RU2793749C1 - Card tab for direct connection or inductive coupling technology - Google Patents

Abstract

FIELD: smart cards carrying information.

SUBSTANCE: tab for a card with a microcircuit. The tab contains an antenna for communication with the module for inductive communication with the antenna of the chip module and an antenna for communication with the card reader for inductive communication with the antenna of the reader of the external card reader. The antenna for communication with the card reader is electrically connected to the antenna for communication with the module. The tab also includes a leadless capacitor module that is electrically connected to the card reader communication antenna to allow the card reader communication antenna to resonate at a predetermined frequency. The leadless capacitor module contains at least one passive component for storing electrical energy. At least one passive component has a capacitance in the range of 40 to 140 picofarads and a base area of less than 2.6 square millimetres.

EFFECT: improved technical characteristics of a smart card.

17 cl, 26 dwg

Description

This application relates to a smart card.

Smart cards that carry information can be divided into types of contact, contactless, or combined types, depending on the method used when reading data from smart cards. A contact-type smart card has a contact interface that allows a card identification device or a card reader to read data from a smart card that contacts a card reader. A contactless type smart card has a contactless or wireless interface that allows an external card reader to read data from the smart card using radio frequency (RF) waves. The combination type smart card or the dual interface smart card has a contact interface and a wireless interface to enable the card reader to read data from the smart card through contact or through RF waves. Contactless technologies simplify and speed up the use of cards for identification, authentication, data storage, application processing and payment transactions.

Smart cards can be made of plastic or metal. Metal cards are more durable than plastic cards as they cannot be easily bent, scratched or broken. In addition, metal cards have a shiny appearance and are heavier, giving users a sense of exclusivity and prestige when using cards.

WO 2019173455 discloses the middle layer of the card. The middle layer of the map contains the body that bounds the cut and the gap. The incision contains a hole in the body, bounded by the edge. The rupture contains a channel, which is limited by the body, which extends from the outer surface of the body to the incision. At least one circuit element is located in the section. The cut further defines the size and geometry such that a gap is formed between the at least one circuit element and the edge to electromagnetically isolate the at least one circuit element from the body.

US 2020167628 discloses a chip card. The chip card includes a metal layer containing a hole and a slot that extends from one edge of the hole to the outer edge of the metal layer. The IC card further comprises an amplifying antenna structure which is disposed in the hole. The amplifying antenna structure has an antenna section for electromagnetic coupling with the metal layer and a coupling section for electromagnetic coupling with the chip module antenna structure.

The purpose of this application is to provide an improved smart card tab.

It is believed that the metal card can be improved by adding an improved tab containing a wireless interface.

The plastic card can be upgraded by including an enhanced tab containing the wireless interface.

The application provided an improved card with a microcircuit. The IC card contains the first dual interface IC card using inductive coupling technology.

The first dual interface IC card includes a metal layer forming the body of the IC card. The metal layer contains an opening that extends to the outer edge of the metal layer. The hole may include a slit portion, which is an elongated hole extending from the other portion of the hole to the outer edge of the metal layer. The slit portion or hole portion near the outer edge of the metal layer is designed to break the conductive loop that passes through the hole in the metal layer, thereby preventing the loop eddy current from forming around the hole. The first dual interface chip card is also called the first dual interface smart card.

An IC card contains an IC module, which refers to an integrated circuit (IC) or microelectronic chip that includes the functions of a microprocessor. The chip module also contains a chip module antenna that is electrically connected to the chip module.

The IC card also includes a contact interface. The contact interface is electrically connected to the chip module for electrically connecting the chip module to an external card reader when the IC card is placed in the external card reader. The contact interface of the IC card then comes into contact with the contact pins of the reader cards by providing an electrical path between the chip card chip module and the card reader computer processor.

The chip card additionally contains an improved tab, which is located in the hole.

The tab additionally contains an antenna for communication with the module. The antenna for communication with the module may be a wire antenna made of electrical wire. The antenna for communication with the module is used for inductive communication with the antenna of the chip module. A change in the electrical current flowing through the antenna to communicate with the module creates a changing magnetic field around it, and the changing magnetic field induces a voltage in the antenna of the chip module. Conversely, a change in electrical current in the chip module antenna also induces voltage in the antenna to communicate with the module. Inductive coupling is also called electromagnetic coupling.

The tab also contains an antenna for communication with the card reader. The antenna for communication with the card reader may also be a wire antenna. It is designed to be inductively coupled to the reader antenna of an external card reader located at some distance from the chip card. The antenna for communication with the card reader is electrically or integrally connected to the antenna for communication with the module.

The tab further comprises a leadless capacitor module that is electrically connected to two of the antenna leads for communication with the card reader.

The leadless capacitor module contains at least one discrete passive component for storing electrical energy. This passive component may be provided as a discrete capacitor. The capacitor often contains at least two electrical conductors separated by a dielectric layer. An example of a discrete capacitor is a ceramic capacitor in which the dielectric layer is made of ceramic. The leadless capacitor module may include a surface mount (SMT) jacket enclosing a ceramic capacitor. Alternatively, the leadless capacitor module may also comprise a printed circuit board (COB) chip package enclosing a ceramic capacitor, the ceramic capacitor attached to a substrate, and the capacitor substrate coated with one or more layers of resin. The ceramic capacitor is often small in size. It may be in the form of a rectangular block about 0.4 millimeters (mm) long, about 0.2 mm wide and about 0.2 mm thick. Ceramic capacitors are commonly used in the manufacture of small or miniature electronic devices such as hearing aids that can be placed in a miniature space. A ceramic capacitor also often has a fixed, constant, and precise capacitance, which can have a tolerance of 5% or less than 5%.

The leadless capacitor module functions as a resonant capacitor, allowing the card reader communication antenna to resonate at a predetermined frequency of approximately 13.56 megahertz (MHz).

When used, the leadless capacitor module allows the antenna to communicate with the card reader to receive RF signals that are transmitted from the card reader in the resonant frequency band. The card reader communication antenna then transmits the received signals to the module communication antenna, which subsequently transmits the received signals to the chip module antenna by inductive coupling. The chip module antenna then transmits the received signals to the chip module for processing.

At the resonant frequency, the capacitance impedance of the leadless capacitor module is substantially equal to the combined inductance of the antenna for communication with the card reader and the antenna for communication with the module. In other words, the product of the total inductance of these antennas and the capacitance of the leadless capacitor module is essentially a constant value. If you choose a leadless capacitor module with a larger capacitance, the antenna inductance will become smaller. Less inductance means the antennas can be smaller. This can reduce the size of the hole housing the antenna and increase the size of the metal portion of the IC card, thereby making the IC card heavier.

Also, the capacitance of the leadless capacitor module cannot be too large, because the inductance of the antenna for communication with the card reader will become too small. If the inductance of the antenna for communication with the card reader is too small, the size of the antenna for communication with the card reader will be too small, so that the radio frequency energy induced in the antenna will not be sufficient to power the electronic parts of the smart card. Therefore, it is desirable that the capacitance of the leadless capacitor module does not exceed the predetermined upper value. The capacitance of the leadless capacitor module is also preferably larger than the predetermined lower value so that the hole size can be reduced sufficiently.

To meet this requirement, at least one passive component of the leadless capacitor module has a capacitance in the range of 40 picofarads to 140 picofarads. If at least one passive component refers to two or more capacitors, the capacitance of at least one passive component refers to the equivalent or effective capacitance of the capacitors. The passive component also has a small base area, which is less than 2.6 square millimeters. Base area refers to the area of the main surface or top surface of a passive component. If at least one passive component refers to two or more capacitors, the base area of the at least one passive component refers to the base area of each capacitor.

