[go: up one dir, main page]

SG157977A1 - System and method for inspection of semiconductor packages - Google Patents

System and method for inspection of semiconductor packages

Info

Publication number
SG157977A1
SG157977A1 SG200804752-4A SG2008047524A SG157977A1 SG 157977 A1 SG157977 A1 SG 157977A1 SG 2008047524 A SG2008047524 A SG 2008047524A SG 157977 A1 SG157977 A1 SG 157977A1
Authority
SG
Singapore
Prior art keywords
camera
semiconductor package
inspection
prism assembly
semiconductor packages
Prior art date
Application number
SG200804752-4A
Inventor
Ajharali Amanullah
Han Cheng Ge
Heng Lee Kwang
Albert Archwamety
Original Assignee
Semiconductor Tech & Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Tech & Instr Inc filed Critical Semiconductor Tech & Instr Inc
Priority to SG200804752-4A priority Critical patent/SG157977A1/en
Priority to CH00963/09A priority patent/CH699122B1/en
Priority to MYPI20092564A priority patent/MY148191A/en
Priority to TW098120780A priority patent/TWI499771B/en
Priority to CN200910205728.7A priority patent/CN101672802B/en
Priority to KR1020090055915A priority patent/KR101698006B1/en
Publication of SG157977A1 publication Critical patent/SG157977A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H10P74/00—

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

A system and method for inspection of semiconductor packages. The system comprises a lighting assembly, a prism assembly, a first camera and a second camera. The prism assembly comprises a number of surfaces. Light reflected off the semiconductor package positioned at a ready position enters the prism assembly before exiting therefrom and entering into one of the first camera and the second camera. The first camera and the second camera have different magnifications. The first camera captures an image of a bottom surface and each of four side surfaces of the semiconductor package. The second camera captures an image of only the bottom surface of the semiconductor package. Light supplied by the lighting assembly is of a predetermined set of properties, which are variable to enhance specific defect detection. Images captured by the first camera and the second camera are transferred to a controller for analysis thereby.
SG200804752-4A 2008-06-23 2008-06-23 System and method for inspection of semiconductor packages SG157977A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SG200804752-4A SG157977A1 (en) 2008-06-23 2008-06-23 System and method for inspection of semiconductor packages
CH00963/09A CH699122B1 (en) 2008-06-23 2009-06-19 System and method for inspection of semiconductor components.
MYPI20092564A MY148191A (en) 2008-06-23 2009-06-19 System and method for inspection of semiconductor packages
TW098120780A TWI499771B (en) 2008-06-23 2009-06-22 System and Method for Semiconductor Packaging Detection
CN200910205728.7A CN101672802B (en) 2008-06-23 2009-06-23 System and method for inspection of semiconductor packages
KR1020090055915A KR101698006B1 (en) 2008-06-23 2009-06-23 System and method for inspection of semiconductor packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200804752-4A SG157977A1 (en) 2008-06-23 2008-06-23 System and method for inspection of semiconductor packages

Publications (1)

Publication Number Publication Date
SG157977A1 true SG157977A1 (en) 2010-01-29

Family

ID=41509581

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200804752-4A SG157977A1 (en) 2008-06-23 2008-06-23 System and method for inspection of semiconductor packages

Country Status (6)

