SE7514390L - Halvledaraggregat - Google Patents
HalvledaraggregatInfo
- Publication number
- SE7514390L SE7514390L SE7514390A SE7514390A SE7514390L SE 7514390 L SE7514390 L SE 7514390L SE 7514390 A SE7514390 A SE 7514390A SE 7514390 A SE7514390 A SE 7514390A SE 7514390 L SE7514390 L SE 7514390L
- Authority
- SE
- Sweden
- Prior art keywords
- semi
- leader unit
- leader
- unit
- Prior art date
Links
Classifications
-
- H10W72/30—
-
- H10W70/02—
-
- H10W70/20—
-
- H10W70/69—
-
- H10W72/60—
-
- H10W76/136—
-
- H10W76/138—
-
- H10W72/07636—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/535,670 US3995310A (en) | 1974-12-23 | 1974-12-23 | Semiconductor assembly including mounting plate with recessed periphery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE7514390L true SE7514390L (sv) | 1976-06-24 |
Family
ID=24135257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7514390A SE7514390L (sv) | 1974-12-23 | 1975-12-18 | Halvledaraggregat |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3995310A (sv) |
| JP (1) | JPS5189385A (sv) |
| DE (1) | DE2557371A1 (sv) |
| GB (1) | GB1535195A (sv) |
| SE (1) | SE7514390L (sv) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH630490A5 (de) | 1978-06-30 | 1982-06-15 | Bbc Brown Boveri & Cie | Gehaeuse fuer ein halbleiter-hochleistungsbauelement. |
| DE3209174A1 (de) * | 1982-03-13 | 1983-09-15 | Brown, Boveri & Cie Ag, 6800 Mannheim | Sandwich fuer druckkontaktierbare halbleiter-leistungsbauelemente und verfahren zu seiner herstellung |
| US4939619A (en) * | 1987-01-26 | 1990-07-03 | Northern Telecom Limited | Packaged solid-state surge protector |
| EP0400177A1 (de) * | 1989-05-31 | 1990-12-05 | Siemens Aktiengesellschaft | Verbindung eines Halbleiterbauelements mit einem Metallträger |
| US5209390A (en) * | 1989-07-03 | 1993-05-11 | General Electric Company | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid |
| US5166773A (en) * | 1989-07-03 | 1992-11-24 | General Electric Company | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid |
| JPH0671062B2 (ja) * | 1989-08-30 | 1994-09-07 | 株式会社東芝 | 樹脂封止型半導体装置 |
| DE10249205B3 (de) * | 2002-10-22 | 2004-08-05 | Siemens Ag | Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen |
| DE10249206B3 (de) * | 2002-10-22 | 2004-07-01 | Siemens Ag | Verfahren zum Zusammenbau eines Leistungsbauelements |
| DE102009032193A1 (de) * | 2009-07-07 | 2011-01-13 | Behr Gmbh & Co. Kg | Verfahren zum fluiddichten Verbinden von zwei Bauelementen zur Herstellung einer fluiddichten Einheit und Kühlungseinheit zur Kühlung von Energiespeicherzellen |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3200310A (en) * | 1959-09-22 | 1965-08-10 | Carman Lab Inc | Glass encapsulated semiconductor device |
| NL269308A (sv) * | 1960-09-16 | |||
| GB1054422A (sv) * | 1963-03-16 | 1900-01-01 | ||
| US3303432A (en) * | 1966-04-18 | 1967-02-07 | Gen Electric | High power semiconductor laser devices |
| US3447118A (en) * | 1966-08-16 | 1969-05-27 | Westinghouse Electric Corp | Stacking module for flat packaged electrical devices |
| GB1152809A (en) * | 1968-05-07 | 1969-05-21 | Standard Telephones Cables Ltd | Electric Circuit Assembly |
| JPS5437474B1 (sv) * | 1968-06-10 | 1979-11-15 | ||
| US3551758A (en) * | 1969-01-08 | 1970-12-29 | Westinghouse Electric Corp | Fluid cooled heat sink assembly for pressure contacted semiconductor devices |
| US3831067A (en) * | 1972-05-15 | 1974-08-20 | Int Rectifier Corp | Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring |
| US3708720A (en) * | 1973-01-02 | 1973-01-02 | Franklin Electric Co Inc | Semiconductor thermal protection |
| US3869787A (en) * | 1973-01-02 | 1975-03-11 | Honeywell Inf Systems | Method for precisely aligning circuit devices coarsely positioned on a substrate |
-
1974
- 1974-12-23 US US05/535,670 patent/US3995310A/en not_active Expired - Lifetime
-
1975
- 1975-12-18 SE SE7514390A patent/SE7514390L/sv unknown
- 1975-12-19 GB GB52131/75A patent/GB1535195A/en not_active Expired
- 1975-12-19 DE DE19752557371 patent/DE2557371A1/de active Pending
- 1975-12-23 JP JP50152913A patent/JPS5189385A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3995310A (en) | 1976-11-30 |
| GB1535195A (en) | 1978-12-13 |
| JPS5189385A (sv) | 1976-08-05 |
| DE2557371A1 (de) | 1976-06-24 |
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