Since the leadless capacitor module often has a constant and precise capacitance, this allows the inlay antennas to operate at a constant efficiency without having to adjust the antennas after the inlay is made.

In addition, the leadless capacitor module can ensure that the inductance or size of the tab antennas is substantially smaller, while sufficient RF energy can be induced in the antennas to power the smart card electronics. This small leadless capacitor module also occupies a small part of the space of the tab, thereby reducing the size of the hole in the metal layer and increasing the metal part of the metal IC card to make the IC card stronger and heavier.

The leadless capacitor module also eliminates the use of an internal capacitance structure found in other metal IC cards. The internal capacitive structure is often created by running conductors in parallel, or stacking layers of metal separated by a dielectric sheet on top of each other. The internal capacitive structure often occupies a significant area of the IC card, and it often has a lower capacitance due to differences in manufacturing processes.

The application provides another improved chip card. The IC card contains a contactless IC card using direct plug technology. The contactless IC card comprises a metal layer containing a hole that extends to the outer edge of the metal layer.

The chip card additionally contains a tab located in the hole. The tab contains a microcircuit module and an antenna for communication with the card reader for inductive communication with the reader antenna of the external card reader. The antenna for communication with the card reader is electrically connected to the microcircuit module. The tab also includes a leadless capacitor module that is electrically connected to the card reader communication antenna to allow the card reader communication antenna to resonate at a predetermined frequency. The leadless capacitor module contains at least one passive component for storing electrical energy, wherein at least one passive component has a capacitance in the range from 40 picofarads to 140 picofarads and a main area that is less than 2.6 square millimeters.

Unlike the insert of the first card with a dual interface chip, in which the antenna for communication with the card reader is electrically connected to the antenna for communication with the module, which is inductively coupled with the antenna of the chip module, the antenna for communication with the card reader of the tab of this contactless card with chip is directly connected to the chip module that does not have an antenna.

The application also provides another advanced chip card. The IC card contains a second IC card with a dual interface using direct plug technology. The second dual interface chip card contains a metal layer. The metal layer contains an opening that extends to the outer edge of the metal layer.

The chip card further comprises a chip module and a contact interface that is electrically connected to the chip module for electrically connecting the chip module to an external card reader when the chip card is inserted into the external card reader.

The chip card additionally contains a tab located in the hole. The tab contains an antenna for communication with the card reader for inductive communication with the antenna of the reader of the external card reader. The antenna for communication with the card reader is electrically connected to the card chip module. The tab further comprises a leadless capacitor module that is electrically connected to the antenna for communication with the card reader to enable the antenna for communication with the card reader to resonate at a given frequency. The leadless capacitor module contains at least one passive component for storing electrical energy, wherein at least one passive component has a capacitance in the range from 40 picofarads to 140 picofarads and a main area that is less than 2.6 square millimeters.

With respect to the IC cards mentioned above, the passive component may have a capacitance in the range of 80 picofarads to 120 picofarads. This capacitance range is preferred to reduce the size and optimize the RF performance of the card reader antenna.

The passive component of a leadless capacitor module may be less than 0.3 mm thick. The small thickness allows the passive component to be enclosed, for example, in a COB shell. For the above contactless chip card using direct plug technology, the size of the COB shell can be such that its dimensions are similar to those of the chip module, so that the leadless capacitor module and the chip module can be processed by a similar process using the same equipment with a small setting. This can simplify the manufacturing process of making a contactless card insert with a chip.

The passive component may also be less than 0.6 mm thick. This allows the larger passive component to be electrically connected directly to the antenna for communication with the IC card inserter card reader. This can eliminate the manufacturing cost of the leadless capacitor module including the shell.

The contact interface of the respective chip cards mentioned above may comprise a plurality of pads that are electrically connected to the chip module. The pads can comply with the ISO 7816 standard and can have six or eight electrically conductive pads.

The leadless capacitor module of the respective IC cards mentioned above may have a capacitance of approximately 100 picofarads (pF). The capacitance of the leadless capacitor module is essentially the same as the capacitance of the passive component of the leadless capacitor module. This leadless capacitor module allows more RF energy to be injected into the card reader antenna and significantly reduces the size of the antenna. In this way, it is possible to obtain a metal chip card with a large metal part and fairly good RF performance.

In another implementation, the tab of the corresponding chip cards mentioned above further comprises an antenna carrier sheet for accommodating the antennas of the tab and the leadless capacitor module.

The tab of the corresponding chip cards mentioned above may further comprise a thickness compensation sheet, which is provided next to the carrier sheet for the antenna.

The tab of the respective IC cards mentioned above may also comprise at least one overlay sheet which is provided next to the thickness compensation sheet.

The tab of the corresponding IC cards mentioned above may further comprise at least one overlay sheet which is provided next to the carrier sheet for the antenna.

The application also provides an improved chip card inlay. The advanced tab contains the first tab using inductive coupling technology.

The first tab contains an antenna for communication with the module for inductive communication with the antenna of the chip card chip module. This chip card may be a dual interface chip card, with the chip module with chip module antenna not being part of the first tab. The first tab also contains an antenna for communication with the card reader for inductive communication with the antenna for communication with the card reader. and an antenna for communication with the module. The first tab further comprises a leadless capacitor module that is electrically connected to the card reader communication antenna to allow the card reader communication antenna to resonate at a predetermined frequency. The leadless capacitor module contains at least one passive component for storing electrical energy, wherein at least one passive component has a capacitance in the range from 40 picofarads to 140 picofarads and a main area that is less than 2.6 square millimeters.

The first tab has a leadless capacitor module with a constant and accurate capacitance, and the first tab does not require antenna tuning after the first tab is made. This leadless capacitor module is substantially small and has a large capacitance, which causes the antennas of the first tab to become substantially small, allowing the opening of the metal chip card to receive the first tab to be substantially small. Thus, it is possible to increase the size of the metal part of the IC card, thereby making the metal IC card stronger and heavier.

The application also provides an improved chip card inlay. The tab contains a second tab that uses direct-attach technology.

This second tab contains the antenna for communication with the card reader for inductive communication with the antenna for the reader of the external card reader. The antenna for communication with the card reader contains leads for electrical connection with the chip card chip module. The chip card can be a dual interface chip card, with the chip module not being part of the second tab. The second tab also contains a leadless capacitor module that is electrically connected to the card reader communication antenna to allow the card reader communication antenna to resonate at a predetermined frequency. The leadless capacitor module contains at least one passive component for storing electrical energy, wherein at least one passive component has a capacitance in the range from 40 picofarads to 140 picofarads and a main area that is less than 2.6 square millimeters.

The second tab does not require tuning of its antennas after the second tab is made. The second tab is also substantially small, allowing the fabrication of a stronger and heavier metal chip card.

In a special implementation where the IC card is a contactless IC card using direct plug technology, this second tab further contains the chip module. The chip module is electrically connected to the terminals of the antenna for communication with the card reader, so that the chip module can receive signals from the antenna to communicate with the card reader directly. The electrical connection may include a galvanic connection, but is not limited to a galvanic connection.

As for the first and second tabs, the passive component can have a capacitance in the range from 80 picofarads to 120 picofarads. This capacitance range is preferred to reduce the size and optimize the RF performance of the card reader antenna.

The leadless capacitor module of the first and second tabs may have a capacitance of approximately 100 picofarads (pF).

