[go: up one dir, main page]

SG144903A1 - Electrical test device for testing electrical test pieces - Google Patents

Electrical test device for testing electrical test pieces

Info

Publication number
SG144903A1
SG144903A1 SG200801056-3A SG2008010563A SG144903A1 SG 144903 A1 SG144903 A1 SG 144903A1 SG 2008010563 A SG2008010563 A SG 2008010563A SG 144903 A1 SG144903 A1 SG 144903A1
Authority
SG
Singapore
Prior art keywords
electrical test
electrical
testing
test device
test pieces
Prior art date
Application number
SG200801056-3A
Other languages
English (en)
Inventor
Gunther Boehm
Peter Stolp
Georg Steidle
Original Assignee
Feinmetall Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Feinmetall Gmbh filed Critical Feinmetall Gmbh
Publication of SG144903A1 publication Critical patent/SG144903A1/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG200801056-3A 2007-02-08 2008-02-06 Electrical test device for testing electrical test pieces SG144903A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007007741 2007-02-08
DE102008004800A DE102008004800A1 (de) 2007-02-08 2008-01-17 Elektrische Prüfeinrichtung zur Prüfung von elektrischen Prüflingen

Publications (1)

Publication Number Publication Date
SG144903A1 true SG144903A1 (en) 2008-08-28

Family

ID=39597747

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200801056-3A SG144903A1 (en) 2007-02-08 2008-02-06 Electrical test device for testing electrical test pieces

Country Status (6)

Country Link
US (1) US20080191721A1 (zh)
JP (1) JP2008209408A (zh)
CN (1) CN101241159A (zh)
DE (1) DE102008004800A1 (zh)
SG (1) SG144903A1 (zh)
TW (1) TW200908185A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012016449A1 (de) * 2012-08-16 2014-03-13 Feinmetall Gmbh Prüfkopf für die elektrische Prüfung eines Prüflings
DE102013203536B4 (de) * 2013-03-01 2016-03-31 Multitest Elektronische Systeme Gmbh Vorrichtung zum Prüfen von elektronischen Bauteilen
CN112556621A (zh) * 2020-11-06 2021-03-26 浙江马尔风机有限公司 电机转子轴的检测装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4901013A (en) * 1988-08-19 1990-02-13 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus having a buckling beam probe assembly
JPH10132855A (ja) * 1996-10-31 1998-05-22 Nec Corp Ic検査用プローブカード
JP2000227443A (ja) * 1999-02-05 2000-08-15 Mitsubishi Electric Corp プローブカード
US20020118029A1 (en) * 1999-05-14 2002-08-29 Rikihito Yamasaka Probe card and contactor
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
JP2003107105A (ja) * 2001-09-27 2003-04-09 Mitsubishi Electric Corp プローブカード
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US6897666B2 (en) * 2002-12-31 2005-05-24 Intel Corporation Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
DE102004023987B4 (de) * 2004-05-14 2008-06-19 Feinmetall Gmbh Elektrische Prüfeinrichtung

Also Published As

Publication number Publication date
JP2008209408A (ja) 2008-09-11
CN101241159A (zh) 2008-08-13
US20080191721A1 (en) 2008-08-14
DE102008004800A1 (de) 2008-08-14
TW200908185A (en) 2009-02-16

Similar Documents

Publication Publication Date Title
TW200745568A (en) Probe structures with electronic components
SG135138A1 (en) Electronic device test set and contact used therein
WO2012074969A3 (en) Electrical interconnect ic device socket
WO2011087490A3 (en) Capacitive opens testing in low signal environments
SG137778A1 (en) Contact for use in testing integrated circuits
WO2012173777A3 (en) Probe module with interleaved serpentine test contacts for electronic device testing
WO2010038179A3 (en) An oled device and an electronic circuit
TWD143765S1 (zh) 電卡緣連接器
TW200641377A (en) Apparatus and method for testing component built in circuit board
SG195107A1 (en) An electrical interconnect assembly
WO2009103515A3 (de) Leiterplattenanordnung und elektrisches anschlussmodul
TW200622266A (en) Test probe and tester, method for manufacturing the test probe
ATE551883T1 (de) Elektronisches gerät und verfahren zum untersuchen einer leiterplatte
WO2008101884A3 (de) Verfahren zur kontaktierung elektrischer bauelemente
TW200702665A (en) Socket for inspection apparatus
SG144903A1 (en) Electrical test device for testing electrical test pieces
SG134271A1 (en) Test contact system for testing integrated circuits with packages having an array of signal and power contacts
TW200702667A (en) Test probe and manufacturing method for test probe
WO2014049080A3 (de) Optoelektronische bauelementevorrichtung, verfahren zum herstellen einer optoelektronischen bauelementevorrichtung und verfahren zum betreiben einer optoelektronischen bauelementevorrichtung
TW200942833A (en) Inspection jig
TW200703472A (en) Semiconductor test device
TW200729373A (en) Test module for wafer
TWD143764S1 (zh) 電卡緣連接器
TW200951444A (en) Testing wafer unit and test system
TW200734661A (en) Electronic component device testing apparatus