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SG158903A1 - Method for forming a double embossing structure - Google Patents

Method for forming a double embossing structure

Info

Publication number
SG158903A1
SG158903A1 SG201000390-3A SG2010003903A SG158903A1 SG 158903 A1 SG158903 A1 SG 158903A1 SG 2010003903 A SG2010003903 A SG 2010003903A SG 158903 A1 SG158903 A1 SG 158903A1
Authority
SG
Singapore
Prior art keywords
metal layer
pattern
forming
layer
defining
Prior art date
Application number
SG201000390-3A
Inventor
Mou-Shiung Lin
Hsin-Jung Lo
Chiu-Ming Chou
Chien-Kang Chou
Original Assignee
Megica Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/491,117 external-priority patent/US7960269B2/en
Application filed by Megica Corp filed Critical Megica Corp
Publication of SG158903A1 publication Critical patent/SG158903A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for fabricating a circuitry component comprises depositing a first metal layer over a substrate; forming a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposing said first metal layer; depositing a second metal layer over said first metal layer exposed by said first opening; removing said first pattern-defining layer; forming a second pattern-defining layer over said second metal layer, a second opening in said second pattern-defining layer exposing said second metal layer; depositing a third metal layer over said second metal layer exposed by said second opening; removing said second pattern-defining layer; removing said first metal layer not under said second metal layer, and forming a polymer layer over said second metal layer, wherein said third metal layer is used as a metal bump bonded to an external circuitry. Figure no. 13 is suggested for publication.
SG201000390-3A 2006-07-24 2007-03-28 Method for forming a double embossing structure SG158903A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/491,117 US7960269B2 (en) 2005-07-22 2006-07-24 Method for forming a double embossing structure

Publications (1)

Publication Number Publication Date
SG158903A1 true SG158903A1 (en) 2010-02-26

Family

ID=39110998

Family Applications (2)

Application Number Title Priority Date Filing Date
SG201000390-3A SG158903A1 (en) 2006-07-24 2007-03-28 Method for forming a double embossing structure
SG200702344-3A SG139614A1 (en) 2006-07-24 2007-03-28 Method for forming a double embossing structure

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG200702344-3A SG139614A1 (en) 2006-07-24 2007-03-28 Method for forming a double embossing structure

Country Status (1)

Country Link
SG (2) SG158903A1 (en)

Also Published As

Publication number Publication date
SG139614A1 (en) 2008-02-29

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