The first and second tabs may further comprise an antenna carrier sheet for accommodating the antennas of the tab and the leadless capacitor module.

The first and second tabs may also include a thickness compensation sheet that is provided adjacent to the carrier sheet for the antenna.

The first and second tabs may further comprise at least one overlay sheet that is provided adjacent to the thickness compensation sheet.

The first and second tabs may also comprise at least one overlay sheet that is provided adjacent to the carrier sheet for the antenna.

The passive component of the first and second tabs may be less than 0.3 millimeters thick.

The passive component of the first and second tabs may also be less than 0.6 millimeters thick.

The application also provides a method for obtaining an inlay using inductive coupling technology. The method includes the step of providing a carrier sheet for the antenna, followed by the step of providing a hole in the carrier sheet for the antenna by punching or milling. The hole is designed to install a leadless capacitor module. Then a leadless capacitor module is inserted into the hole. The electrical wire is subsequently laid on the antenna carrier sheet to form a module communication antenna and a card reader communication antenna such that the card reader communication antenna surrounds the leadless capacitor module. The leadless capacitor module is then electrically connected to an antenna for communication with the card reader. The leadless capacitor module includes at least one passive component for storing electrical energy. At least one passive component has a capacitance in the range of 40 picofarads to 140 picofarads and a base area of less than 2.6 square millimeters.

The application also provides a plastic insert for a plastic card with a dual interface chip using inductive coupling technology. This plastic chip card does not have a metal layer and does not have a hole that can be found in the body of a metal chip card. This chip card often consists of several layers of plastic layered on top of each other. An example of this chip card is a credit card.

This plastic tab contains an antenna for communication with the module for inductive communication with the antenna of the chip card chip module and an antenna for communication with the card reader for inductive communication with the antenna of the reader of the external card reader. The antenna for communication with the card reader is integrally connected with the antenna to communicate with the module. This plastic tab additionally contains a leadless capacitor module. The leadless capacitor module is electrically connected to the card reader communication antenna to allow the card reader communication antenna to resonate at a predetermined frequency. The leadless capacitor module contains at least one passive component for storing electrical energy. At least one passive component has a capacitance in the range of 40 picofarads to 140 picofarads and a base area of less than 2.6 square millimeters.

This plastic tab has an antenna that has a constant efficiency because the leadless capacitor module has a precise and constant capacitance. The antenna of this plastic tab does not require adjustment. This can reduce the manufacturing steps for a given plastic inlay and hence the cost of manufacturing a given plastic inlay.

In addition, this plastic insert has a large unused space because the leadless capacitor module is relatively small. Large whitespace can be used to enable additional features and design features that may not be available on other tabs with limited whitespace.

The passive component of the plastic insert may have a capacitance in the range of 80 pF to 120 pF. This capacitance range is preferred to reduce the size and optimize the RF performance of the card reader antenna.

In one implementation, the leadless capacitor module of this plastic insert has a capacitance of approximately 100 picofarads (pF).

An antenna for communication with a card reader of a given plastic inlay may comprise a plurality of substantially rectangular conductor loops that are located near the outer edges of this plastic inlay. The rectangular conductor loops may be substantially the same size as this plastic tab. The rectangular conductor loops may also be about half the size of a given plastic insert, or about two thirds the size of a given plastic insert.

The passive component of this plastic insert may be less than 0.3 millimeters thick.

The passive component of this plastic insert may also be less than 0.6 millimeters thick.

The leadless capacitor module may further comprise a metal substrate having a main inner surface on which the passive component is placed. The metal substrate further comprises a main outer surface opposite the inner surface. A unique visible feature is provided on the outer surface. This visible feature is often etched from the outer surface of the metal substrate. This unique visible feature can function as a security feature if it is placed so as to be visible to the card user so that the card user can distinguish a genuine IC card having this unique security feature from other IC cards that do not have the same security feature. .

Inside the plastic tab and the chip card, the leadless capacitor module can be placed in a transparent window so that the security element is visible.

In one implementation, the unique visible feature contains at least one element selected from the group consisting of text and drawing. An example of a drawing is a logo.

The application also provided a plastic card with a dual interface chip. This chip card consists of the above plastic tab and chip module with chip module antenna. This chip card additionally contains several pads that are electrically connected to the chip module. The chip module antenna is made with the possibility of inductive coupling with the antenna for communication with the plastic tab module.

This IC plastic card has an antenna that has a constant efficiency so that the antenna does not need to be tuned after manufacture.

The plastic chip card may further comprise a plurality of flat plastic sheets. The plastic sheets are placed on top of each other in such a way that the plastic insert is positioned between the plastic sheets. The plastic sheets contain a transparent part. The transparent part is adapted in such a way that the user can see through the transparent part a visible sign, which is provided on the main outer surface of the metal substrate of the leadless capacitor module of the plastic insert. The transparent portion allows the card user to use a visible feature to distinguish a genuine chip card having that visible feature from other chip cards not having the same visible feature.

The application also provides a tag tab for an electronic device that is powered by electrical energy. The label tab contains a chip module and an antenna for communication with the reader for inductive communication with the reader antenna of the external reader. The antenna for communication with the reader is electrically connected to the chip module. The label tab further comprises a leadless capacitor module that is electrically connected to the reader communication antenna to allow the reader communication antenna to resonate at a predetermined frequency. The leadless capacitor module contains at least one passive component for storing electrical energy. At least one passive component has a capacitance in the range of 40 picofarads to 140 picofarads and a major outer surface area of less than 2.6 square millimeters.

This tag tab has an antenna that has a constant efficiency so that the antenna does not need to be tuned before use. In addition, this label tab is small because the dimensions of the antenna for communication with the reader and the leadless capacitor module are also small. Thus, this tag tab is suitable for creating a small wireless tag.

The passive component of the tag tab can have a capacitance in the range of 80 picofarads to 120 picofarads. This capacitance range is preferred to reduce the size and optimize the RF performance of the antenna for communication with the reader.

The leadless label tab capacitor module may have a capacitance of approximately 100 picofarads (pF).

In one implementation, the passive label tab component is less than 0.3 millimeters thick. In another implementation, the passive component has a thickness of less than 0.6 millimeters.

The leadless label tab capacitor module may further comprise a metal substrate on which the passive component is placed. The metal substrate has a primary outer surface on which there is a visible indicia.

The visible feature may contain at least one element selected from the group consisting of text and a picture.

The application also provides a wearable electronic device, such as a wearable fitness bracelet. The wearable device contains the above label tab.

The application also provided an electronic data page for the passport. The electronic data page contains information about the passport user. The data page contains several plastic sheets and the aforementioned label tab. The plastic sheets are stacked on top of each other such that the tab is placed between the plastic sheets. The plastic sheets and tab include a transparent portion next to the leadless capacitor label tab module so that the user can see a visible feature of the label tab that is provided on the outer surface of the leadless capacitor module.

