[go: up one dir, main page]

SE8105378L - Flussmedelskomposition - Google Patents

Flussmedelskomposition

Info

Publication number
SE8105378L
SE8105378L SE8105378A SE8105378A SE8105378L SE 8105378 L SE8105378 L SE 8105378L SE 8105378 A SE8105378 A SE 8105378A SE 8105378 A SE8105378 A SE 8105378A SE 8105378 L SE8105378 L SE 8105378L
Authority
SE
Sweden
Prior art keywords
flux
card
copper
ester
constituents
Prior art date
Application number
SE8105378A
Other languages
English (en)
Inventor
G F Arbib
W Rubin
Original Assignee
Multicore Solders Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multicore Solders Ltd filed Critical Multicore Solders Ltd
Publication of SE8105378L publication Critical patent/SE8105378L/sv

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Claims (3)

PATENTKRAV 1. Satt att framstAlla ett kort med tryckta kretsar, k A n - netecknat dArav, (A) att man pa ett kopparbelagt plastlarninatkort anbringar en flytande flussmedelskomposition, vilken corn vAsentliga bestAndsdelar inbegriper:
1. minst en neutral ester, non erhAllits frAn en flervArd alkohol och en organisk monokarboxylsyra och corn liar en molekylvikt av mlnst 300, och 2. minst ytterligare en bestAndsdel, som utgOres av: organiska syror, som Sr vasentligen 18sliga 1 astern av den flervarda alkoholen i slant tillstAnd,
2. flussmedelsaktiverande medel och/eller
3. hardare for flussmedelsaterstoden med en smaltpunkt av minst 100°C, varvid esters (1) foreligger i en mangd av mer an 25 vikt% rAknat pl den totals vikten av bestandsdelarna (1) och (2), varjamte bestandsdelarna Sr associerade med ett organiskt losningsmedel for bildning av ett leer pa kortet ,r1 kretsledare av koppar skall formes, (B) att man underkastar det erhAllna kortet inverkan av en etsloaning for avlagsnande av all kopparbelaggning pi omrAden utanfor de manstrade omradena, och (c) att man tvattar Oct ddrefter torkar det erhAllna etsade kortet, son uppbar de onskade kretsledarna av koppar, vilka alltjamt tar en belaggning av flussmedelskompositionen. (a)
SE8105378A 1976-06-11 1981-09-10 Flussmedelskomposition SE8105378L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB24410/76A GB1550648A (en) 1976-06-11 1976-06-11 Soft soldering

Publications (1)

Publication Number Publication Date
SE8105378L true SE8105378L (sv) 1981-09-10

Family

ID=10211310

Family Applications (2)

Application Number Title Priority Date Filing Date
SE7706771A SE7706771L (sv) 1976-06-11 1977-06-10 Flussmedelskomposition
SE8105378A SE8105378L (sv) 1976-06-11 1981-09-10 Flussmedelskomposition

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SE7706771A SE7706771L (sv) 1976-06-11 1977-06-10 Flussmedelskomposition

Country Status (29)

