[go: up one dir, main page]

SG108312A1 - Procedure for the electrical contacting of two metal structures - Google Patents

Procedure for the electrical contacting of two metal structures

Info

Publication number
SG108312A1
SG108312A1 SG200300165A SG200300165A SG108312A1 SG 108312 A1 SG108312 A1 SG 108312A1 SG 200300165 A SG200300165 A SG 200300165A SG 200300165 A SG200300165 A SG 200300165A SG 108312 A1 SG108312 A1 SG 108312A1
Authority
SG
Singapore
Prior art keywords
procedure
metal structures
electrical contacting
contacting
electrical
Prior art date
Application number
SG200300165A
Inventor
Bauer Alfred
Hartmann Horst
Kolodzei Gunter
Rabe Michael
Original Assignee
Heraeus Gmbh W C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Gmbh W C filed Critical Heraeus Gmbh W C
Publication of SG108312A1 publication Critical patent/SG108312A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Contacts (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
SG200300165A 2002-02-08 2003-01-24 Procedure for the electrical contacting of two metal structures SG108312A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2002105521 DE10205521A1 (en) 2002-02-08 2002-02-08 Process for the electrical contacting of two metal structures

Publications (1)

Publication Number Publication Date
SG108312A1 true SG108312A1 (en) 2005-01-28

Family

ID=27588519

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200300165A SG108312A1 (en) 2002-02-08 2003-01-24 Procedure for the electrical contacting of two metal structures

Country Status (5)

Country Link
EP (1) EP1335452A3 (en)
CN (1) CN1437285A (en)
DE (1) DE10205521A1 (en)
SG (1) SG108312A1 (en)
TW (1) TW200302772A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080318A (en) * 2008-09-26 2010-04-08 Smk Corp Shell for connector
DE102010050343A1 (en) * 2010-11-05 2012-05-10 Heraeus Materials Technology Gmbh & Co. Kg Chip-integrated via contacting of multi-layer substrates
DE102010050342A1 (en) 2010-11-05 2012-05-10 Heraeus Materials Technology Gmbh & Co. Kg Laminate with integrated electronic component
DE102011010186B4 (en) 2011-02-02 2018-10-18 Heraeus Deutschland GmbH & Co. KG Process for producing a laminate with conductive contacting
DE102011122037A1 (en) * 2011-12-22 2013-06-27 Kathrein-Werke Kg Method for producing a high-frequency electrical connection between two plate sections and an associated high-frequency electrical connection
CN104039079B (en) * 2013-12-01 2017-03-29 东莞市震泰电子科技有限公司 Integrated circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19522338A1 (en) * 1995-06-20 1997-01-02 Fraunhofer Ges Forschung Deformable substrate through-contact production method for chip carrier
DE19852832A1 (en) * 1998-11-17 2000-05-25 Heraeus Gmbh W C Production of e.g. multilayer metal plastic laminate forming lead frame, includes stamping processes raising contact surfaces and adhesive dams, advancing miniaturization by replacement of ball grid arrays
JP2000151110A (en) * 1998-11-13 2000-05-30 Mitsui High Tec Inc Method of forming via hole in multilayer wiring board and multilayer wiring board
US6243946B1 (en) * 1996-04-12 2001-06-12 Yamaichi Electronics Co., Ltd. Method of forming an interlayer connection structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3346950A (en) * 1965-06-16 1967-10-17 Ibm Method of making through-connections by controlled punctures
JP2640780B2 (en) * 1989-12-28 1997-08-13 松下電器産業株式会社 Interlayer connection method for metal substrates
JPH06132659A (en) * 1992-10-22 1994-05-13 Matsushita Electric Ind Co Ltd Through-hole printed wiring board manufacturing method
DE19531970A1 (en) * 1995-08-30 1997-03-06 Siemens Ag Method for producing a connection between at least two electrical conductors, one of which is arranged on a carrier substrate
JP3338004B2 (en) * 1999-06-25 2002-10-28 株式会社オートネットワーク技術研究所 Busbar connection structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19522338A1 (en) * 1995-06-20 1997-01-02 Fraunhofer Ges Forschung Deformable substrate through-contact production method for chip carrier
US6243946B1 (en) * 1996-04-12 2001-06-12 Yamaichi Electronics Co., Ltd. Method of forming an interlayer connection structure
JP2000151110A (en) * 1998-11-13 2000-05-30 Mitsui High Tec Inc Method of forming via hole in multilayer wiring board and multilayer wiring board
DE19852832A1 (en) * 1998-11-17 2000-05-25 Heraeus Gmbh W C Production of e.g. multilayer metal plastic laminate forming lead frame, includes stamping processes raising contact surfaces and adhesive dams, advancing miniaturization by replacement of ball grid arrays

Also Published As

Publication number Publication date
EP1335452A3 (en) 2007-05-02
CN1437285A (en) 2003-08-20
DE10205521A1 (en) 2003-08-28
TW200302772A (en) 2003-08-16
EP1335452A2 (en) 2003-08-13

Similar Documents

Publication Publication Date Title
GB2383188B (en) Method for the fabrication of electrical contacts
GB2378043B (en) Method for the fabrication of electrical contacts
GB0121669D0 (en) Electrode
ZA200401004B (en) Combination for the treatment of inflammatory disorders
EG23458A (en) Set of elements for assemlying structures
AU2003236991A8 (en) Representations of processes
EP1359830A4 (en) Choptstick of the pincers type
AU2003258145A8 (en) Substituted phenylindoles for the treatment of hiv
AU2003218346A8 (en) Influence of surface geometry on metal properties
GB2383187B (en) Electrode structures
SG108312A1 (en) Procedure for the electrical contacting of two metal structures
AP1925A (en) Method for the prevention of malaria
IL164788A0 (en) Process for the preparation of 3-isochromanone
ZA200304827B (en) The inspection of electrical equipment.
GB2393207B (en) Means of assembly
TW581334U (en) The compound structure of terminal
TW545437U (en) Abstract of the disclosure
AU2002353705A8 (en) Electrode
TW554950U (en) Improved structure of bumping structure
GB0110857D0 (en) Electrical structures
TW566229U (en) The component of the distiller
GB0213868D0 (en) Methods for the preparation of metal foams
TW562054U (en) Metallic ceilings
TW579837U (en) The turning structure of electric walk-substituting car
GB0100867D0 (en) Method of increasing the effective thickness of inusulation