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SG10202000757YA - Confirming method - Google Patents

Confirming method

Info

Publication number
SG10202000757YA
SG10202000757YA SG10202000757YA SG10202000757YA SG10202000757YA SG 10202000757Y A SG10202000757Y A SG 10202000757YA SG 10202000757Y A SG10202000757Y A SG 10202000757YA SG 10202000757Y A SG10202000757Y A SG 10202000757YA SG 10202000757Y A SG10202000757Y A SG 10202000757YA
Authority
SG
Singapore
Prior art keywords
confirming method
confirming
Prior art date
Application number
SG10202000757YA
Other languages
English (en)
Inventor
Akutagawa Yukito
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202000757YA publication Critical patent/SG10202000757YA/en

Links

Classifications

    • H10P74/23—
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H10P50/00—
    • H10P72/06—
    • H10P74/203—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
SG10202000757YA 2019-02-13 2020-01-28 Confirming method SG10202000757YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019023349 2019-02-13

Publications (1)

Publication Number Publication Date
SG10202000757YA true SG10202000757YA (en) 2020-09-29

Family

ID=72071391

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202000757YA SG10202000757YA (en) 2019-02-13 2020-01-28 Confirming method

Country Status (6)

Country Link
JP (1) JP7417411B2 (zh)
KR (1) KR102764811B1 (zh)
CN (1) CN111564381B (zh)
MY (1) MY204612A (zh)
SG (1) SG10202000757YA (zh)
TW (1) TWI843804B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230045993A (ko) * 2021-09-29 2023-04-05 삼성전자주식회사 기판 다이싱 방법 및 기판 다이싱 장치
JP7811702B2 (ja) * 2022-03-29 2026-02-06 株式会社東京精密 レーザ光補正方法
JP2024041253A (ja) * 2022-09-14 2024-03-27 株式会社ディスコ ウエーハの加工方法及び加工装置
JP2024051279A (ja) * 2022-09-30 2024-04-11 株式会社ディスコ ウエーハの加工方法及び加工装置
JP2024055023A (ja) * 2022-10-06 2024-04-18 株式会社ディスコ ウエーハの加工方法およびウエーハ処理装置
JP2024067757A (ja) * 2022-11-07 2024-05-17 株式会社ディスコ ウエーハの加工方法
KR20240085168A (ko) * 2022-12-07 2024-06-14 가부시기가이샤 디스코 가공 장치
US20240300174A1 (en) * 2023-03-10 2024-09-12 Align Technology, Inc. Substrates and associated materials for additive manufacturing

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7166528B2 (en) * 2003-10-10 2007-01-23 Applied Materials, Inc. Methods of selective deposition of heavily doped epitaxial SiGe
JP2005332982A (ja) * 2004-05-20 2005-12-02 Renesas Technology Corp 半導体装置の製造方法
JP5133855B2 (ja) * 2008-11-25 2013-01-30 株式会社ディスコ 保護膜の被覆方法
US20110291300A1 (en) * 2009-02-12 2011-12-01 Takashi Hirano Dicing sheet-attached film for forming semiconductor protection film, method for producing semiconductor device using the same, and semiconductor device
JP5436917B2 (ja) * 2009-04-23 2014-03-05 株式会社ディスコ レーザー加工装置
JP4422790B1 (ja) * 2009-09-17 2010-02-24 宇部興産株式会社 フレキシブル金属積層体の製造方法
JP5615107B2 (ja) 2010-09-10 2014-10-29 株式会社ディスコ 分割方法
TWI457191B (zh) * 2011-02-04 2014-10-21 Mitsuboshi Diamond Ind Co Ltd 雷射切割方法及雷射加工裝置
JP6002391B2 (ja) * 2012-01-20 2016-10-05 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
JP6044919B2 (ja) * 2012-02-01 2016-12-14 信越ポリマー株式会社 基板加工方法
JP6232230B2 (ja) * 2013-08-30 2017-11-15 株式会社ディスコ ウェーハの加工方法
JP6210902B2 (ja) * 2014-02-18 2017-10-11 株式会社ディスコ レーザー加工溝の検出方法
JP6433264B2 (ja) * 2014-11-27 2018-12-05 株式会社ディスコ 透過レーザービームの検出方法
JP6472333B2 (ja) * 2015-06-02 2019-02-20 株式会社ディスコ ウエーハの生成方法
JP2017037912A (ja) * 2015-08-07 2017-02-16 株式会社ディスコ 検査用ウエーハおよび検査用ウエーハの使用方法
JP2017166961A (ja) * 2016-03-16 2017-09-21 株式会社ディスコ 被加工物の内部検出装置、および内部検出方法
JP6784527B2 (ja) * 2016-07-12 2020-11-11 株式会社ディスコ 静電チャックテーブル、レーザー加工装置及び被加工物の加工方法
JP6749727B2 (ja) 2016-10-14 2020-09-02 株式会社ディスコ 検査用ウエーハ及び検査用ウエーハの使用方法
US10414685B2 (en) * 2016-11-15 2019-09-17 Via Mechanics, Ltd. Substrate processing method
JP6815894B2 (ja) * 2017-02-27 2021-01-20 株式会社ディスコ 静電チャックテーブルの使用方法
JP7032050B2 (ja) * 2017-03-14 2022-03-08 株式会社ディスコ レーザー加工装置
JP6882045B2 (ja) * 2017-04-13 2021-06-02 株式会社ディスコ 集光点位置検出方法
JP6998128B2 (ja) * 2017-04-25 2022-01-18 株式会社ディスコ サンプルウエーハ及びウエーハの形状確認方法
JP6932437B2 (ja) 2017-06-02 2021-09-08 株式会社ディスコ レーザ加工装置の光軸確認方法
JP6953210B2 (ja) * 2017-07-14 2021-10-27 株式会社ディスコ ウエーハの加工方法

Also Published As

Publication number Publication date
KR20200099075A (ko) 2020-08-21
KR102764811B1 (ko) 2025-02-06
MY204612A (en) 2024-09-05
TWI843804B (zh) 2024-06-01
JP2020136662A (ja) 2020-08-31
CN111564381B (zh) 2025-10-17
CN111564381A (zh) 2020-08-21
TW202030813A (zh) 2020-08-16
JP7417411B2 (ja) 2024-01-18

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