Figure 1 shows a top view of a dual interface smart card containing a tab that contains an antenna unit,

Figure 2 shows the dual interface smart card shown in Figure 1, wherein the smart card further comprises a contact interface and a smart card integrated circuit (IC) module with a chip module antenna that is inductively coupled to the antenna unit,

figure 3 shows a sectional view of a part of the tab of the smart card along the line AA shown in figure 1, and this part contains the antenna unit,

figure 4 shows the equivalent electrical circuit of the antenna unit, which is inductively coupled to the IC module of the smart card shown in figure 1,

5 is a plan view of a contactless smart card containing an inlay that contains a smart card IC module and an antenna unit electrically connected to the smart card IC module,

figure 6 shows the equivalent electrical circuit of the antenna unit of the smart card shown in figure 5,

Fig. 7 is a plan view of a dual interface smart card containing a tab that contains an antenna unit with two leads,

Fig. 8 is a plan view of the dual interface smart card shown in Fig. 7, wherein the smart card further comprises a contact interface and a smart card IC module that is electrically connected to the terminals of the antenna unit,

figure 9 shows a tab sheet with several antenna units shown in figure 1,

figure 10 shows a flowchart of the method for obtaining the tab sheet shown in figure 9,

Fig. 11 is a plan view of the dual interface smart card, which is a variant of the smart card shown in Fig. 1,

figure 12 shows the dimensions of the antenna unit of the smart card shown in figure 11,

figure 13 shows a comparison of the antenna unit shown in figure 12 and the antennas of other tabs,

14 shows a top view of a non-metallic smart card with two interfaces and a full-sized antenna unit,

15 shows a top view of another non-metallic smart card with two interfaces and a two-thirds antenna unit,

Fig. 16 is a top view of another non-metallic smart card with a dual interface and a half-size antenna unit,

Fig. 17 shows the non-metal smart card shown in Fig. 15 having a large unallocated space,

Fig.18 shows the first non-metallic smart card having an antenna unit located in the first position,

19 shows a second non-metallic smart card having an antenna unit located in a second position,

20 shows a third non-metal smart card having an antenna unit located in a third position, and

Fig.21 shows a fourth non-metallic smart card having an antenna unit located in the fourth position,

Fig.22 shows a leadless capacitor module of the antenna unit shown in Fig.21, while the leadless capacitor module contains a metal substrate on which a visible sign is etched,

23 shows a non-metallic contactless smart card containing an inlay that contains a smart card IC module and an antenna unit that is electrically connected to the smart card IC module,

Fig. 24 shows the first wireless tag tab for an electronic device,

Fig. 25 shows a second wireless label tab for a wireless device, which is a variant of the first wireless label tab shown in Fig. 24, and

FIG. 26 shows a third wireless label tab for a wireless device, which is a variation of the first wireless label tab shown in FIG.

The following description provides details for describing embodiments of the present invention. However, it should be obvious to one skilled in the art that the embodiments may be practiced without such details.

Some parts of the embodiments have similar parts. Like parts may have like names or like part numbers with an alphabetic character. The description of one such part is also applied by referring to another similar part where appropriate, thereby reducing text repetition without limiting the present invention.

Figures 1 and 2 show a dual interface smart card 1 using inductive coupling technology. The smart card 1 is configured to wirelessly connect to an external or remote card acceptor, such as a card reader.

The smart card 1 comprises a card body 4, a smart card integrated circuit (IC) module 10, an inductive coupling tab 13, and a contact interface 78. As best seen in FIG. 2, the smart card IC module 10 is electrically connected to the contact interface 78 and inductively coupled to tab 13.

The card body 4 is made of a layer of metal having a substantially rectangular shape. The metal body 4 has a hole 7 and a slot 17 that extends from the hole 7 to the outer edge of the metal body 4. The tab 13 of the inductive coupling is placed in the hole 7.

The opening 7 of the metal body 4 includes a communication cutout part 20 and an antenna cutout part 23 which is connected to the communication cutout part 20 . The communication cutout portion 20 is connected to the end of the slot 17. In this example, the communication cutout portion 20 is substantially rectangular in shape, while the antenna cutout portion 23 is in the form of a truncated circle with a straight edge. The straight edge is connected to the rectangular portion 20 of the communication cutout.

The smart card IC module 10 includes an IC chip 27 and an antenna 29 of the chip module. The chip module antenna 29 is electrically connected to the output pads of the microelectronic chip 27. The chip module antenna 29 refers to a metal etched antenna having one or more coils or coils.

The tab 13 includes an antenna unit 32, an antenna support sheet 35, a thickness compensation sheet 37, and a top layer sheet 40. The antenna unit 32, the antenna carrier sheet 35, the thickness compensation sheet 37, and the top layer sheet 40 are best seen in FIG. The antenna unit 32 is built into the antenna carrier sheet 35 which is placed between the thickness compensation sheet 37 and the top layer sheet 40 . The carrier sheet 35 for the antenna is also referred to as a substrate. In one implementation, the antenna carrier sheet 35 has a thickness of approximately 150 micrometers (µm), the thickness compensation sheet 37 has a thickness of 200 µm, and the top layer sheet 40 has a thickness of approximately 50 µm.

In another embodiment, the tab 13 further comprises a first plastic sheet that is placed next to the overlay sheet 40 and a second plastic sheet that is placed next to the thickness compensation sheet 37 .

The antenna unit 32 includes an antenna 43 for communicating with the module, an antenna 47 for communicating with the card reader, and a leadless capacitor module 50. The antenna 47 for communicating with the card reader is electrically or integrally connected to the antenna 43 for communicating with the module. The card reader communication antenna 47 is also electrically connected to the leadless capacitor module 50. The module communication antenna 43 is inductively coupled to the chip module antenna 29 .

The antenna 43 for communication with the module is located in the part 20 of the communication cutout of the hole 7. The antenna 47 for communication with the card reader is located in the part 23 of the cutout for the antenna of the hole 7.

The module communication antenna 43 and the card reader communication antenna 47 are formed using an electric wire. The electrical wire may be copper, aluminum, silver, or an alloy of at least two of aluminum, silver, or copper. The electrical wire can be insulated with varnish.

Antenna 43 for communication with the module is a frame containing one or more turns of electrical wire. In this example, the frame has a substantially rectangular shape that is smaller than the rectangular bond cutout portion 20 . In other words, the frame is separated from the edges of the bond cut portion 20 by a gap.

Antenna 47 for communication with the card reader is also a frame containing one or more turns of electrical wire. In this example, the frame has a substantially circular shape, which is smaller than the frusto-circular antenna cutout portion 23. In other words, the circular frame is separated from the arcs of the antenna cutout portion 23 by a gap. The circular frame contains two electrical wire terminals that are located near the center of the circular frame.

The leadless capacitor module 50 is galvanically connected to the two terminals of the card reader communication antenna 47, so that the module communication antenna 43, the card reader communication antenna 47, and the leadless capacitor module 50 are connected in series to form an electrical circuit. Galvanic connection can be made using thermocompression bonding, conductive adhesive or soldering.

The leadless capacitor module 50 includes a metal substrate with a discrete ceramic capacitor and a plastic shell enclosing the ceramic capacitor substrate. The plastic package can be provided as a surface mount device (SMD) shell or a printed circuit board (COB) chip shell that consists of one or more layers of resin. A ceramic capacitor typically contains at least two electrical conductors separated by a ceramic dielectric layer.

In one implementation, leadless capacitor module 50 is approximately 8 mm long and approximately 5 mm wide, and includes a ceramic capacitor shaped like a rectangular block approximately 0.4 mm long, approximately 0.2 mm wide, and approximately 0.2 mm thick, i.e. less 0.3 mm. The ceramic capacitor has a capacitance of 100 picofarads (pF) with a tolerance of +- 5 pF.

In another implementation, the leadless capacitor module 50 includes only a ceramic capacitor that is galvanically coupled to the ends of antenna 47 for communication with the card reader. This ceramic capacitor is shaped like a rectangular block approximately 1.6 mm long, approximately 0.8 mm wide, and 0.5 mm, i.e. less than 0.6 mm. This ceramic capacitor has a capacitance of 100 pF with a tolerance of + - 5 pF.

