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SG2014010623A - Package-on-package using through-hole via die on saw streets - Google Patents

Package-on-package using through-hole via die on saw streets

Info

Publication number
SG2014010623A
SG2014010623A SG2014010623A SG2014010623A SG2014010623A SG 2014010623 A SG2014010623 A SG 2014010623A SG 2014010623 A SG2014010623 A SG 2014010623A SG 2014010623 A SG2014010623 A SG 2014010623A SG 2014010623 A SG2014010623 A SG 2014010623A
Authority
SG
Singapore
Prior art keywords
package
hole via
saw streets
via die
die
Prior art date
Application number
SG2014010623A
Inventor
Byung Tai Do
Heap Hoe Kuan
Seng Guan Chow
Original Assignee
Stats Chippac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/744,657 external-priority patent/US7569421B2/en
Priority claimed from US11/768,844 external-priority patent/US7723159B2/en
Application filed by Stats Chippac Ltd filed Critical Stats Chippac Ltd
Publication of SG2014010623A publication Critical patent/SG2014010623A/en

Links

Classifications

    • H10W72/07251—
    • H10W72/20—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
SG2014010623A 2007-05-04 2008-05-02 Package-on-package using through-hole via die on saw streets SG2014010623A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/744,657 US7569421B2 (en) 2007-05-04 2007-05-04 Through-hole via on saw streets
US11/768,844 US7723159B2 (en) 2007-05-04 2007-06-26 Package-on-package using through-hole via die on saw streets

Publications (1)

Publication Number Publication Date
SG2014010623A true SG2014010623A (en) 2014-04-28

Family

ID=44824180

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2014010623A SG2014010623A (en) 2007-05-04 2008-05-02 Package-on-package using through-hole via die on saw streets

Country Status (2)

Country Link
SG (1) SG2014010623A (en)
TW (1) TWI425610B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8093151B2 (en) 2009-03-13 2012-01-10 Stats Chippac, Ltd. Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100493063B1 (en) * 2003-07-18 2005-06-02 삼성전자주식회사 BGA package with stacked semiconductor chips and manufacturing method thereof

Also Published As

Publication number Publication date
TWI425610B (en) 2014-02-01
TW200849547A (en) 2008-12-16

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