SG107600A1 - Multilayer substrate metallization for ic interconnection - Google Patents
Multilayer substrate metallization for ic interconnectionInfo
- Publication number
- SG107600A1 SG107600A1 SG200203893A SG200203893A SG107600A1 SG 107600 A1 SG107600 A1 SG 107600A1 SG 200203893 A SG200203893 A SG 200203893A SG 200203893 A SG200203893 A SG 200203893A SG 107600 A1 SG107600 A1 SG 107600A1
- Authority
- SG
- Singapore
- Prior art keywords
- layer
- substrate
- interconnection
- metallization
- multilayer substrate
- Prior art date
Links
Classifications
-
- H10W90/701—
-
- H10W72/251—
-
- H10W72/29—
-
- H10W72/923—
-
- H10W72/9415—
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
A substrate metallization for soldering, with a Pb-free solder or a eutectic SnPb solder (4), to a thin film under-bump-metallization (UBM) of a Si die, comprising: a substrate (1), a layer of Cu (20) formed on a portion of the substrate (1), a layer of Ni (21) formed on the Cu layer (20), an oxidation protection layer (22), and a Ni-barrier layer (23), between the Ni layer (21)and the oxidation protection layer (22), adapted to inhibit diffusion of Ni from the Ni layer (21) to the solder (4) during a reflow process or during high temperature storage.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200203893A SG107600A1 (en) | 2002-06-27 | 2002-06-27 | Multilayer substrate metallization for ic interconnection |
| AU2003251281A AU2003251281A1 (en) | 2002-06-27 | 2003-06-26 | Multilayer substrate metallization for ic interconnection |
| PCT/SG2003/000154 WO2004004003A1 (en) | 2002-06-27 | 2003-06-26 | Multilayer substrate metallization for ic interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200203893A SG107600A1 (en) | 2002-06-27 | 2002-06-27 | Multilayer substrate metallization for ic interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG107600A1 true SG107600A1 (en) | 2004-12-29 |
Family
ID=29997744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200203893A SG107600A1 (en) | 2002-06-27 | 2002-06-27 | Multilayer substrate metallization for ic interconnection |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2003251281A1 (en) |
| SG (1) | SG107600A1 (en) |
| WO (1) | WO2004004003A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8659155B2 (en) | 2009-11-05 | 2014-02-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for forming copper pillar bumps |
| US9227257B2 (en) | 2012-04-24 | 2016-01-05 | Seagate Technology Llc | Laser subassembly metallization for heat assisted magnetic recording |
| US10692830B2 (en) | 2017-10-05 | 2020-06-23 | Texas Instruments Incorporated | Multilayers of nickel alloys as diffusion barrier layers |
| US11127704B2 (en) * | 2017-11-28 | 2021-09-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device with bump structure and method of making semiconductor device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5449955A (en) * | 1994-04-01 | 1995-09-12 | At&T Corp. | Film circuit metal system for use with bumped IC packages |
| WO1999064198A1 (en) * | 1998-06-10 | 1999-12-16 | W. C. Heraeus Gmbh & Co. Kg | Method for producing a lead-free substrate |
| US6445069B1 (en) * | 2001-01-22 | 2002-09-03 | Flip Chip Technologies, L.L.C. | Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor |
-
2002
- 2002-06-27 SG SG200203893A patent/SG107600A1/en unknown
-
2003
- 2003-06-26 WO PCT/SG2003/000154 patent/WO2004004003A1/en not_active Ceased
- 2003-06-26 AU AU2003251281A patent/AU2003251281A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003251281A1 (en) | 2004-01-19 |
| WO2004004003A1 (en) | 2004-01-08 |
| WO2004004003A8 (en) | 2004-04-15 |
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