FIG. 4 shows an equivalent circuit diagram of antenna unit 32. Antenna unit 32 is a resonant circuit that is configured to resonate at a predetermined frequency at which the efficiency or RF performance of antenna unit 32 is optimized or maximized. The resonant frequency is approximately 13.56 megahertz (MHz). The resonant frequency is mainly related to the inductance and capacitance of the antenna unit 32. The inductance of the antenna unit 32 depends on the size of the antenna unit 32. The capacitance of the antenna unit 32 is essentially limited by the capacitance of the leadless capacitor module 50, which is indicated by the symbol "Cext" in Fig.4.

At resonant frequency, the inductance impedance of the antenna unit 32 is substantially equal to the capacitance of the leadless capacitor module 50. The relationship between the capacitance impedance and the inductance impedance can be expressed according to the following equation:

where Cext is the capacitance of the leadless capacitor module,

L is the inductance of the antenna unit and

fres - resonant frequency.

This means that the inductance of the antenna unit 32 is inversely proportional to the capacitance of the leadless capacitor module 50. The smaller the inductance, the greater the capacitance, and vice versa. more. The smaller the inductance, the fewer turns of electrical wire are needed to form an antenna, and hence the size of the antenna is smaller.

Because the ceramic capacitor of the leadless capacitor module 50 is relatively small in size, even if its capacitance is relatively large, the leadless capacitor module 50 occupies only a small portion of the space occupied by the tab 13. Therefore, the antenna unit 32 can be made relatively small, having a small inductance and a large capacity. The size of the hole 7 in the metal body 4 can be reduced, thereby increasing the size of the metal part of the card body 4.

However, if the inductance of the antenna unit 32 is too low, sufficient RF energy cannot be induced in the antenna unit 32 to power the smart card 1 electronics. On the other hand, the capacitance of the leadless capacitor module 50 should preferably be as large as possible in order to minimize the size of the hole 7. Therefore, the capacitance cannot be less than a predetermined lower value.

It has been estimated that the ceramic capacitor of the leadless capacitor module 50 can be selected such that its capacitance is in the range of 40 picofarads (pF) to 140 pF. The capacitance of the leadless capacitor module 50 is substantially the same as the capacitance of the ceramic capacitor.

For the more optimized antenna unit 32, the ceramic capacitor is preferably chosen to have a capacitance in the range of 80 picofarads to 120 pF. The lower limit of the capacitance range is increased to reduce the size of the antenna unit 32 in order to reduce the hole 7 in the metal body 4. The upper limit of the capacitance range is reduced to improve the RF performance of the antenna unit 32.

In one implementation, the leadless capacitor module 50 has a capacitance of 100 pF with a tolerance of +- 5 pF. The antenna unit 32 with this leadless capacitor module 50 has optimum RF performance and ensures that the hole 7 in the metal body 4 becomes substantially small.

In use, the card reader communication antenna 47 is used for inductive coupling with the reader antenna of the external card reader. The card reader transmits radio signals at a resonant frequency to the card reader communication antenna 47. Then, the card reader communication antenna 47 receives signals and transmits the received signals to the antenna 43 for communication with the module. The antenna 43 for communicating with the module subsequently receives the signals, and transmits the received signals to the antenna 29 of the chip module 29 of the smart card IC module 10 by inductive coupling. The IC module antenna 29 then transmits the received signals to the IC chip 27 of the smart card IC module 10 . The chip 27 then converts the radio signals into electrical signals to power the chip 27 and/or to process the electrical signals.

Similarly, the chip 27 converts data into radio signals for transmission to the chip module antenna 29, to the module communication antenna 43, to the card reader communication antenna 47, to the card reader antenna, and to the card reader for processing.

The slot 17 has the function of removing any conductive loop around the hole 7 in the metal body 4, thereby preventing the flow of eddy currents in the closed loop surrounding the hole 7 in the metal body 4. This ensures that there is sufficient magnetic field strength for the operation of the antenna unit 32 of the tab 13 .

Contact interface 78 complies with International Organization for Standardization (ISO)/International Electrotechnical Commission (IEC) standard 7816. Contact interface 78 includes a plurality of contact pads that are electrically connected to the microelectronic chip 27. The contact pads are configured to touch the contact pins of the card reader when indoors. smart card 1 into the card reader. The contact performs the function of electrically connecting the microelectronic chip 27 to the card reader to ensure the transfer of power and data between the card reader and the microelectronic chip 27.

Figure 5 shows a contactless smart card 1b using direct plug technology. The smart card 1b is a variant of the smart card 1. The smart card 1b contains parts that are similar to the corresponding parts of the smart card 1 in terms of layout and functional relationships.

Briefly, the contactless smart card 1b comprises a metal body 4b with an opening 7b and a direct connection tab 13b. Tab 13b is located in hole 7b.

The direct connection tab 13b is different from the inductive coupling tab 13 of the smart card 1. Specifically, the tab 13b includes an IC chip 27b, a card reader communication antenna 47b, and a leadless capacitor module 50b. The leadless capacitor module 50b is electrically connected to the card reader communication antenna 47b, which is also electrically connected to the chip 27b. The equivalent electrical circuit of tab 13b is shown in FIG. The leadless capacitor module 50b may be provided in a COB shell whose dimensions are similar to those of the chip 27b, so that the leadless capacitor module 50b and the chip 27b can be similarly processed using the same equipment during production.

7 and 8 show a dual interface smart card 1c using direct plug technology. The smart card 1c is another version of the smart card 1. Parts of the smart card 1c and parts of the dual interface smart card 1 have similar arrangements and functional relationships.

Briefly, the dual interface smart card 1c includes a metal body 4c with a hole 7c, a microelectronic chip 27c, a direct connection tab 13c, and a contact interface 78c. The microelectronic chip 27c and the contact interface 78c are shown in FIG. Tab 13c is located in hole 7c. The microelectronic chip 27c is electrically connected to the insert 13c and the contact interface 78c.

This direct connect tab 13c includes an antenna 47c for communication with the card reader and a leadless capacitor module 50c that is electrically connected to the antenna 47c for communication with the card reader. crystal 27c, which is not part of tab 13c.

FIG. 9 shows an inlay sheet 53 containing multiple card transponders, each transponder being similar to the dual interface smart card 1 antenna unit 32 above. The card transponders are arranged in a matrix. Sheet 53 tabs receive according to the method described below.

Figure 10 shows a flowchart 60 of a method for obtaining a sheet 53 of the tab.

The method includes the step 62 of providing a carrier sheet 35 for the antenna.

Thereafter, the antenna carrier sheet 35 is milled, cut, or perforated to provide the antenna carrier sheet 35 with a plurality of holes at predetermined positions. Each hole is designed to accept a 50 leadless capacitor module.

Then, an adhesive tape is placed next to the antenna carrier sheet 35 so that the antenna carrier sheet 35 is attached to the adhesive layer of the adhesive tape.

The antenna carrier sheet 35 is subsequently placed on the support surface, with the adhesive tape resting on the support surface. This is to allow easy placement of the leadless capacitor modules 50 in the openings of the antenna carrier sheet 35 .

The leadless capacitor modules 50, which are obtained separately, are then respectively inserted into the respective holes, with the leadless capacitor module 50 attached to the adhesive tape in step 64.

Subsequently, a plurality of electrical wires are respectively laid on the antenna support sheet 35 to form an antenna 43 for communication with the module and an antenna 47 for communication with the card reader of each antenna unit 32. The antenna 47 for communication with the card reader of each antenna unit 32 surrounds a respective leadless capacitor module 50. The electrical wires are attached to the antenna support sheet 35 by terminating in step 66. Then, in the next step 68, the electrical wires are connected to the leadless capacitor modules 50, for example, by means of a galvanic connection.

