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SE8803469L - Baerelement foer en ic-modul - Google Patents

Baerelement foer en ic-modul

Info

Publication number
SE8803469L
SE8803469L SE8803469A SE8803469A SE8803469L SE 8803469 L SE8803469 L SE 8803469L SE 8803469 A SE8803469 A SE 8803469A SE 8803469 A SE8803469 A SE 8803469A SE 8803469 L SE8803469 L SE 8803469L
Authority
SE
Sweden
Prior art keywords
module
bearing element
bearing
Prior art date
Application number
SE8803469A
Other languages
English (en)
Other versions
SE503924C2 (sv
SE8803469D0 (sv
Inventor
Y Haghiri-Tehrani
J Hoppe
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of SE8803469L publication Critical patent/SE8803469L/sv
Publication of SE8803469D0 publication Critical patent/SE8803469D0/sv
Publication of SE503924C2 publication Critical patent/SE503924C2/sv

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H10W70/453—
    • H10W70/68—
    • H10W70/699—
    • H10W72/0198—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SE8803469A 1980-12-08 1988-09-30 Bärelement bestående av en bärfilm, en IC-komponent och en film med ursparningar som är förbunden med bärfilmen samt ett identitetskort innefattande ett sådant bärelement SE503924C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3046193 1980-12-08

Publications (3)

Publication Number Publication Date
SE8803469L true SE8803469L (sv) 1988-09-30
SE8803469D0 SE8803469D0 (sv) 1988-09-30
SE503924C2 SE503924C2 (sv) 1996-09-30

Family

ID=6118603

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8803469A SE503924C2 (sv) 1980-12-08 1988-09-30 Bärelement bestående av en bärfilm, en IC-komponent och en film med ursparningar som är förbunden med bärfilmen samt ett identitetskort innefattande ett sådant bärelement

Country Status (3)

Country Link
JP (1) JPS57122559A (sv)
BE (1) BE891283A (sv)
SE (1) SE503924C2 (sv)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59222947A (ja) * 1983-06-02 1984-12-14 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JPH0655554B2 (ja) * 1984-12-13 1994-07-27 松下電器産業株式会社 Ｉｃカードおよびその製造方法
JPS6283672U (sv) * 1985-11-12 1987-05-28
JPH06101493B2 (ja) * 1986-03-28 1994-12-12 松下電器産業株式会社 プラスチツクチツプキヤリア
JP2796625B2 (ja) * 1988-01-09 1998-09-10 カシオ計算機株式会社 電子桟器
JP2519332B2 (ja) * 1988-07-08 1996-07-31 沖電気工業株式会社 半導体装置
JP2606673B2 (ja) * 1994-10-21 1997-05-07 松下電器産業株式会社 実装体
JP2777114B2 (ja) * 1996-09-02 1998-07-16 株式会社日立製作所 テープキャリア
KR100447035B1 (ko) * 1996-11-21 2004-09-07 가부시키가이샤 히타치세이사쿠쇼 반도체 장치의 제조방법
KR20010034214A (ko) * 1998-03-19 2001-04-25 가나이 쓰토무 반도체장치와 그 제조방법 및 반도체장치의 실장구조
JP3931330B2 (ja) 2001-09-14 2007-06-13 ソニー株式会社 熱プレス用プレートおよびカード製造装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50135062U (sv) * 1974-04-23 1975-11-07
JPS50159262A (sv) * 1974-06-12 1975-12-23

Also Published As

Publication number Publication date
JPH0370374B2 (sv) 1991-11-07
BE891283A (fr) 1982-03-16
SE503924C2 (sv) 1996-09-30
SE8803469D0 (sv) 1988-09-30
JPS57122559A (en) 1982-07-30

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