[go: up one dir, main page]

SG2014014054A - Device and Method for Alignment of substrates - Google Patents

Device and Method for Alignment of substrates

Info

Publication number
SG2014014054A
SG2014014054A SG2014014054A SG2014014054A SG2014014054A SG 2014014054 A SG2014014054 A SG 2014014054A SG 2014014054 A SG2014014054 A SG 2014014054A SG 2014014054 A SG2014014054 A SG 2014014054A SG 2014014054 A SG2014014054 A SG 2014014054A
Authority
SG
Singapore
Prior art keywords
substrates
alignment
Prior art date
Application number
SG2014014054A
Other languages
English (en)
Inventor
Erich Thallner
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG2014014054A publication Critical patent/SG2014014054A/en

Links

Classifications

    • H10P72/53—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/26—Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
    • H10P72/0428—
    • H10P74/238—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
SG2014014054A 2013-06-17 2013-06-17 Device and Method for Alignment of substrates SG2014014054A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/062473 WO2014202106A1 (de) 2013-06-17 2013-06-17 Vorrichtung und verfahren zum ausrichten von substraten

Publications (1)

Publication Number Publication Date
SG2014014054A true SG2014014054A (en) 2014-10-30

Family

ID=48699743

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2014014054A SG2014014054A (en) 2013-06-17 2013-06-17 Device and Method for Alignment of substrates

Country Status (8)

Country Link
US (1) US9418882B2 (zh)
EP (1) EP3011589B9 (zh)
JP (1) JP6258479B2 (zh)
KR (1) KR101708143B1 (zh)
CN (1) CN105283950B (zh)
SG (1) SG2014014054A (zh)
TW (1) TWI618181B (zh)
WO (1) WO2014202106A1 (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5743958B2 (ja) * 2012-05-30 2015-07-01 キヤノン株式会社 計測方法、露光方法および装置
EP3312871B1 (de) 2014-02-03 2024-09-25 EV Group E. Thallner GmbH Aufnahmeeinrichtung zur aufnahme eines substratstapels
CN111326405B (zh) 2014-04-01 2024-08-23 Ev集团E·索尔纳有限责任公司 用于衬底表面处理的方法及装置
SG11201603148VA (en) 2014-12-18 2016-07-28 Ev Group E Thallner Gmbh Method for bonding substrates
CN106158715B (zh) * 2015-04-24 2021-04-02 上海微电子装备（集团）股份有限公司 用于晶圆的预对准装置及方法
DE102015108901A1 (de) 2015-06-05 2016-12-08 Ev Group E. Thallner Gmbh Verfahren zum Ausrichten von Substraten vor dem Bonden
JP6596353B2 (ja) * 2016-02-17 2019-10-23 東京応化工業株式会社 貼付装置、貼付システム、及び貼付方法
CN118099069A (zh) 2016-03-22 2024-05-28 Ev 集团 E·索尔纳有限责任公司 用于衬底的接合的装置和方法
CN109496345B (zh) 2016-08-12 2023-07-18 Ev 集团 E·索尔纳有限责任公司 用于经控制地接合衬底的方法和样本支架
EP3504733B1 (de) 2016-08-29 2020-09-23 EV Group E. Thallner GmbH Verfahren und vorrichtung zum ausrichten von substraten
KR102904959B1 (ko) 2017-03-02 2025-12-31 에베 그룹 에. 탈너 게엠베하 칩들을 본딩하기 위한 방법 및 디바이스
CN110383446B (zh) * 2017-03-16 2024-07-16 Ev集团E·索尔纳有限责任公司 用于接合至少三个衬底的方法
DE102017105697B4 (de) 2017-03-16 2025-12-31 Ev Group E. Thallner Gmbh Verfahren und System zur Ausrichtung zweier gegenüberliegend angeordneter optischer Teilsysteme und Kamerachip
KR102365283B1 (ko) * 2017-03-20 2022-02-18 에베 그룹 에. 탈너 게엠베하 두 기판의 정렬 방법
MA48439B1 (fr) * 2017-04-25 2021-08-31 Komax Holding Ag Procédé d'alignement d'une sertisseuse d'un premier outil d'une presse de sertissage par rapport à une enclume d'un second outil de la presse de sertissage et dispositif de presse de sertissage
JP7123123B2 (ja) 2017-09-21 2022-08-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板を接合する装置および方法
US11680792B2 (en) 2018-02-27 2023-06-20 Ev Group E. Thallner Gmbh Incoming runout measurement method
KR20200021138A (ko) 2018-08-20 2020-02-28 주식회사 피엘아이 웨이퍼의 접합을 위한 웨이퍼 지그 및 이를 포함하는 웨이퍼 접합 장치
US12510834B2 (en) 2019-08-23 2025-12-30 Ev Group E. Thallner Gmbh Method and device for the alignment of substrates
WO2021115574A1 (de) 2019-12-10 2021-06-17 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zur ausrichtung von substraten
CN114730743B (zh) 2019-12-19 2025-09-09 Ev集团E·索尔纳有限责任公司 经切割的封装组件及其制造方法
JP7391733B2 (ja) * 2020-03-17 2023-12-05 キオクシア株式会社 半導体製造装置及び半導体装置の製造方法
CN115552590B (zh) 2020-06-29 2025-12-05 Ev集团E·索尔纳有限责任公司 用于键合基底的方法和装置
TWI792785B (zh) * 2020-12-31 2023-02-11 南韓商Ｔｅｓ股份有限公司 基板接合裝置及基板接合方法
KR102677190B1 (ko) * 2020-12-31 2024-06-20 주식회사 테스 기판접합장치 및 기판접합방법
CN118451540A (zh) * 2021-12-17 2024-08-06 Ev 集团 E·索尔纳有限责任公司 用于调整检测构件的设备和方法
US20250046639A1 (en) * 2021-12-17 2025-02-06 Ev Group E. Thallner Gmbh Method and device for the alignment of a substrate
JP2025528292A (ja) 2022-09-02 2025-08-27 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 最適化された真空シールを有する真空基板ホルダ
WO2025061255A1 (de) 2023-09-18 2025-03-27 Erich Thallner Substratstapel, modifiziertes schichtsystem, verfahren zum handhaben des substratstapels und vorrichtung für ein solches verfahren

