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SE0000587L - Apparatus for removing heat from heated elements and method of manufacturing the apparatus. - Google Patents

Apparatus for removing heat from heated elements and method of manufacturing the apparatus.

Info

Publication number
SE0000587L
SE0000587L SE0000587A SE0000587A SE0000587L SE 0000587 L SE0000587 L SE 0000587L SE 0000587 A SE0000587 A SE 0000587A SE 0000587 A SE0000587 A SE 0000587A SE 0000587 L SE0000587 L SE 0000587L
Authority
SE
Sweden
Prior art keywords
channels
liquid
path
tubes
elements
Prior art date
Application number
SE0000587A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE0000587D0 (en
Inventor
Goeran Linder
Jari Tuomela
Original Assignee
Teracom Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teracom Ab filed Critical Teracom Ab
Priority to SE0000587A priority Critical patent/SE0000587L/en
Publication of SE0000587D0 publication Critical patent/SE0000587D0/en
Priority to PCT/SE2001/000387 priority patent/WO2001063666A1/en
Priority to AU2001236288A priority patent/AU2001236288A1/en
Publication of SE0000587L publication Critical patent/SE0000587L/en

Links

Classifications

    • H10W40/47—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An apparatus is provided for transporting away heat from heated elements. The ap-paratus comprises a block (9; 18; 27) of a material having good thermal conductivity on to which the elements are provided in thermal contact. Channels (7,8; 17; 25) are provided in the block. A liquid, for example water, is forced to flow through the channels. Path means (10, 11; 15, 16; 28, 29) in the channels provide a spiral path for the liquid. Whirl means (7,8; 17; 25) in the liquid path provide turbulence to the streaming water. The channels could be made by tubes having corrugated thin walls and made by a non-corrosive material against the streaming liquid, such as steel, preferably acid proof stainless steel. The tubes could be cast, or fastened in some other way, in a material having good thermal conductivity, for example aluminium. A method for producing the apparatus is also disclosed.
SE0000587A 2000-02-23 2000-02-23 Apparatus for removing heat from heated elements and method of manufacturing the apparatus. SE0000587L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0000587A SE0000587L (en) 2000-02-23 2000-02-23 Apparatus for removing heat from heated elements and method of manufacturing the apparatus.
PCT/SE2001/000387 WO2001063666A1 (en) 2000-02-23 2001-02-22 Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus
AU2001236288A AU2001236288A1 (en) 2000-02-23 2001-02-22 Apparatus for heat transport away from heated elements and method for manufacturing the apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0000587A SE0000587L (en) 2000-02-23 2000-02-23 Apparatus for removing heat from heated elements and method of manufacturing the apparatus.

Publications (2)

Publication Number Publication Date
SE0000587D0 SE0000587D0 (en) 2000-02-23
SE0000587L true SE0000587L (en) 2001-08-24

Family

ID=20278557

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0000587A SE0000587L (en) 2000-02-23 2000-02-23 Apparatus for removing heat from heated elements and method of manufacturing the apparatus.

Country Status (3)

Country Link
AU (1) AU2001236288A1 (en)
SE (1) SE0000587L (en)
WO (1) WO2001063666A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE524673C2 (en) * 2003-01-31 2004-09-14 Tykoflex Ab Apparatus for cooling heat-generating components by means of a cooling plate and processes for making the same
US7542495B1 (en) * 2007-11-12 2009-06-02 Gooch And Housego Plc Corrosion resistant cooled acousto-optic devices
CN101610664B (en) * 2008-06-20 2014-05-14 萨帕铝型材（上海）有限公司 Liquid cooler and manufacture method thereof
US8517750B2 (en) * 2009-08-27 2013-08-27 Air Motion Systems, Inc Interchangeable UV LED curing system
EP2685494B1 (en) * 2011-03-10 2016-04-27 Toyota Jidosha Kabushiki Kaisha Cooler
US9468131B2 (en) * 2014-04-16 2016-10-11 Raytheon Company Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
KR102792718B1 (en) * 2022-03-08 2025-04-07 엘에스일렉트릭(주) flow path module and electric device include the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1238462A (en) * 1967-07-11 1971-07-07
JPH06101524B2 (en) * 1985-09-18 1994-12-12 株式会社東芝 Cooling element for semiconductor element
DE4301865A1 (en) * 1993-01-25 1994-07-28 Abb Management Ag Cooling box for electric component
DE4421025C2 (en) * 1994-06-16 1999-09-09 Abb Patent Gmbh Heatsink with at least one cooling channel
JPH08215737A (en) * 1995-02-17 1996-08-27 Toshiba Corp Method of manufacturing cooling block for semiconductor device and cooling block thereof
DE19747321C2 (en) * 1997-10-27 2002-08-01 Semikron Elektronik Gmbh Liquid cooler for power semiconductor components

Also Published As

Publication number Publication date
AU2001236288A1 (en) 2001-09-03
WO2001063666A1 (en) 2001-08-30
SE0000587D0 (en) 2000-02-23

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Legal Events

Date Code Title Description
NAV Patent application has lapsed