000127A (ko) * 1990-02-26 1992-01-10 미다 가쓰시게 반도체 패키지와 그것을 위한 리드프레임
US5179435A (en) * 1990-03-05 1993-01-12 Nec Corporation Resin sealed semiconductor integrated circuit device
US5220200A (en) * 1990-12-10 1993-06-15 Delco Electronics Corporation Provision of substrate pillars to maintain chip standoff
WO1992022090A1 (fr) * 1991-06-03 1992-12-10 Motorola, Inc. Ensemble electronique thermoconducteur
US5432535A (en) * 1992-12-18 1995-07-11 Xerox Corporation Method and apparatus for fabrication of multibeam lasers
US6696103B1 (en) 1993-03-19 2004-02-24 Sumitomo Electric Industries, Ltd. Aluminium nitride ceramics and method for preparing the same
JP3593707B2 (ja) * 1993-03-19 2004-11-24 住友電気工業株式会社 窒化アルミニウムセラミックスとその製造方法
JP3693300B2 (ja) * 1993-09-03 2005-09-07 日本特殊陶業株式会社 半導体パッケージの外部接続端子及びその製造方法
JP3575068B2 (ja) * 1994-08-02 2004-10-06 住友電気工業株式会社 平滑なめっき層を有するセラミックスメタライズ基板およびその製造方法
WO1996015283A1 (fr) * 1994-11-15 1996-05-23 Tosoh Smd, Inc. Procede pour fixer des cibles sur une plaque de support
US5593082A (en) * 1994-11-15 1997-01-14 Tosoh Smd, Inc. Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby
US5522535A (en) * 1994-11-15 1996-06-04 Tosoh Smd, Inc. Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies
JP3845925B2 (ja) * 1996-02-05 2006-11-15 住友電気工業株式会社 窒化アルミニウム基材を用いた半導体装置用部材及びその製造方法
US6783867B2 (en) * 1996-02-05 2004-08-31 Sumitomo Electric Industries, Ltd. Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same
DE10221085B4 (de) * 2002-05-11 2012-07-26 Robert Bosch Gmbh Baugruppe mit einer Verbindungseinrichtung zum Kontaktieren eines Halbleiter-Bauelements und Herstellungsverfahren
WO2006051881A1 (fr) * 2004-11-12 2006-05-18 Tokuyama Corporation Procede de fabrication d'un substrat en nitrure d'aluminium metallise et substrat ainsi obtenu
KR20090042574A (ko) * 2007-10-26 2009-04-30 삼성전자주식회사 반도체 모듈 및 이를 구비하는 전자 장치
JP2011187687A (ja) * 2010-03-09 2011-09-22 Panasonic Corp 半導体装置用リードフレームとその製造方法
US10165669B2 (en) 2011-12-22 2018-12-25 Kyocera Corporation Wiring board and electronic device
KR102335720B1 (ko) * 2017-03-27 2021-12-07 삼성전자주식회사 표면 실장용 금속 유닛 및 이를 포함하는 전자 장치
CN111989759B (zh) * 2018-05-30 2023-04-25 柏恩氏株式会社 断路器、安全电路和二次电池组
WO2020004566A1 (fr) 2018-06-28 2020-01-02 京セラ株式会社 Base et dispositif à semi-conducteur

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607157A (ja) * 1983-06-25 1985-01-14 Masami Kobayashi Ｉｃ用リ−ドフレ−ム
JPH0810710B2 (ja) * 1984-02-24 1996-01-31 株式会社東芝 良熱伝導性基板の製造方法
JPS61176142A (ja) * 1985-01-31 1986-08-07 Toshiba Corp 基板構造体
US4780572A (en) * 1985-03-04 1988-10-25 Ngk Spark Plug Co., Ltd. Device for mounting semiconductors
JPH0791610B2 (ja) * 1985-06-17 1995-10-04 日本電装株式会社 非酸化物セラミックヒータ用金属ロー材
US4729010A (en) * 1985-08-05 1988-03-01 Hitachi, Ltd. Integrated circuit package with low-thermal expansion lead pieces
JPS62197379A (ja) * 1986-02-20 1987-09-01 株式会社東芝 窒化アルミニウム基板
JPS6318648A (ja) * 1986-07-11 1988-01-26 Toshiba Corp 窒化アルミニウム回路基板
JPH0680873B2 (ja) * 1986-07-11 1994-10-12 株式会社東芝 回路基板
US4761518A (en) * 1987-01-20 1988-08-02 Olin Corporation Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs

Also Published As

Publication number Publication date
KR910007016B1 (ko) 1991-09-14
KR890003013A (ko) 1989-04-12
US5010388A (en) 1991-04-23
EP0297511B1 (fr) 2003-10-08
EP0297511A3 (fr) 1991-03-13
DE3856562T2 (de) 2004-08-05
CA1308494C (fr) 1992-10-06
EP0297511A2 (fr) 1989-01-04
DE3856562D1 (de) 2003-11-13

Similar Documents

Publication Publication Date Title
SG48868A1 (en) Connection structure between components for semiconductor apparatus
EP0297569A3 (en) Member for semiconductor apparatus
EP0290218A3 (en) Apparatus for retaining wafers
EP0297512A3 (en) Member for semiconductor apparatus
GB2234112B (en) Semiconductor component
EP0313466A3 (en) Wafer positioning apparatus
EP0187249A3 (en) Apparatus for producing semiconductor devices
EP0371087A4 (en) Apparatus for inspecting wafers
EP0169574A3 (en) Apparatus for manufacturing semiconductor device
EP0278460A3 (en) Wafer flip apparatus
GB8713440D0 (en) Semiconductor device
GB2213988B (en) Semiconductor device
EP0331814A3 (en) Lead frame for semiconductor device
EP0279605A3 (en) Semiconductor device
GB8713386D0 (en) Semiconductor device
EP0243170A3 (en) Semiconductor laser apparatus
GB8804954D0 (en) Semiconductor device
GB8713388D0 (en) Semiconductor device
GB8723775D0 (en) Semiconductor device
EP0306021A3 (en) Chip mounting apparatus
GB8713382D0 (en) Semiconductor device
GB8814297D0 (en) Semiconductor device
EP0299163A3 (en) Interconnection method for semiconductor device
SG26295G (en) Semiconductor laser apparatus
EP0316909A3 (en) Semiconductor optical apparatus