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314107A (en) * 1992-12-31 1994-05-24 Motorola, Inc. Automated method for joining wafers
AT405775B (de) 1998-01-13 1999-11-25 Thallner Erich Verfahren und vorrichtung zum ausgerichteten zusammenführen von scheibenförmigen halbleitersubstraten
JP4681241B2 (ja) * 2004-02-16 2011-05-11 ボンドテック株式会社 アライメント方法、この方法を用いた接合方法、接合装置
US7433038B2 (en) * 2006-04-27 2008-10-07 Asml Netherlands B.V. Alignment of substrates for bonding
JP5117109B2 (ja) * 2006-08-17 2013-01-09 株式会社アルバック 貼り合せ基板の製造方法、及び貼り合せ基板製造装置
TWI478271B (zh) * 2007-08-10 2015-03-21 尼康股份有限公司 Substrate bonding device and substrate bonding method
JP2009231671A (ja) * 2008-03-25 2009-10-08 Nikon Corp アラインメント装置
US8139219B2 (en) * 2008-04-02 2012-03-20 Suss Microtec Lithography, Gmbh Apparatus and method for semiconductor wafer alignment
WO2010038454A1 (ja) * 2008-10-01 2010-04-08 株式会社ニコン アラインメント装置およびアラインメント方法
JP5531508B2 (ja) * 2009-08-26 2014-06-25 株式会社ニコン 基板重ね合わせ装置、基板重ね合わせ方法、及びデバイスの製造方法
EP3731258A1 (de) * 2009-09-22 2020-10-28 EV Group E. Thallner GmbH Vorrichtung zum ausrichten zweier substrate
JP5593748B2 (ja) * 2010-03-11 2014-09-24 株式会社ニコン 位置合わせ装置、基板貼り合わせ装置および基板貼り合わせ方法
JP5454310B2 (ja) * 2010-04-01 2014-03-26 株式会社ニコン 基板貼り合わせ装置および基板貼り合わせ方法
EP2463892B1 (de) * 2010-12-13 2013-04-03 EV Group E. Thallner GmbH Einrichtung, Vorrichtung und Verfahren zur Ermittlung von Ausrichtungsfehlern
JP5752639B2 (ja) * 2012-05-28 2015-07-22 東京エレクトロン株式会社 接合システム、接合方法、プログラム及びコンピュータ記憶媒体
US10014202B2 (en) * 2012-06-12 2018-07-03 Erich Thallner Device and method for aligning substrates
US9666470B2 (en) 2013-03-27 2017-05-30 Ev Group E. Thallner Gmbh Receptacle device, device and method for handling substrate stacks

Also Published As

Publication number Publication date
EP3011589B9 (de) 2018-09-05
CN105283950A (zh) 2016-01-27
CN105283950B (zh) 2018-03-13
TW201513259A (zh) 2015-04-01
JP2016529691A (ja) 2016-09-23
KR101708143B1 (ko) 2017-02-17
US9418882B2 (en) 2016-08-16
KR20160019453A (ko) 2016-02-19
EP3011589B1 (de) 2017-07-26
WO2014202106A1 (de) 2014-12-24
EP3011589A1 (de) 2016-04-27
TWI618181B (zh) 2018-03-11
US20160148826A1 (en) 2016-05-26
JP6258479B2 (ja) 2018-01-10

Similar Documents

Publication Publication Date Title
SG2014014054A (en) Device and Method for Alignment of substrates
SG11201406979VA (en) Device and method for aligning substrates
PL2860516T3 (pl) Urządzenie i sposób do sprawdzenia budowy podłoży mocowanych przylepnie
SG11201602220TA (en) Substrate treatment method and substrate treatment device
EP3089466A4 (en) METHOD AND DEVICE FOR INTERACTING ON THE SAME SCREEN
SG11201504442YA (en) Semiconductor device and method of making semiconductor device
GB201302787D0 (en) Method and apparatus
TWI563558B (en) Substrate treatment apparatus and substrate treatment method
SG11201600306XA (en) Method of in-line testing devices and testing apparatus
GB201306083D0 (en) Method and apparatus
GB201306963D0 (en) Peripheral apparatus and method of cpnstruction
SG11201602316PA (en) Apparatus and method for bonding substrates
GB201309915D0 (en) Stall-start method and apparatus
GB201306495D0 (en) Apparatus and method
GB2534100B (en) Electronic apparatus and method for executing application thereof
GB201213805D0 (en) Alignment device and method of alignment using an alignment device
GB201309689D0 (en) Method and apparatus
SG2014012942A (en) Device and method for aligning substrates
SG11201508944UA (en) Coating device and coating method
TWI560027B (en) Method and apparatus of symmetrically chamfering substrate
TWI562198B (en) Forming method and substrate
PL2986429T3 (pl) Urządzenie do powlekania profili i sposób powlekania profili
GB201305942D0 (en) Apparatus and method
EP3065446A4 (en) DRIVE MINIMIZATION TEST METHOD AND DEVICE
GB201308460D0 (en) Apparatus and method