Country Link
KR (1) KR101698006B1 (en)
CN (1) CN101672802B (en)
CH (1) CH699122B1 (en)
MY (1) MY148191A (en)
SG (1) SG157977A1 (en)
TW (1) TWI499771B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102192909A (en) * 2010-03-12 2011-09-21 深圳市先阳软件技术有限公司 System for detecting laser cutting quality of battery pole piece
JP6491425B2 (en) * 2014-05-21 2019-03-27 Ｔｏｗａ株式会社 Electronic parts package side view photographing device
KR20180010492A (en) * 2016-07-21 2018-01-31 (주)제이티 Vision inspection module and device handler having the same
CN107677678A (en) * 2017-09-20 2018-02-09 广州视源电子科技股份有限公司 appearance detection method and device based on automatic path planning
CN107688029A (en) * 2017-09-20 2018-02-13 广州视源电子科技股份有限公司 Appearance detection method and device
CN109100366A (en) * 2018-08-10 2018-12-28 武汉盛为芯科技有限公司 The detection system and method for semiconductor laser chip end face appearance
CN110806410A (en) * 2019-12-09 2020-02-18 泉州师范学院 Optical device and method for simultaneous detection of top surface and side surface of semiconductor die
KR102350544B1 (en) * 2020-10-14 2022-01-17 주식회사 지엠지 Optical module for semiconductor packaging inspection process
CN119422052A (en) * 2022-12-12 2025-02-11 株式会社Lg新能源 Battery inspection device
CN117838006A (en) * 2023-06-14 2024-04-09 杭州微新医疗科技有限公司 Inspection device
CN119138818A (en) * 2023-06-14 2024-12-17 杭州微新医疗科技有限公司 Inspection device and endoscopic equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1273224A (en) * 1985-03-14 1990-08-28 Timothy R. Pryor Panel surface flaw inspection
DE3712513A1 (en) * 1987-04-13 1988-11-03 Roth Electric Gmbh METHOD AND DEVICE FOR DETECTING SURFACE DEFECTS
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
US6567161B1 (en) * 2000-11-28 2003-05-20 Asti Holdings Limited Three dimensional lead inspection system
DE10122917A1 (en) 2001-05-11 2002-11-14 Byk Gardner Gmbh Device and method for determining the properties of reflective bodies
US20030086083A1 (en) * 2001-11-01 2003-05-08 Martin Ebert Optical metrology tool with dual camera path for simultaneous high and low magnification imaging
JP3789097B2 (en) 2002-02-21 2006-06-21 光洋機械工業株式会社 Peripheral inspection method and peripheral inspection apparatus for inspection object
US6809808B2 (en) * 2002-03-22 2004-10-26 Applied Materials, Inc. Wafer defect detection system with traveling lens multi-beam scanner
US7315364B2 (en) * 2004-10-25 2008-01-01 Applied Materials, Israel, Ltd. System for inspecting a surface employing configurable multi angle illumination modes

Also Published As

Publication number Publication date
CN101672802B (en) 2014-07-16
CN101672802A (en) 2010-03-17
CH699122A2 (en) 2010-01-15
MY148191A (en) 2013-03-15
KR101698006B1 (en) 2017-02-01
TW201005285A (en) 2010-02-01
CH699122B1 (en) 2015-05-15
TWI499771B (en) 2015-09-11
KR20090133097A (en) 2009-12-31

Similar Documents

Publication Publication Date Title
SG157977A1 (en) System and method for inspection of semiconductor packages
WO2010082900A3 (en) System and method for inspecting a wafer
MY187200A (en) System and method for inspection of wet ophthalmic lens
MY167163A (en) System and method for capturing illumination reflected in multiple directions
WO2015076753A8 (en) Apparatus and method for selectively inspecting component sidewalls
WO2012091494A3 (en) Substrate inspection method
PH12013000288A1 (en) System and method for inspecting a wafer
EP2579100A3 (en) Inspection apparatus, lithographic apparatus, and device manufacturing method
WO2009107981A3 (en) Apparatus and method for measuring a three-dimensional shape
WO2012096847A3 (en) Apparatus for euv imaging and methods of using same
WO2008105460A1 (en) Observation device, inspection device and inspection method
WO2010027772A3 (en) System and method for detecting a camera
WO2013048093A3 (en) Contactless component-inspecting apparatus and component-inspecting method
TW200736599A (en) Defect inspection device for inspecting defect by image analysis
WO2009090633A3 (en) Inspection of a substrate using multiple cameras
WO2017206966A1 (en) Automatic optical inspection device and method
WO2008139735A1 (en) Surface tester and surface testing method
WO2012091344A3 (en) Visual inspection apparatus
WO2011087337A3 (en) Substrate-inspecting device
MY165130A (en) Surface defect inspecting device and method for hot-dip coated steel sheets
WO2009054404A1 (en) Inspection method based on captured image and inspection device
EP2354782A3 (en) Defect detection apparatus and defect detection method
EP2381245A3 (en) Image inspection device and image forming apparatus
JP2014109530A (en) Defect inspection device and defect inspection method
WO2011083989A3 (en) Defect inspection device