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SG10201500801YA - Electroplating methods for semiconductor substrates - Google Patents

Electroplating methods for semiconductor substrates

Info

Publication number
SG10201500801YA
SG10201500801YA SG10201500801YA SG10201500801YA SG10201500801YA SG 10201500801Y A SG10201500801Y A SG 10201500801YA SG 10201500801Y A SG10201500801Y A SG 10201500801YA SG 10201500801Y A SG10201500801Y A SG 10201500801YA SG 10201500801Y A SG10201500801Y A SG 10201500801YA
Authority
SG
Singapore
Prior art keywords
semiconductor substrates
electroplating methods
electroplating
methods
substrates
Prior art date
Application number
SG10201500801YA
Other languages
English (en)
Inventor
K Lee Sam
Sharbono Charles
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10201500801YA publication Critical patent/SG10201500801YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • H10P14/47—
    • H10P95/04—
    • H10W20/023—
    • H10W20/0261—
    • H10W20/062—
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SG10201500801YA 2014-02-07 2015-02-02 Electroplating methods for semiconductor substrates SG10201500801YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461937370P 2014-02-07 2014-02-07
US14/222,407 US9758893B2 (en) 2014-02-07 2014-03-21 Electroplating methods for semiconductor substrates

Publications (1)

Publication Number Publication Date
SG10201500801YA true SG10201500801YA (en) 2015-09-29

Family

ID=53774447

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201500801YA SG10201500801YA (en) 2014-02-07 2015-02-02 Electroplating methods for semiconductor substrates

Country Status (5)

Country Link
US (1) US9758893B2 (zh)
KR (1) KR102169555B1 (zh)
CN (1) CN104835750B (zh)
SG (1) SG10201500801YA (zh)
TW (1) TWI642815B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105206563A (zh) * 2015-08-20 2015-12-30 华进半导体封装先导技术研发中心有限公司 Tsv电镀工艺
US9922874B2 (en) * 2016-07-01 2018-03-20 Applied Materials, Inc. Methods of enhancing polymer adhesion to copper
US10692735B2 (en) * 2017-07-28 2020-06-23 Lam Research Corporation Electro-oxidative metal removal in through mask interconnect fabrication
KR102789261B1 (ko) * 2017-10-19 2025-04-01 램 리써치 코포레이션 단일 금속의 멀티배스 (multibath) 도금
CN108103566B (zh) * 2017-12-28 2021-02-02 上海冠众光学科技有限公司 一种金属薄膜退镀方法及系统
KR20220124787A (ko) 2020-01-10 2022-09-14 램 리써치 코포레이션 긴 펄싱 및 램핑에 의한 tsv 프로세스 윈도우 및 충진 성능 향상
KR20230024286A (ko) * 2020-05-15 2023-02-20 램 리써치 코포레이션 반도체 프로세싱에서 입자 오염 완화를 수반하는 전기-산화성 금속 제거
CN113423189B (zh) * 2021-06-21 2022-11-25 北京世维通科技股份有限公司 一种金属电极的制备方法
CN113862770B (zh) * 2021-09-28 2023-12-26 北京航空航天大学杭州创新研究院 一种采用退镀工艺制备图案化电极的方法
CN114182338B (zh) * 2021-12-17 2023-05-16 北京星航机电装备有限公司 一种钛合金工件减重方法
US12146235B2 (en) * 2022-03-03 2024-11-19 Applied Materials, Inc. Plating and deplating currents for material co-planarity in semiconductor plating processes
US20240413011A1 (en) * 2023-06-12 2024-12-12 Applied Materials, Inc. Automated dial-in of electroplating process parameters based on wafer results from ex-situ metrology

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999057342A1 (en) 1998-04-30 1999-11-11 Ebara Corporation Method and device for plating substrate
US6878259B2 (en) 1998-10-14 2005-04-12 Faraday Technology Marketing Group, Llc Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
US6524461B2 (en) 1998-10-14 2003-02-25 Faraday Technology Marketing Group, Llc Electrodeposition of metals in small recesses using modulated electric fields
US6224737B1 (en) * 1999-08-19 2001-05-01 Taiwan Semiconductor Manufacturing Company Method for improvement of gap filling capability of electrochemical deposition of copper
US6399479B1 (en) 1999-08-30 2002-06-04 Applied Materials, Inc. Processes to improve electroplating fill
US6309528B1 (en) 1999-10-15 2001-10-30 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
US7582564B2 (en) * 2001-03-14 2009-09-01 Applied Materials, Inc. Process and composition for conductive material removal by electrochemical mechanical polishing
US6863795B2 (en) 2001-03-23 2005-03-08 Interuniversitair Microelektronica Centrum (Imec) Multi-step method for metal deposition
US6750144B2 (en) * 2002-02-15 2004-06-15 Faraday Technology Marketing Group, Llc Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes
US6699380B1 (en) * 2002-10-18 2004-03-02 Applied Materials Inc. Modular electrochemical processing system
US20040094511A1 (en) * 2002-11-20 2004-05-20 International Business Machines Corporation Method of forming planar Cu interconnects without chemical mechanical polishing
US20050224358A1 (en) * 2004-03-30 2005-10-13 Lsi Logic Corporation Method for improved local planarity control during electropolishing
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US7247558B2 (en) * 2004-12-03 2007-07-24 Novellus Systems, Inc. Method and system for electroprocessing conductive layers
US20060226014A1 (en) * 2005-04-11 2006-10-12 Taiwan Semiconductor Manufacturing Co., Ltd. Method and process for improved uniformity of electrochemical plating films produced in semiconductor device processing
US20070181441A1 (en) * 2005-10-14 2007-08-09 Applied Materials, Inc. Method and apparatus for electropolishing
US8323460B2 (en) * 2007-06-20 2012-12-04 Lam Research Corporation Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal
TW200936309A (en) * 2007-10-10 2009-09-01 Ebara Corp Electrolitic composite abrasion method and abrasion method

Also Published As

Publication number Publication date
US9758893B2 (en) 2017-09-12
CN104835750B (zh) 2019-03-08
TWI642815B (zh) 2018-12-01
TW201540877A (zh) 2015-11-01
KR102169555B1 (ko) 2020-10-23
CN104835750A (zh) 2015-08-12
KR20150093620A (ko) 2015-08-18
US20150225866A1 (en) 2015-08-13

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