SG165221A1 - Substrate treating apparatus and method - Google Patents
Substrate treating apparatus and methodInfo
- Publication number
- SG165221A1 SG165221A1 SG200906904-8A SG2009069048A SG165221A1 SG 165221 A1 SG165221 A1 SG 165221A1 SG 2009069048 A SG2009069048 A SG 2009069048A SG 165221 A1 SG165221 A1 SG 165221A1
- Authority
- SG
- Singapore
- Prior art keywords
- pressure
- substrate
- vacuum
- treating apparatus
- maintained
- Prior art date
Links
Classifications
-
- H10P72/78—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Provided are a substrate treating apparatus and method, which vacuum-absorb a substrate. An inner space of a housing is maintained at a second pressure by a pipe maintained at a first pressure. The interior of a vacuum hole of a vacuum chuck is maintained at a third pressure. A substrate is vacuum-absorbed by a difference between the third pressure and the second pressure. A gas is supplied into a first line connected to the vacuum hole, or the first line communicates with the inner space of the housing to maintain the difference between the third pressure and the second pressure within a previously set range, thereby to unload the substrate. Therefore, the absorption between the substrate and the vacuum chuck can be increased, and also, a process speed can be improved. Fig.1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090027371A KR101057118B1 (en) | 2009-03-31 | 2009-03-31 | Substrate Processing Apparatus and Method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG165221A1 true SG165221A1 (en) | 2010-10-28 |
Family
ID=43130190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200906904-8A SG165221A1 (en) | 2009-03-31 | 2009-10-14 | Substrate treating apparatus and method |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101057118B1 (en) |
| SG (1) | SG165221A1 (en) |
| TW (1) | TWI395288B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102232691B1 (en) * | 2013-06-26 | 2021-03-29 | 삼성디스플레이 주식회사 | Substrate processing apparatus, deposition apparatus comprising the same, processing method of substrate, and deposition method |
| KR102308929B1 (en) | 2016-04-08 | 2021-10-05 | 어플라이드 머티어리얼스, 인코포레이티드 | vacuum chuck pressure control system |
| KR102004421B1 (en) * | 2017-06-13 | 2019-07-29 | 삼성디스플레이 주식회사 | Apparatus for processing substrate |
| KR102454462B1 (en) * | 2017-11-09 | 2022-10-14 | 주식회사 미코세라믹스 | Chuck plate, chuck structure having the chuck plate, and bonding apparatus having the chuck structure |
| KR102041044B1 (en) * | 2018-04-30 | 2019-11-05 | 피에스케이홀딩스 주식회사 | Unit for Supporting Substrate |
| KR102099105B1 (en) | 2018-07-18 | 2020-05-15 | 세메스 주식회사 | Method for treating a substrate and an apparatus for treating a substrate |
| CN113437000B (en) * | 2021-05-26 | 2023-11-21 | 鄂尔多斯市骁龙半导体有限公司 | A wafer carrying tray with high safety performance |
| KR102654902B1 (en) * | 2021-10-27 | 2024-04-29 | 피에스케이 주식회사 | Support unit, and apparatus for treating substrate with the same |
| CN115763352A (en) * | 2022-11-11 | 2023-03-07 | 拓荆科技股份有限公司 | Semiconductor device and semiconductor processing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6896929B2 (en) * | 2001-08-03 | 2005-05-24 | Applied Materials, Inc. | Susceptor shaft vacuum pumping |
| US20070076345A1 (en) * | 2005-09-20 | 2007-04-05 | Bang Won B | Substrate placement determination using substrate backside pressure measurement |
-
2009
- 2009-03-31 KR KR1020090027371A patent/KR101057118B1/en active Active
- 2009-10-14 SG SG200906904-8A patent/SG165221A1/en unknown
- 2009-10-26 TW TW098136182A patent/TWI395288B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201036099A (en) | 2010-10-01 |
| KR20100109009A (en) | 2010-10-08 |
| KR101057118B1 (en) | 2011-08-16 |
| TWI395288B (en) | 2013-05-01 |
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