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SG184703A1 - Method of compression molding for electronic part and apparatus therefor - Google Patents

Method of compression molding for electronic part and apparatus therefor Download PDF

Info

Publication number
SG184703A1
SG184703A1 SG2012062972A SG2012062972A SG184703A1 SG 184703 A1 SG184703 A1 SG 184703A1 SG 2012062972 A SG2012062972 A SG 2012062972A SG 2012062972 A SG2012062972 A SG 2012062972A SG 184703 A1 SG184703 A1 SG 184703A1
Authority
SG
Singapore
Prior art keywords
resin
release film
cavity
mold release
plate
Prior art date
Application number
SG2012062972A
Other languages
English (en)
Inventor
Tsuyoshi Amakawa
Shinji Takase
Yohei Onishi
Hiroshi Uragami
Naoki Takada
Osamu Otsuki
Mamoru Oda
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007063336A external-priority patent/JP4855307B2/ja
Priority claimed from JP2007097346A external-priority patent/JP2008254266A/ja
Priority claimed from JP2007122957A external-priority patent/JP4855329B2/ja
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG184703A1 publication Critical patent/SG184703A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003Discharging moulded articles from the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C43/183Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/58Measuring, controlling or regulating
    • H10W74/016
    • H10W74/017
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • B29C2043/3405Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3427Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C43/183Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould
    • B29C43/184Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould shaped by the compression of the material during moulding
    • H10W72/0198
    • H10W74/00
    • H10W90/754

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG2012062972A 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor SG184703A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007063336A JP4855307B2 (ja) 2007-03-13 2007-03-13 電子部品の圧縮成形方法
JP2007097346A JP2008254266A (ja) 2007-04-03 2007-04-03 電子部品の圧縮成形方法及び装置
JP2007122957A JP4855329B2 (ja) 2007-05-08 2007-05-08 電子部品の圧縮成形方法及び装置

Publications (1)

Publication Number Publication Date
SG184703A1 true SG184703A1 (en) 2012-10-30

Family

ID=39863685

Family Applications (2)

Application Number Title Priority Date Filing Date
SG201002433-9A SG161252A1 (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor
SG2012062972A SG184703A1 (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG201002433-9A SG161252A1 (en) 2007-03-13 2008-03-06 Method of compression molding for electronic part and apparatus therefor

Country Status (5)

Country Link
KR (3) KR101107843B1 (zh)
MY (3) MY154681A (zh)
SG (2) SG161252A1 (zh)
TW (1) TW200843930A (zh)
WO (1) WO2008126527A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010162710A (ja) * 2009-01-13 2010-07-29 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP5576197B2 (ja) * 2010-07-08 2014-08-20 Towa株式会社 電子部品の圧縮成形方法及び成形装置
JP5627619B2 (ja) * 2012-02-28 2014-11-19 Towa株式会社 樹脂封止装置及び樹脂封止体の製造方法
JP6039198B2 (ja) * 2012-03-07 2016-12-07 Towa株式会社 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置
JP6310773B2 (ja) * 2014-05-22 2018-04-11 Towa株式会社 樹脂成形装置及び樹脂成形方法
JP6525580B2 (ja) * 2014-12-24 2019-06-05 Towa株式会社 樹脂成形装置及び樹脂成形方法
JP6672103B2 (ja) * 2016-08-01 2020-03-25 Towa株式会社 樹脂成形装置及び樹脂成形品製造方法
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
TWI744572B (zh) 2018-11-28 2021-11-01 蔡憲聰 具有封裝內隔室屏蔽的半導體封裝及其製作方法
US10896880B2 (en) 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
JP7240300B2 (ja) * 2019-10-25 2023-03-15 Towa株式会社 粉粒体供給装置、樹脂成形装置、及び樹脂成形品の製造方法
JP7428384B2 (ja) * 2020-10-06 2024-02-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7644494B2 (ja) * 2021-09-28 2025-03-12 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2025040784A (ja) * 2023-09-12 2025-03-25 Towa株式会社 樹脂成形装置及び樹脂成形品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3900947B2 (ja) * 2002-01-30 2007-04-04 大日本インキ化学工業株式会社 燃料電池用セパレータの製造方法、燃料電池セパレータおよび燃料電池
JP4262468B2 (ja) * 2002-10-30 2009-05-13 アピックヤマダ株式会社 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具
JP4052939B2 (ja) * 2002-12-17 2008-02-27 Towa株式会社 電子部品の樹脂封止成形方法及び装置
JP4336499B2 (ja) * 2003-01-09 2009-09-30 Towa株式会社 電子部品の樹脂封止成形方法及び装置
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Towa株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP4469755B2 (ja) * 2005-05-23 2010-05-26 株式会社松井製作所 圧縮成形加工における粉粒体材料の充填装置

Also Published As

Publication number Publication date
WO2008126527A1 (ja) 2008-10-23
MY182099A (en) 2021-01-18
MY154681A (en) 2015-07-15
TW200843930A (en) 2008-11-16
KR101162460B1 (ko) 2012-07-04
SG161252A1 (en) 2010-05-27
TWI355325B (zh) 2012-01-01
KR20090097910A (ko) 2009-09-16
KR20110081309A (ko) 2011-07-13
KR101245393B1 (ko) 2013-03-19
KR101107843B1 (ko) 2012-02-09
KR20120048047A (ko) 2012-05-14
MY182097A (en) 2021-01-18

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