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SE8106386L - PROCEDURE FOR PREPARING A CORROSION-RESISTANT GOLD PLATING THROUGH ELECTROLYTIC DEPOSIT - Google Patents

PROCEDURE FOR PREPARING A CORROSION-RESISTANT GOLD PLATING THROUGH ELECTROLYTIC DEPOSIT

Info

Publication number
SE8106386L
SE8106386L SE8106386A SE8106386A SE8106386L SE 8106386 L SE8106386 L SE 8106386L SE 8106386 A SE8106386 A SE 8106386A SE 8106386 A SE8106386 A SE 8106386A SE 8106386 L SE8106386 L SE 8106386L
Authority
SE
Sweden
Prior art keywords
gold plating
electrodeposition
salt
corrosion
preparing
Prior art date
Application number
SE8106386A
Other languages
Unknown language ( )
Swedish (sv)
Inventor
D R Rosegren
L J Mayer
Original Assignee
Hooker Chemicals Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals Plastics Corp filed Critical Hooker Chemicals Plastics Corp
Publication of SE8106386L publication Critical patent/SE8106386L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Improved corrosion resistance of base metal hardened gold plating is achieved by the electrodeposition of a ductile, low-stress nickel coating on the substrate prior to the electrodeposition of the metal-hardened gold plating. The nickel coating is electrodeposited from a bath containing a Ni salt, an electrolyte eg boric and/or formic acid, o-formyl benzene sulphonic acid, and optionally a blend of K perfluoroalkyl sulphonates as wetting agent. The gold coating is electrodeposited from a bath containing a Au salt, an electrolyte eg acetic, citric and/or formic acid, and a Au hardener metal salt, eg of Co, In, Ni and/or Zn. Both electrodeposition steps may use insoluble anodes.
SE8106386A 1980-10-31 1981-10-29 PROCEDURE FOR PREPARING A CORROSION-RESISTANT GOLD PLATING THROUGH ELECTROLYTIC DEPOSIT SE8106386L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20241080A 1980-10-31 1980-10-31

Publications (1)

Publication Number Publication Date
SE8106386L true SE8106386L (en) 1982-05-01

Family

ID=22749762

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8106386A SE8106386L (en) 1980-10-31 1981-10-29 PROCEDURE FOR PREPARING A CORROSION-RESISTANT GOLD PLATING THROUGH ELECTROLYTIC DEPOSIT

Country Status (14)

Country Link
JP (1) JPS6053120B2 (en)
AU (1) AU530002B2 (en)
BE (1) BE890947A (en)
BR (1) BR8107041A (en)
CA (1) CA1162505A (en)
DE (1) DE3139815C2 (en)
DK (1) DK422081A (en)
ES (1) ES506573A0 (en)
FR (1) FR2493349A1 (en)
GB (1) GB2086428B (en)
HK (1) HK66886A (en)
IT (1) IT1171616B (en)
NL (1) NL8104859A (en)
SE (1) SE8106386L (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2130602B (en) * 1982-11-24 1986-04-16 Stc Plc Electroplating electrical contacts
DE3465115D1 (en) * 1983-05-28 1987-09-03 Masami Kobayashi Solderable stainless steel article and method for making same
JPS607157A (en) * 1983-06-25 1985-01-14 Masami Kobayashi Lead frame for ic
JPS6033363A (en) * 1983-08-02 1985-02-20 Nippon Dento Kogyo Kk Noble metal plating method
GB2153386B (en) * 1984-02-01 1987-08-26 Omi Int Corp Gold alloy plating bath
GB2168381B (en) * 1984-12-12 1988-03-09 Stc Plc Gold plated electrical contacts
JP2693480B2 (en) * 1988-04-28 1997-12-24 シチズン時計株式会社 Exterior parts for watch and manufacturing method thereof
JP2780506B2 (en) * 1991-03-04 1998-07-30 戸田工業株式会社 Electric Ni plating method
US9693672B2 (en) 2011-09-22 2017-07-04 Whirlpool Corporation Dishwasher with sprayer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1124780B (en) * 1960-10-08 1962-03-01 Schering Ag Electrolyte for the deposition of high-gloss nickel coatings
DE1496818C3 (en) * 1964-03-12 1978-04-27 Dr. Hesse & Cie, 4800 Bielefeld Process for the electrolytic production of gold layers with a high, uniform gloss and good resistance to corrosion and tarnishing
US3334032A (en) * 1964-05-08 1967-08-01 Hanson Van Winkle Munning Co Electrodeposition of nickel
GB1442325A (en) * 1972-07-26 1976-07-14 Oxy Metal Finishing Corp Electroplating with gold and gold alloys
FR2309203A1 (en) * 1975-04-30 1976-11-26 Parant Sa Dental cap based on stainless steel - which is electrolytically deposited with nickel and gold and finally coated with ceramic
DK422181A (en) * 1980-10-23 1982-04-24 Hooker Chemicals Plastics Corp BATH AND METHOD FOR HIGH SPEED NICKEL ELECTROPLETING

Also Published As

Publication number Publication date
IT8149589A0 (en) 1981-10-29
DE3139815C2 (en) 1986-05-22
CA1162505A (en) 1984-02-21
AU530002B2 (en) 1983-06-30
DE3139815A1 (en) 1982-06-16
GB2086428A (en) 1982-05-12
HK66886A (en) 1986-09-18
ES8206671A1 (en) 1982-08-16
BE890947A (en) 1982-04-30
FR2493349A1 (en) 1982-05-07
IT8149589A1 (en) 1983-04-29
AU7567581A (en) 1982-05-06
IT1171616B (en) 1987-06-10
GB2086428B (en) 1983-11-30
JPS5798694A (en) 1982-06-18
NL8104859A (en) 1982-05-17
JPS6053120B2 (en) 1985-11-22
DK422081A (en) 1982-05-01
BR8107041A (en) 1982-07-20
ES506573A0 (en) 1982-08-16

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