Country Link
US (2) US4092182A (sv)
JP (1) JPS52152846A (sv)
AR (1) AR211186A1 (sv)
AU (1) AU502483B2 (sv)
BE (1) BE855242A (sv)
BR (1) BR7703776A (sv)
CA (1) CA1085275A (sv)
CH (2) CH621277A5 (sv)
DE (2) DE2725701C2 (sv)
DK (1) DK257877A (sv)
ES (2) ES459662A1 (sv)
FI (1) FI63683C (sv)
FR (1) FR2354172A1 (sv)
GB (1) GB1550648A (sv)
HK (1) HK20980A (sv)
HU (2) HU180180B (sv)
IE (1) IE45280B1 (sv)
IL (1) IL52187A (sv)
IN (1) IN146478B (sv)
IT (1) IT1083506B (sv)
LU (1) LU77523A1 (sv)
MY (1) MY8100032A (sv)
NL (1) NL175705C (sv)
NZ (1) NZ184109A (sv)
PT (1) PT66649B (sv)
SE (2) SE7706771L (sv)
SU (1) SU1042607A3 (sv)
TR (1) TR19703A (sv)
ZA (1) ZA772799B (sv)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1594804A (en) * 1978-05-23 1981-08-05 Multicore Solders Ltd Soft soldering
DE3110319A1 (de) * 1980-03-17 1982-01-07 Multicore Solders Ltd., Hemel Hempstead, Hertfordshire Weichlotmaterial und verwendung desselben fuer loetbaeder
US4298407A (en) * 1980-08-04 1981-11-03 E. I. Du Pont De Nemours And Company Flux treated solder powder composition
US4342607A (en) * 1981-01-05 1982-08-03 Western Electric Company, Inc. Solder flux
EP0079135A3 (en) * 1981-11-06 1984-05-30 Multicore Solders Limited Method of producing preformed solder material for use in soldering electronic components
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
US4496098A (en) 1982-03-25 1985-01-29 Ichiro Kawakatsu Process for producing a tin/lead alloy solder joint with less wetting agent residue
JPS60133998A (ja) * 1983-12-22 1985-07-17 Nippon Genma:Kk はんだ付用フラツクス
US4561913A (en) * 1984-03-12 1985-12-31 At&T Technologies, Inc. Soldering flux additive
US4601763A (en) * 1984-10-11 1986-07-22 Lgz Landis & Gyr Zug Ag Method for the mechanical soft-soldering of heavy metals utilizing a fluxing agent
US4568395A (en) * 1985-05-10 1986-02-04 Nabhani Abdol R Precleaner system and soldering flux
JPS6388085A (ja) * 1986-10-02 1988-04-19 Toyo Kohan Co Ltd めつき鋼板の後処理方法
US4795508A (en) * 1987-02-05 1989-01-03 Shell Internationale Research Maatschappij B.V. Soldering compositions
US5639515A (en) * 1987-11-10 1997-06-17 Toyo Kohan Co., Ltd. Method for post-treatment of plated steel sheet for soldering
GB8900381D0 (en) * 1989-01-09 1989-03-08 Cookson Group Plc Flux composition
JPH07121468B2 (ja) * 1990-10-03 1995-12-25 メック株式会社 はんだ付け用フラックス
DE4033430A1 (de) * 1990-10-20 1992-04-23 Licentia Gmbh Verfahren zum herstellen eines lotmittelauftrags
JPH04351288A (ja) * 1991-05-27 1992-12-07 Metsuku Kk はんだ付け用フラックス及びクリームはんだ
US5118364A (en) * 1991-08-08 1992-06-02 International Business Machines Corporation Solder flux/paste compositions
DE4235575C2 (de) * 1992-10-22 1994-11-10 Degussa Weichlotpaste zum Löten von elektronischen Schaltungen
EP1237677B1 (en) 1999-12-03 2005-08-24 FRY'S METALS, INC. d.b.a. ALPHA METALS, INC. Soldering flux
US7108755B2 (en) * 2002-07-30 2006-09-19 Motorola, Inc. Simplification of ball attach method using super-saturated fine crystal flux
US7182241B2 (en) * 2002-08-09 2007-02-27 Micron Technology, Inc. Multi-functional solder and articles made therewith, such as microelectronic components
US7285173B2 (en) 2003-11-21 2007-10-23 Illinois Tool Works, Inc. Desoldering systems and processes
US7861915B2 (en) * 2004-04-16 2011-01-04 Ms2 Technologies, Llc Soldering process
RU2263569C1 (ru) * 2004-05-11 2005-11-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" (ФГУП НПП "Исток") Флюс для низкотемпературной пайки
WO2005118213A2 (en) * 2004-05-28 2005-12-15 P. Kay Metal, Inc. Solder paste and process
TW200610122A (en) * 2004-09-14 2006-03-16 P Kay Metal Inc Soldering process
TW200633810A (en) * 2004-12-28 2006-10-01 Arakawa Chem Ind Lead-free solder flux and solder paste
US8784696B2 (en) * 2012-05-09 2014-07-22 Xerox Corporation Intermediate transfer members containing internal release additives
DE102012220159B4 (de) * 2012-11-06 2019-06-27 Ersa Gmbh Verfahren und Reinigungssystem zur Reinigung des Prozessgases in Lötanlagen und Lötabsaugsystemen
US11648631B2 (en) 2018-06-29 2023-05-16 Senju Metal Industry Co., Ltd. Flux for resin flux cored solder, resin flux cored solder, flux for flux-coated solder, flux-coated solder, and soldering method
JP6604452B1 (ja) * 2019-04-12 2019-11-13 千住金属工業株式会社 フラックス、やに入りはんだ、フラックスコートはんだ及びはんだ付け方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2700628A (en) * 1951-12-07 1955-01-25 Rosa John A De Soldering flux
DE1690265U (de) 1954-08-19 1954-12-30 Herbert R W Hartmann Vorrichtung zum andruekken und anrollen von kapseln am hals von flaschen.
US2829998A (en) * 1955-03-23 1958-04-08 Whiffen And Sons Ltd Soldering fluxes
US3235414A (en) * 1962-01-11 1966-02-15 Continental Can Co Organic flux for soldering
US3301688A (en) * 1965-10-11 1967-01-31 Modine Mfg Co Bonding compositions
US3436278A (en) * 1966-08-08 1969-04-01 Ibm Glycol soldering fluxes
DE1690265B2 (de) * 1967-05-23 1975-10-30 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zur Erzeugung von gedruckten Leitungszügen
US3675307A (en) * 1969-08-08 1972-07-11 Frys Metals Ltd Soldering fluxes
JPS4834490B1 (sv) * 1970-12-07 1973-10-22
CS152769B1 (sv) * 1971-05-20 1974-02-22
DE2312482C3 (de) * 1973-03-13 1981-08-20 Rohde & Schwarz GmbH & Co KG, 8000 München Gedruckte Schaltungsplatte und Verfahren zu deren Herstellung
JPS5234015B2 (sv) * 1973-04-10 1977-09-01
US3975216A (en) * 1975-01-31 1976-08-17 Chevron Research Company Wax-flux composition containing a diester of sulfomalic acid for soldering