Then, a thickness compensation sheet 37 is placed over the antenna support sheet 35 so that the thickness compensation sheet 37 presses the tops of the leadless capacitor modules 50 and the electrical wires in step 70.

Thereafter, the adhesive tape is removed from the carrier sheet 35 for the antenna.

Thereafter, a top layer sheet 40 is provided under the antenna carrier sheet 35 . The top layer sheet 40 touches the antenna carrier sheet 35 at step 72.

Then, thereafter, the top layer sheet 40, the antenna carrier sheet 35, and the thickness compensation sheet 37 are laminated, and these sheets are pressed together to form an inlay sheet 53 in step 74.

The method may include the additional step of providing a first plastic sheet adjacent to the top sheet 40 . The first plastic sheet then comes into contact with the sheet 40 of the upper layer.

The method may also include another additional step of providing a second plastic sheet adjacent to the thickness compensation sheet 37 . Then, the first plastic sheet comes into contact with the thickness compensation sheet 37 .

Various implementations of antenna units 32, 32b and 32c are possible. Leadless capacitor module 50, 50b and 50c may include two or more discrete capacitors in parallel. The leadless capacitor module 50, 50b and 50c can be any discrete capacitor that can be provided in the shell. The discrete capacitor may also be electrically connected directly to the antennas 47, 47b and 47c for communication with the card reader of the antenna unit 32, 32b and 32c.

Tab 13, 13b and 13c may contain a different number of layers that are located on top of each other. The parts of the tab 13, 13b and 13c can also be positioned differently to simplify the manufacturing process.

The opening 7, 7b and 7c of the metal body 4, 4b and 4c may have different geometries. In one implementation, the hole communication cutout portion is square in shape, while the antenna cutout portion is rectangular in shape.

Another embodiment is shown in Fig. 11, which shows a dual interface smart card 1d having a different shaped hole 7d. The hole 7d includes a communication cutout part 20d and an antenna cutout part 23d, which is connected to the communication cutout part 20d. The size of the antenna cutout part 23d is substantially the same as the size of the antenna cutout part 23 of the above smart card 1. The communication cutout part 20d includes a rectangular part 20d1 and a triangular part 20d2. The rectangular portion 20d1 is connected to the antenna cutout portion 23d. The base of the triangular part 20d2 is connected to the rectangular part 20d1, while the truncated top, which is opposite the base of the triangular part 20d2, touches the outer edge of the metal body 4d. The truncated top portion of the notch functions as the slot for the smart card 1 described above.

The smart card 1d further comprises an inductive coupling tab 13d which is similar to the other inductive coupling tab 13 and 13a above.

Briefly, the inductive coupling tab 13d includes an antenna assembly 32d which includes an antenna 43d for communicating with the module, an antenna 47d for communicating with the card reader, and a leadless capacitor module 50d.

In FIG. 12, it is better seen that the antenna 43d for communication with the module has a rectangular shape, having a length of approximately 15 millimeters (mm) and a width of approximately 11.62 mm, while the antenna 47d for communication with the card reader has a circular shape with a diameter approximately 25 mm. The antenna 47d for communication with the card reader is integrally connected to the antenna 43d for communication with the module via insulated conductors. A leadless capacitor module 50d is connected to two leads of a card reader communication antenna 47d, with the leads located in the interior of a circular card reader antenna 47d. . The antenna unit 32d covers an area of approximately 754 square millimeters (mm2), including the areas occupied by the two antennas 43d and 47d and the space occupied by the insulated conductors that are placed between the antenna 43d for communication with the module and the antenna 47d for communication with the card reader.

Compared to the outer loop antenna of the other tab of the inductive coupling card, the size of the antenna unit 32d is substantially smaller. The antenna unit 32d occupies an area of approximately 754 mm2, while the loop antenna of another map tab may occupy an area of more than 2800 mm2, as shown in FIG. This is because the other tab of the inductive coupling card often has a resonant capacitor with a small capacitance. The resonant capacitor is composed of insulated conductors or insulated layers with etched metal, which are parallel to each other, and it is difficult to make such a resonant capacitor with a large capacitance. Thus, to form an LC resonant circuit that operates at a given resonant frequency of approximately 13.56 megahertz, a large, high inductance antenna is required.

Therefore, the openings of the smart cards 1 and 1d for accommodating the inductive coupling tabs are small. Therefore, the smart cards 1 and 1d, respectively, have a large metal portion compared to other metal cards. Therefore, these smart cards are heavier.

These smart cards 1 and 1d are not easy to bend because they have more metal and require more bending force. In addition, the connection area between the metal part and the plastic sheet covering the body of the metal card is large, which makes the card more mechanically stable and rigid.

Thus, advanced contactless smart cards and dual interface smart cards provide several advantages.

The advanced inlay leadless capacitor module, which is obtained externally for inlay assembly, has a constant and accurate capacitance, allowing the inlay antenna to have a constant efficiency without having to adjust the antenna after inlay assembly. This reduces the overall cost of making inlays.

The leadless capacitor module also precludes the use of internal capacitance structures in other tabs where the conductive antennas and internal capacitance structures are fabricated using insulated conductors or where the etched antennas and internal capacitance structures are fabricated using multiple insulated layers with etched metal. Internal capacitive structures are made by laying conductors in parallel or by arranging metal layers separated by a dielectric sheet, one above the other. Such an internal capacitive structure often takes up more space. In addition, the formation of a conductor capacitor often requires high-precision conductor termination equipment operating at a slower speed for high-precision conductor placement.

In addition, the advanced tab is small in size. It also reduces the size of the smart card opening that houses the enhanced tab. Thus, the metal part of the smart card can become larger, which allows the smart card to be stronger and heavier, and to create a more exclusive and upmarket feel for the card user.

The use of an external leadless capacitor module also increases the efficiency of the advanced smart card. This makes it easy to certify an advanced smart card for certain RF specifications that are required for cards that will be used for banking and government transactions, for example.

In addition, the use of discrete capacitors allows the smart card manufacturer to use standard smart card ICs that are also used for non-metal cards, simplifying inventory management.

The application also provides a dual-interface non-metallic smart card 100 with a full-length antenna, as shown in FIG. Card 100 does not have a hole metal layer. Instead, it is made of plastic.

Card 100 contains tab 113, several flat plastic sheets, and several electronic modules.

The tab 113 and the flat sheets are substantially the same rectangular shape. The tab 113 and the flat sheets are placed on top of each other with the outer edge of the tab 113 placed adjacent to the outer edges of the flat sheets. Tab 113 is located between the flat sheets. The electronic modules are built into the flat sheets and the insert 113. Since parts of the card 100 are known in the art, only some of the parts will be described for simplicity.

Tab 113 includes a loop antenna unit 132 that is inductively coupled to smart card IC module 110 100, which is an electronic module embedded in flat sheets. The smart card IC module 110 may include a microelectronic chip with a chip module antenna. The microelectronic chip is electrically connected to several pads of the contact interface, which is another electronic module of the card 100 built into flat sheets. In one implementation, the smart card IC module 110 includes a first chip with a chip module antenna and a second chip that is electrically connected to the pads.

