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SE8302679L - LODNINGSFORFARANDE - Google Patents

LODNINGSFORFARANDE

Info

Publication number
SE8302679L
SE8302679L SE8302679A SE8302679A SE8302679L SE 8302679 L SE8302679 L SE 8302679L SE 8302679 A SE8302679 A SE 8302679A SE 8302679 A SE8302679 A SE 8302679A SE 8302679 L SE8302679 L SE 8302679L
Authority
SE
Sweden
Prior art keywords
wire
solder
tool
soldering
terminal pads
Prior art date
Application number
SE8302679A
Other languages
Swedish (sv)
Other versions
SE450098B (en
SE8302679D0 (en
Inventor
R Morino
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE8302679D0 publication Critical patent/SE8302679D0/en
Publication of SE8302679L publication Critical patent/SE8302679L/en
Publication of SE450098B publication Critical patent/SE450098B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

In a method for rapidly soldering insulated wire to terminal pads of a printed circuit board 5, a soldering tool 32 is electrically heated to a high temperature above 530 DEG C, and preferably between 870 and 1100 DEG C, and has a predetermined effective mass for holding a quantum of heat just sufficient to vaporize the wire insulation and to make an effective solder joint in less than 500 milliseconds over a broad range of terminal pad conditions. Solder may be applied by solder-coating the terminal pads or the wire, by introducing powder or paste into the joint zone, or by use of preforms in the shape of washers, discs or ribbons or use of microdots and microspheres. Electrical heating of the tool 32 may be effected before and/or during tool contact with the wire. <IMAGE>
SE8302679A 1982-05-10 1983-05-10 LODNINGSFORFARANDE SE450098B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37665882A 1982-05-10 1982-05-10

Publications (3)

Publication Number Publication Date
SE8302679D0 SE8302679D0 (en) 1983-05-10
SE8302679L true SE8302679L (en) 1983-11-11
SE450098B SE450098B (en) 1987-06-09

Family

ID=23485924

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8302679A SE450098B (en) 1982-05-10 1983-05-10 LODNINGSFORFARANDE

Country Status (11)

Country Link
JP (1) JPS5916289A (en)
AU (1) AU1436083A (en)
BR (1) BR8302421A (en)
CA (1) CA1202377A (en)
CH (1) CH659204A5 (en)
DE (1) DE3313456C2 (en)
FR (1) FR2526624B1 (en)
GB (1) GB2120152B (en)
NL (1) NL8301585A (en)
SE (1) SE450098B (en)
ZA (1) ZA833330B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144864A (en) * 1986-12-08 1988-06-17 Matsushita Electric Ind Co Ltd Substrate heating device
DE3722729A1 (en) * 1987-07-09 1989-01-19 Productech Gmbh HEATED STAMP
DE3828621A1 (en) * 1988-08-23 1990-03-01 Productech Gmbh Arrangement for producing a defined gap between tool and parts in pulse soldering
US4987678A (en) * 1989-03-21 1991-01-29 Harris Corporation Apparatus for installing wire in grid support structure
EP0468267B1 (en) * 1990-07-23 1994-04-13 Siemens Nixdorf Informationssysteme Aktiengesellschaft Laying tool for laying modification wires on printed circuit boards and method therefor
DE102010006879A1 (en) * 2010-02-04 2011-08-04 Sunfilm AG, 01900 Contacting a photovoltaic module, comprises providing a layer arrangement from a light-sensitive layer for generating a charge during falling light on the light-sensitive layer and a conductive layer arranged on the light-sensitive layer
DE102017114771B4 (en) * 2017-06-29 2022-01-27 Pac Tech - Packaging Technologies Gmbh Method and device for producing a wire connection and component arrangement with wire connection
WO2025146580A1 (en) * 2024-01-04 2025-07-10 Biosense Webster (Israel) Ltd. Soldering wires of electrodes to tin domes and pads in a multielectrode catheter

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1164437A (en) * 1966-05-27 1969-09-17 Plessey Co Ltd Improvements relating to Soldering
US3673681A (en) * 1969-04-01 1972-07-04 Inforex Electrical circuit board wiring
US3650450A (en) * 1969-11-24 1972-03-21 Wells Electronics Means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive element on an electrical assembly
US3960309A (en) * 1974-07-31 1976-06-01 International Business Machines Corporation Fine wire twisted pair routing and connecting system
FR2304247A1 (en) * 1975-03-12 1976-10-08 Commissariat Energie Atomique METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS
JPS5915937Y2 (en) * 1979-09-12 1984-05-11 陽介 二宮 table

Also Published As

Publication number Publication date
AU1436083A (en) 1983-11-17
CA1202377A (en) 1986-03-25
ZA833330B (en) 1984-06-27
DE3313456C2 (en) 1984-02-16
CH659204A5 (en) 1987-01-15
SE450098B (en) 1987-06-09
FR2526624A1 (en) 1983-11-10
JPS5916289A (en) 1984-01-27
GB2120152B (en) 1986-06-04
NL8301585A (en) 1983-12-01
FR2526624B1 (en) 1986-05-02
GB2120152A (en) 1983-11-30
SE8302679D0 (en) 1983-05-10
DE3313456A1 (en) 1983-11-17
BR8302421A (en) 1984-01-10
JPH0145957B2 (en) 1989-10-05
GB8312010D0 (en) 1983-06-08

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