Also Published As

Publication number Publication date
HU177241B (en) 1981-08-28
IN146478B (sv) 1979-06-16
IT1083506B (it) 1985-05-21
DE2725701A1 (de) 1977-12-22
USRE30696E (en) 1981-08-04
IL52187A (en) 1982-07-30
FI771674A7 (sv) 1977-12-12
AU502483B2 (en) 1979-07-26
LU77523A1 (sv) 1977-09-26
AU2604077A (en) 1978-12-14
CA1085275A (en) 1980-09-09
NL175705B (nl) 1984-07-16
DE2725701C2 (de) 1982-06-24
FR2354172B1 (sv) 1982-10-22
SU1042607A3 (ru) 1983-09-15
NL175705C (nl) 1984-12-17
BE855242A (fr) 1977-09-16
US4092182A (en) 1978-05-30
TR19703A (tr) 1979-10-11
DK257877A (da) 1977-12-12
FI63683C (fi) 1983-08-10
JPS52152846A (en) 1977-12-19
SE7706771L (sv) 1977-12-12
GB1550648A (en) 1979-08-15
JPS5718998B2 (sv) 1982-04-20
AR211186A1 (es) 1977-10-31
ES470622A1 (es) 1979-02-01
MY8100032A (en) 1981-12-31
BR7703776A (pt) 1978-02-28
ES459662A1 (es) 1978-11-16
DE2759915C1 (de) 1982-07-15
FI63683B (fi) 1983-04-29
CH621277A5 (sv) 1981-01-30
ZA772799B (en) 1978-04-26
PT66649B (en) 1978-11-10
CH622659A5 (sv) 1981-04-15
IE45280B1 (en) 1982-07-28
IE45280L (en) 1977-12-11
FR2354172A1 (fr) 1978-01-06
PT66649A (en) 1977-07-01
NZ184109A (en) 1979-10-25
NL7706297A (nl) 1977-12-13
HU180180B (en) 1983-02-28
HK20980A (en) 1980-04-25

Similar Documents

Publication Publication Date Title
SE8105378L (sv) Flussmedelskomposition
EP0257792A3 (en) Composition and method for stripping films from printed circuit boards
US4983224A (en) Cleaning compositions and methods for removing soldering flux
DE69323321T2 (de) Flussmittel ohne reinigungsmittel und dessen verwendung
KR910004290A (ko) 세정 조성물 및 이를 이용하여 지지체 표면의 잔류물을 감소 시키는 방법
DE2713393C3 (de) Verfahren zum Herstellen von gedruckten Schaltungen
GB1484542A (en) Electric circuit boards
DE4333127A1 (de) Verfahren zum Schutz von lötfähigen Kupfer- und Kupferlegierungsoberflächen vor Korrosion
KR960700854A (ko) 잔유물이 적고 휘발성 유기화합물이 없는 납땜용융제 및 제조방법(no-clean, low-residue, volatile organic compound free soldering flux and method of use)
DE4235575C2 (de) Weichlotpaste zum Löten von elektronischen Schaltungen
GB1013608A (en) Improvements in or relating to processes for the manufacture of printed circuits
JP3796669B2 (ja) はんだ付用フラックス
DE2316720A1 (de) Verfahren zum entfernen von kolophoniumhaltigen rueckstaenden und dazugehoerige waschmittelloesung
TH22781A (th) ส่วนประกอบ (composition) ฟลักซ์และวิธีการบัดกรีที่สอดคล้องกัน
TH19889B (th) ส่วนประกอบ (composition) ฟลักซ์และวิธีการบัดกรีที่สอดคล้องกัน
JPS6457999A (en) Water soluble flux for soldering
US3366499A (en) Combination etching resist and soldering flux compound
SU912457A1 (ru) Состав дл удалени остатков флюса и подготовки поверхности печатных плат
FI68145C (fi) Foerfarande foer framstaellning av en tryckt kretsskiva
SU725850A1 (ru) Флюс дл пайки легкоплавкими припо ми
SU1722753A1 (ru) Флюс дл низкотемпературной пайки
SU797860A1 (ru) Флюс дл пайки легкоплавкимипРипО Ми
JPH1046368A (ja) はんだ剥離液
SU1006139A1 (ru) Флюс дл низкотемпературной пайки
KR950008670A (ko) 납땜플럭스제거용 세정제조성물

Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 8105378-7