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SE2330469A1 - Integrated Circuit Package - Google Patents

Integrated Circuit Package

Info

Publication number
SE2330469A1
SE2330469A1 SE2330469A SE2330469A SE2330469A1 SE 2330469 A1 SE2330469 A1 SE 2330469A1 SE 2330469 A SE2330469 A SE 2330469A SE 2330469 A SE2330469 A SE 2330469A SE 2330469 A1 SE2330469 A1 SE 2330469A1
Authority
SE
Sweden
Prior art keywords
package
integrated circuit
circuit package
accommodate
probe
Prior art date
Application number
SE2330469A
Other versions
SE546664C2 (en
Inventor
Torrent Adrian Gomez
Bernhard Beuerle
James Campion
Original Assignee
Terasi Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Terasi Ab filed Critical Terasi Ab
Priority to SE2330469A priority Critical patent/SE546664C2/en
Priority to PCT/SE2024/050885 priority patent/WO2025084976A1/en
Publication of SE2330469A1 publication Critical patent/SE2330469A1/en
Publication of SE546664C2 publication Critical patent/SE546664C2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H10W44/20—
    • H10W90/00—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The abstract describes an integrated circuit (1C) package. The package comprises an 1C housing configured to accommodate the 1C, a passive component housing configured to accommodate a set of passive components, and at least one integrated probe suspended within the package. Each probe is configured to interface with a terminal of the 1C and comprises at least one suspended beam and at least one mechanical anchor point. The package enables efficient signal transfer and simplifies the integration process, providing a versatile solution for 1C integration.
SE2330469A 2023-10-18 2023-10-18 Integrated Circuit Package SE546664C2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE2330469A SE546664C2 (en) 2023-10-18 2023-10-18 Integrated Circuit Package
PCT/SE2024/050885 WO2025084976A1 (en) 2023-10-18 2024-10-17 Integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE2330469A SE546664C2 (en) 2023-10-18 2023-10-18 Integrated Circuit Package

Publications (2)

Publication Number Publication Date
SE2330469A1 true SE2330469A1 (en) 2025-01-14
SE546664C2 SE546664C2 (en) 2025-01-14

Family

ID=94210036

Family Applications (1)

Application Number Title Priority Date Filing Date
SE2330469A SE546664C2 (en) 2023-10-18 2023-10-18 Integrated Circuit Package

Country Status (2)

Country Link
SE (1) SE546664C2 (en)
WO (1) WO2025084976A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100833813B1 (en) * 2007-04-13 2008-05-30 나노세미텍(주) Integral probe block with anisotropic silicone connector and removable joint plate
JP2011064705A (en) * 2010-12-16 2011-03-31 Renesas Electronics Corp Method of manufacturing semiconductor integrated circuit
WO2016131906A1 (en) * 2015-02-18 2016-08-25 Technische Universiteit Eindhoven Multi-port optical probe for photonic ic characterization and packaging
CN112670260A (en) * 2020-12-24 2021-04-16 北京国联万众半导体科技有限公司 Millimeter wave monolithic integrated circuit module of integrated probe and preparation method thereof
WO2022079348A1 (en) * 2020-10-13 2022-04-21 Teknologian Tutkimuskeskus Vtt Oy Wafer-level package for millimetre wave and thz signals
TWI790605B (en) * 2021-05-03 2023-01-21 佳崨科技股份有限公司 Integrated circuit test socket

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100833813B1 (en) * 2007-04-13 2008-05-30 나노세미텍(주) Integral probe block with anisotropic silicone connector and removable joint plate
JP2011064705A (en) * 2010-12-16 2011-03-31 Renesas Electronics Corp Method of manufacturing semiconductor integrated circuit
WO2016131906A1 (en) * 2015-02-18 2016-08-25 Technische Universiteit Eindhoven Multi-port optical probe for photonic ic characterization and packaging
WO2022079348A1 (en) * 2020-10-13 2022-04-21 Teknologian Tutkimuskeskus Vtt Oy Wafer-level package for millimetre wave and thz signals
CN112670260A (en) * 2020-12-24 2021-04-16 北京国联万众半导体科技有限公司 Millimeter wave monolithic integrated circuit module of integrated probe and preparation method thereof
TWI790605B (en) * 2021-05-03 2023-01-21 佳崨科技股份有限公司 Integrated circuit test socket

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Ermolov V. et. al., 'Micromachining integration platform for sub-terahertz and terahertz systems', International Journal of Microwave and Wireless Technologies 10(5-6):651-659 (2018); DOI: 10.1017/S175907871800048X *

Also Published As

Publication number Publication date
WO2025084976A1 (en) 2025-04-24
SE546664C2 (en) 2025-01-14

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