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SG109436A1 - Leaded mcm package and method therefor - Google Patents

Leaded mcm package and method therefor

Info

Publication number
SG109436A1
SG109436A1 SG200007216A SG200007216A SG109436A1 SG 109436 A1 SG109436 A1 SG 109436A1 SG 200007216 A SG200007216 A SG 200007216A SG 200007216 A SG200007216 A SG 200007216A SG 109436 A1 SG109436 A1 SG 109436A1
Authority
SG
Singapore
Prior art keywords
leaded
method therefor
mcm package
mcm
package
Prior art date
Application number
SG200007216A
Inventor
Fung Leng Chen
Chuen Khiang Wang
Yong Khim Swee
Original Assignee
Fung Leng Chen
Chuen Khiang Wang
Yong Khim Swee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fung Leng Chen, Chuen Khiang Wang, Yong Khim Swee filed Critical Fung Leng Chen
Priority to SG200007216A priority Critical patent/SG109436A1/en
Publication of SG109436A1 publication Critical patent/SG109436A1/en

Links

SG200007216A 2000-12-07 2000-12-07 Leaded mcm package and method therefor SG109436A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200007216A SG109436A1 (en) 2000-12-07 2000-12-07 Leaded mcm package and method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200007216A SG109436A1 (en) 2000-12-07 2000-12-07 Leaded mcm package and method therefor

Publications (1)

Publication Number Publication Date
SG109436A1 true SG109436A1 (en) 2005-03-30

Family

ID=34588228

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200007216A SG109436A1 (en) 2000-12-07 2000-12-07 Leaded mcm package and method therefor

Country Status (1)

Country Link
SG (1) SG109436A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984065A (en) * 1989-01-11 1991-01-08 Kabushiki Kaisha Toshiba Hybrid resin-sealed semiconductor device
US5049977A (en) * 1989-07-18 1991-09-17 Kabushiki Kaisha Toshiba Plastic molded type semiconductor device
US5349233A (en) * 1992-04-20 1994-09-20 Kabushiki Kaisha Toshiba Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984065A (en) * 1989-01-11 1991-01-08 Kabushiki Kaisha Toshiba Hybrid resin-sealed semiconductor device
US5049977A (en) * 1989-07-18 1991-09-17 Kabushiki Kaisha Toshiba Plastic molded type semiconductor device
US5349233A (en) * 1992-04-20 1994-09-20 Kabushiki Kaisha Toshiba Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame

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