The loop antenna unit 132 includes a module communication antenna portion 143, a card reader communication antenna portion 147, and a leadless capacitor module 150. The card reader communication antenna portion 147 is electrically or integrally connected to the module communication antenna portion 143. The module communication antenna portion 143 is disposed adjacent the smart card IC module 110 for inductively coupling with the chip module antenna of the smart card IC module 110 . The antenna portion 147 for communicating with the card reader is made of an electrical wire forming one or more loops forming a substantially rectangular shape. The rectangle has an area that covers substantially the entire main surface of the card body. The antenna portion 147 for communicating with the card reader has two terminals that are connected to the leadless capacitor module 150.

The leadless capacitor module 150 is similar to the leadless capacitor module 50 above. Briefly, the leadless capacitor module 150 functions as a resonant capacitor having a capacitance that allows the loop antenna assembly 132 to resonate at a predetermined frequency of approximately 13.56 megahertz, so that the antenna portion 147 for connection to the card reader may be inductively coupled to the reader antenna of the external card reader.

15 shows another card 100a, which is a variant of card 100 with a two-thirds antenna. The card 100a has parts that are similar to those of the card 100, have similar functions, and have a similar construction. Unlike the card reader communication antenna portion 147 of the card 100, the card reader communication antenna portion 147a of the card 100a has a substantially rectangular shape. The rectangle is located near the long outer edge and the two short outer edges of the card so that it covers approximately two-thirds of the main surface of the card body.

FIG. 16 shows another card 100b, which is a variant of card 100 with a half-size antenna. The card 100a has parts that are similar to those of the card 100, have similar functions, and have a similar construction. Unlike the card reader communication antenna portion 147 of the card 100, the card reader communication antenna portion 147b of the card 100b has a substantially rectangular shape. The rectangle is positioned near the long outer edge and the two short outer edges of the card so that it covers approximately half of the main surface of the card body.

For both cards 100a and 100b, the area of the card body that is outside the rectangular antenna can be used for embossing, thereby allowing more design features to be included in the card to attract the attention of card users.

These non-metallic smart cards 100, 100a and 100b provide several benefits.

The leadless capacitor module has an accurate and constant capacitance which allows the inlay loop antenna assembly to have a constant efficiency without having to adjust the loop antenna assembly after the inlays are assembled. This can reduce the overall cost of making inlays.

In addition, the leadless capacitor module is small in size and has a large capacitance, which makes the loop antenna unit relatively small. Thus, the loop antenna unit takes up little space in the tab. This allows the map tab to have a lot of unallocated space. The unallocated space can be used to add additional functionality or design features that other plastic cards may not have due to limited space. An example of a smart card having a large unallocated space 160 is shown in FIG. Space 160 may be used to house one or more electronic modules that may be electrically connected to antenna 147b for communication with a card reader. The electronic modules may also be connected to a smart card battery.

The electronic modules may include a light source containing multiple light-emitting diodes (LEDs) to illuminate an image such as a card logo, a biometric fingerprint sensor to read the fingerprint pattern of the card user, a card dynamic cryptographic value (dCVV) checker to generate a unique number for card authentication , used for each payment transaction, while the generated numbers are different for different transactions, an organic light-emitting diode (OLED) display for displaying smart card information, and a pin code input device for receiving a personal identification number (PIN) from a card user. Each electronic module can be placed in a predetermined location according to the user's requirements. These additional functional and design features can make the cards more attractive to a wide variety of card users.

Loop antenna unit 132 may be of various sizes and shapes according to user requirements. It is small and can occupy a small space of the tab 113, as shown in Fig.18, 19, 20 and 21, while the tab 113 has a large unoccupied space 160. The space 160 can be used to accommodate the above electronic modules. The space 160 may also be partially or completely covered with a transparent plastic material during manufacture of the smart card. The transparent portion of the smart card may be combined with other smart card design features to improve the aesthetic appearance of the smart card.

A transparent portion of the smart card may be provided so that the card user can view the unique feature embedded in the smart card. The unique feature may be text and/or a drawing, such as a logo. The unique feature is often etched into the base surface of the leadless capacitor module's metal substrate. An example of a unique feature is shown in FIG. 22, which shows a smart card 100 having a leadless capacitor module 150 containing a metal substrate. The metal backing has etched text and/or graphics. The drawing may contain fold lines. This feature can be seen through the transparent portion 165 of the smart card 100 which is adjacent to the leadless capacitor module 150. The unique visible feature is difficult to reproduce because it is built into the smart card. This unique visible feature can function as a security feature that can be easily recognized to distinguish a genuine smart card having this unique security feature from other smart cards that do not have the same security feature.

FIG. 23 shows another plastic contactless smart card 100 using direct plug technology. The card 100 includes an inlay 113. The inlay 113 includes an antenna assembly 132 including an antenna 147 for communicating with a card reader, a leadless capacitor module 150, and a smart card IC module 110. The card reader communication antenna 147 is electrically connected to the leadless capacitor module 150 and the smart card IC module 110. The leadless capacitor module 150 is also electrically connected to the smart card IC module 110 in parallel. Leadless capacitor module 150 includes a discrete ceramic capacitor.

The leadless capacitor module 150 increases the effective capacitance of the antenna unit 132 for applications that require the antenna unit 132 to have a higher capacitance. Such applications include negotiating with the card reader infrastructure when an ISO size smart card does not provide satisfactory RF performance due to the small internal capacitance of a standard smart card IC module. The standard internal capacitance is often around 17pF. In order to match the RF performance, an ISO size smart card is often manufactured with a special smart card IC module having a higher internal capacitance, for example, approximately 70 pF. However, this special smart card IC module is much more expensive than the combined cost of a standard smart card IC module and a leadless capacitor module. Embedding a leadless capacitor module in an ISO size smart card avoids the use of a special smart card IC module, thereby reducing the production cost of an ISO size smart card. In addition, the standard smart card IC module is often readily available, and this can lead to a reduction in lead time and inventory management costs for standard smart card IC modules.

The application also provides a wireless tag containing a tag tab.

FIG. 24 shows the first tag tab 213 for a wireless tag. The wireless tag may be embedded in or attached to a portable electronic device such as a key fob or wearable electronic device. A key fob is a small security device with built-in authentication to control and protect access to, for example, mobile devices, computer systems, network services, and data. A wearable device refers, for example, to an electronic device that can be worn as an accessory or embedded in clothing.

The first tag tab 213 includes an antenna unit 232. Antenna unit 232 includes an antenna 247 for communication with the tag reader, a leadless capacitor module 250, and a tag integrated circuit (IC) module 210. The tag reader communication antenna 247 is electrically connected to the leadless capacitor module 250 and the tag IC module 210. The leadless capacitor module 250 is also electrically connected to the tag smart card IC module 210 in parallel. The leadless capacitor module 250 is also similar to the leadless capacitor module 150 of the non-metal dual interface smart card 100 mentioned above. The tag IC module 210 contains a microelectronic chip. The antenna 247 for communication with the tag reader has several coils that form a substantially square shape.

FIG. 25 shows a second tag tab 213 for a wireless tag. The second label tab 213 contains parts that are similar to the corresponding parts of the first label tab 213 in terms of layout and functional relationships. The antenna 247 for communication with the tag reader of the second tab 213 has several turns that form a substantially circular shape.

FIG. 26 shows a third tag tab 213 for a wireless tag. The third label tab 213 contains parts that are similar to the corresponding parts of the first label tab 213 in terms of layout and functional relationships. The antenna 247 for communication with the tag reader of the third insert 213 has several coils that form a substantially rectangular shape.

