SG144903A1 - Electrical test device for testing electrical test pieces - Google Patents
Electrical test device for testing electrical test piecesInfo
- Publication number
- SG144903A1 SG144903A1 SG200801056-3A SG2008010563A SG144903A1 SG 144903 A1 SG144903 A1 SG 144903A1 SG 2008010563 A SG2008010563 A SG 2008010563A SG 144903 A1 SG144903 A1 SG 144903A1
- Authority
- SG
- Singapore
- Prior art keywords
- electrical test
- electrical
- testing
- test device
- test pieces
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007007741 | 2007-02-08 | ||
| DE102008004800A DE102008004800A1 (de) | 2007-02-08 | 2008-01-17 | Elektrische Prüfeinrichtung zur Prüfung von elektrischen Prüflingen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG144903A1 true SG144903A1 (en) | 2008-08-28 |
Family
ID=39597747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200801056-3A SG144903A1 (en) | 2007-02-08 | 2008-02-06 | Electrical test device for testing electrical test pieces |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20080191721A1 (zh) |
| JP (1) | JP2008209408A (zh) |
| CN (1) | CN101241159A (zh) |
| DE (1) | DE102008004800A1 (zh) |
| SG (1) | SG144903A1 (zh) |
| TW (1) | TW200908185A (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012016449A1 (de) * | 2012-08-16 | 2014-03-13 | Feinmetall Gmbh | Prüfkopf für die elektrische Prüfung eines Prüflings |
| DE102013203536B4 (de) * | 2013-03-01 | 2016-03-31 | Multitest Elektronische Systeme Gmbh | Vorrichtung zum Prüfen von elektronischen Bauteilen |
| CN112556621A (zh) * | 2020-11-06 | 2021-03-26 | 浙江马尔风机有限公司 | 电机转子轴的检测装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4901013A (en) * | 1988-08-19 | 1990-02-13 | American Telephone And Telegraph Company, At&T Bell Laboratories | Apparatus having a buckling beam probe assembly |
| JPH10132855A (ja) * | 1996-10-31 | 1998-05-22 | Nec Corp | Ic検査用プローブカード |
| JP2000227443A (ja) * | 1999-02-05 | 2000-08-15 | Mitsubishi Electric Corp | プローブカード |
| US20020118029A1 (en) * | 1999-05-14 | 2002-08-29 | Rikihito Yamasaka | Probe card and contactor |
| US7349223B2 (en) * | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
| JP2003107105A (ja) * | 2001-09-27 | 2003-04-09 | Mitsubishi Electric Corp | プローブカード |
| US6911835B2 (en) * | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
| US7102367B2 (en) * | 2002-07-23 | 2006-09-05 | Fujitsu Limited | Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof |
| US6897666B2 (en) * | 2002-12-31 | 2005-05-24 | Intel Corporation | Embedded voltage regulator and active transient control device in probe head for improved power delivery and method |
| DE102004023987B4 (de) * | 2004-05-14 | 2008-06-19 | Feinmetall Gmbh | Elektrische Prüfeinrichtung |
-
2008
- 2008-01-17 DE DE102008004800A patent/DE102008004800A1/de not_active Withdrawn
- 2008-02-04 TW TW097104353A patent/TW200908185A/zh unknown
- 2008-02-06 SG SG200801056-3A patent/SG144903A1/en unknown
- 2008-02-07 JP JP2008027837A patent/JP2008209408A/ja active Pending
- 2008-02-07 US US12/069,053 patent/US20080191721A1/en not_active Abandoned
- 2008-02-13 CN CNA2008100743954A patent/CN101241159A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008209408A (ja) | 2008-09-11 |
| CN101241159A (zh) | 2008-08-13 |
| US20080191721A1 (en) | 2008-08-14 |
| DE102008004800A1 (de) | 2008-08-14 |
| TW200908185A (en) | 2009-02-16 |
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