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SG10202012382RA - Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curing - Google Patents

Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curing

Info

Publication number
SG10202012382RA
SG10202012382RA SG10202012382RA SG10202012382RA SG10202012382RA SG 10202012382R A SG10202012382R A SG 10202012382RA SG 10202012382R A SG10202012382R A SG 10202012382RA SG 10202012382R A SG10202012382R A SG 10202012382RA SG 10202012382R A SG10202012382R A SG 10202012382RA
Authority
SG
Singapore
Prior art keywords
cte
tuning
methods
thermal expansion
microwave curing
Prior art date
Application number
SG10202012382RA
Inventor
Yueh Sheng Ow
Rui Wang
Tuck Foong Koh
Xin Wang
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10202012382RA publication Critical patent/SG10202012382RA/en

Links

Classifications

    • H10W74/016—
    • H10P95/90—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/6447—Method of operation or details of the microwave heating apparatus related to the use of detectors or sensors
    • H05B6/645—Method of operation or details of the microwave heating apparatus related to the use of detectors or sensors using temperature sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/66—Circuits
    • H05B6/68—Circuits for monitoring or control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/705—Feed lines using microwave tuning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications
    • H10P14/683—
    • H10P72/0436—
    • H10P72/0602—
    • H10P95/08—
    • H10W74/01—
    • H10W74/47—

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Formation Of Insulating Films (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Constitution Of High-Frequency Heating (AREA)
SG10202012382RA 2016-06-19 2017-06-06 Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curing SG10202012382RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662352005P 2016-06-19 2016-06-19
US15/451,603 US20170365490A1 (en) 2016-06-19 2017-03-07 Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curing

Publications (1)

Publication Number Publication Date
SG10202012382RA true SG10202012382RA (en) 2021-01-28

Family

ID=60660825

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10202012382RA SG10202012382RA (en) 2016-06-19 2017-06-06 Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curing
SG11201811297YA SG11201811297YA (en) 2016-06-19 2017-06-06 Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curing

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201811297YA SG11201811297YA (en) 2016-06-19 2017-06-06 Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curing

Country Status (6)

Country Link
US (1) US20170365490A1 (en)
KR (1) KR102232794B1 (en)
CN (1) CN109314060B (en)
SG (2) SG10202012382RA (en)
TW (1) TWI751173B (en)
WO (1) WO2017222800A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160086960A1 (en) * 2014-09-22 2016-03-24 Texas Instruments Incorporated Low-Temperature Passivation of Ferroelectric Integrated Circuits for Enhanced Polarization Performance
KR101988809B1 (en) * 2018-11-19 2019-06-12 에스케이씨코오롱피아이 주식회사 Polyamic acid Composition for Packaging Electronic Component and Method for Packaging Electronic Component by Using the Same
US12048948B2 (en) * 2018-12-26 2024-07-30 Applied Materials, Inc. Methods for forming microwave tunable composited thin-film dielectric layer
JP7648593B2 (en) * 2019-07-07 2025-03-18 アプライド マテリアルズ インコーポレイテッド Method and apparatus for microwave processing of polymeric materials - Patents.com
CN115179469B (en) * 2022-07-21 2023-06-23 江苏邑文微电子科技有限公司 Polyimide oven curing process conversion method applied to semiconductor device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5241040A (en) * 1990-07-11 1993-08-31 International Business Machines Corporation Microwave processing
US5798395A (en) * 1994-03-31 1998-08-25 Lambda Technologies Inc. Adhesive bonding using variable frequency microwave energy
US5738915A (en) * 1996-09-19 1998-04-14 Lambda Technologies, Inc. Curing polymer layers on semiconductor substrates using variable frequency microwave energy
US7638727B2 (en) * 2002-05-08 2009-12-29 Btu International Inc. Plasma-assisted heat treatment
US7557035B1 (en) * 2004-04-06 2009-07-07 Advanced Micro Devices, Inc. Method of forming semiconductor devices by microwave curing of low-k dielectric films
DE102007017641A1 (en) * 2007-04-13 2008-10-16 Infineon Technologies Ag Curing of layers on the semiconductor module by means of electromagnetic fields
US8846448B2 (en) * 2012-08-10 2014-09-30 Taiwan Semiconductor Manufacturing Co., Ltd. Warpage control in a package-on-package structure
WO2014039194A1 (en) * 2012-09-07 2014-03-13 Applied Materials, Inc. Integrated processing of porous dielectric, polymer-coated substrates and epoxy within a multi-chamber vacuum system confirmation
US10224258B2 (en) * 2013-03-22 2019-03-05 Applied Materials, Inc. Method of curing thermoplastics with microwave energy
US9414445B2 (en) * 2013-04-26 2016-08-09 Applied Materials, Inc. Method and apparatus for microwave treatment of dielectric films
SG11201600447YA (en) * 2013-08-21 2016-03-30 Applied Materials Inc Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabrications
US9159547B2 (en) * 2013-09-17 2015-10-13 Deca Technologies Inc. Two step method of rapid curing a semiconductor polymer layer
US20160086960A1 (en) * 2014-09-22 2016-03-24 Texas Instruments Incorporated Low-Temperature Passivation of Ferroelectric Integrated Circuits for Enhanced Polarization Performance

Also Published As

Publication number Publication date
US20170365490A1 (en) 2017-12-21
CN109314060A (en) 2019-02-05
KR102232794B1 (en) 2021-03-25
TWI751173B (en) 2022-01-01
KR20190009839A (en) 2019-01-29
WO2017222800A1 (en) 2017-12-28
CN109314060B (en) 2023-08-25
TW201808647A (en) 2018-03-16
SG11201811297YA (en) 2019-01-30

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