The application also provides a page of electronic data of the passport. The passport's electronic data page contains several plastic sheets and the label tab 213 mentioned above. The plastic sheets are stacked on top of each other such that the tab 213 is positioned between the plastic sheets. The plastic sheet package and tab 213 contain a transparent portion that is located adjacent to the leadless capacitor module 250 of tab 213.

Leadless capacitor module 250 includes a metal substrate and a discrete capacitor that is attached to the main inner surface of the metal substrate. The metal substrate has a major outer surface opposite to the inner surface of the metal substrate. The outer surface has a unique visible feature containing text and/or a drawing.

The transparent part allows a person to see a unique feature that functions as a security feature to determine the authenticity of the passport.

The size and shape of the antenna 247 for communication with the tag reader in the tag tab 213 can be changed according to the user's requirements.

While the description above is highly specific, it should not be construed as limiting the scope of the embodiments, but merely as providing an explanation of the intended embodiments. The advantages of the embodiments presented above are not to be construed as limiting the scope of the embodiments, but as simply clarifying the likely results when the described embodiments are put into practice. Thus, the scope of the embodiments is to be determined by the claims and their equivalents, and not by the examples given.

Position numbers

1 - smart card

1b - smart card

1c - smart card

1d - smart card

4 - card body

4b - card body

4c - card body

4d - card body

7 - hole

7b - hole

7c - hole

7d - hole

10 - smart card IC module

10b - smart card IC module

10c - smart card IC module

13 - insert

13b - insert

13c - insert

13d - insert

17 - slot

17b - slot

17c - slot

20 - part of the cutout for communication

20b - part of the connection cutout

20c - part of cutout for connection

20d - part of the cutout for communication

20d1 - rectangular part of the cutout for communication

20d2 - triangular part of the cutout part for communication

23 - part of the cutout for the antenna

23b - part of the cutout for the antenna

23c - part of the cutout for the antenna

23d - part of the cutout for the antenna

27 - microelectronic crystal

27b - microelectronic crystal

27c - microelectronic crystal

29 - chip module antenna

32 - antenna unit

32b - antenna unit

32c - antenna unit

32d - antenna unit

35 - carrier sheet for the antenna

37 - thickness compensation sheet

40 - top layer sheet

43 - antenna for communication with the module

43d - antenna for communication with the module

47 - antenna for communication with a card reader

47b - antenna for communication with a card reader

47c - antenna for communication with a card reader

47d - antenna for communication with a card reader

50 - leadless capacitor module

50b - leadless capacitor module

50c - leadless capacitor module

50d - leadless capacitor module

53 - insert sheet

60 - block diagram

62 - stage

64 - stage

66 - stage

68 - stage

70 - stage

72 - stage

74 - stage

78 - pin interface

78c - contact interface

100 - smart card

100a - smart card

100b - smart card

110 - smart card IC module

110a - smart card IC module

110b - smart card IC module

113 - insert

113a - insert

113b - insert

132 - antenna unit

132a - antenna unit

132b - antenna unit

143 - antenna for communication with the module

143a - antenna for communication with the module

143b - antenna for communication with the module

147 - antenna for communication with a card reader

147a - antenna for communication with a card reader

147b - antenna for communication with a card reader

150 - leadless capacitor module

150a - leadless capacitor module

150b - leadless capacitor module

160 - space

165 - transparent part

210 - tag integrated circuit module

213 - insert

232 - antenna unit

247 - antenna for communication with the tag reader

250 - leadless capacitor module

Claims (42)

1. A chip card containing: - a metal layer containing a hole that extends to the outer edge of the metal layer, - a microcircuit module containing the antenna of the microcircuit module, - a contact interface electrically connected to the chip module for electrically connecting the chip module to the external card reader when placing the chip card in the external card reader, and - a tab placed in the hole, and the tab contains: - an antenna for communication with the module for inductive communication with the antenna of the chip module, - an antenna for communication with the card reader for inductive communication with the antenna of the reader of the external card reader, while the antenna for communication with the card reader is electrically connected to the antenna for communication with the module, and a leadless capacitor module that is electrically connected to the card reader communication antenna to allow the card reader communication antenna to resonate at a predetermined frequency, moreover, the leadless capacitor module contains at least one passive component for storing electrical energy, and wherein at least one passive component has a capacitance in the range of 40 to 140 picofarads and a base area of less than 2.6 square millimeters. 2. A chip card according to claim 1, characterized in that at least one passive component has a capacitance in the range from 80 to 120 picofarads. 3. A chip card according to claim 1 or 2, characterized in that at least one passive component has a thickness of less than 0.3 millimeters. 4. A chip card according to claim 1 or 2, characterized in that at least one passive component has a thickness of less than 0.6 millimeters. 5. A microchip card according to any one of the preceding claims, characterized in that the contact interface contains several pads that are electrically connected to the microchip module. 6. An IC card according to any one of the preceding claims, characterized in that the leadless capacitor module has a capacitance of approximately 100 picofarads (pF). 7. Tab for a card with a microcircuit, while the tab contains - an antenna for communication with the module for inductive communication with the antenna of the chip module of the chip card chip module, - an antenna for communication with the card reader for inductive communication with the antenna of the reader of the external card reader, while the antenna for communication with the card reader is electrically connected to the antenna for communication with the module, and a leadless capacitor module that is electrically connected to the card reader communication antenna to allow the card reader communication antenna to resonate at a predetermined frequency, moreover, the leadless capacitor module contains at least one passive component for storing electrical energy, and wherein at least one passive component has a capacitance in the range of 40 to 140 picofarads and a base area of less than 2.6 square millimeters. 8. The tab according to claim 7, characterized in that at least one passive component has a capacitance in the range from 80 to 120 picofarads. 9. An inlay according to claim 7 or 8, characterized in that the leadless capacitor module has a capacitance of approximately 100 picofarads (pF). 10. Tab according to any one of paragraphs. 7-9, characterized in that at least one passive component has a thickness of less than 0.3 millimeters. 11. Tab according to any one of paragraphs. 7-9, characterized in that at least one passive component has a thickness of less than 0.6 mm. 12. Tab according to any one of paragraphs. 7-11, characterized in that the antenna for communication with the card reader contains several conductor circuits, which are located near the outer edges of the tab. 13. Tab according to any one of paragraphs. 7-12, characterized in that the leadless capacitor module further comprises a metal substrate on which a visible sign is provided. 14. Tab according to claim 13, characterized in that the visible feature contains at least one element selected from the group consisting of text and a picture. 15. A card with a microcircuit, containing: - a tab according to any one of paragraphs. 7-14, - chip module with chip module antenna, and - several pads that are electrically connected to the chip module, at the same time, the antenna of the microcircuit module is adapted for inductive coupling with the antenna for communication with the tab module. 16. A card with a microcircuit according to claim 15, characterized in that it additionally contains several plastic sheets that are placed on top of each other in such a way that the tab is placed between the plastic sheets, while the plastic sheets contain a transparent part that allows the user to see a visible sign that provided on the leadless capacitor module of the tab. 17. A method for obtaining a tab, including: - providing a carrier sheet for the antenna, - providing the carrier sheet for the antenna with a hole for accommodating a leadless capacitor module, - inserting a leadless capacitor module into the hole, laying the electrical wire on the carrier sheet for the antenna to form an antenna for communication with the module and an antenna for communication with the card reader such that the antenna for communication with the card reader surrounds the leadless capacitor module, and - electrical connection of the leadless capacitor module with an antenna for communication with the card reader, moreover, the leadless capacitor module contains at least one passive component for storing electrical energy, and wherein at least one passive component has a capacitance in the range of 40 to 140 picofarads and a base area of less than 2.6 square millimeters.

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