RU2746065C1 - Multi-service transportation platform casing - Google Patents

Abstract

FIELD: transport platforms.

SUBSTANCE: invention relates to the body of a multiservice transport platform. The aforementioned technical result is achieved by the fact that the housing of the multiservice transport platform contains walls (3,4), while the side walls (4) are made with perforations (5), the backplane board (6), located parallel to the rear wall and at a distance from it, cavities for placing electronic components (8), fan units (9), each of which is installed along the corresponding side wall (4); in the space between the rear wall and the backplane board (6) on both sides (4) of the housing, in addition to the fan blocks (9), additional fans (10) and a figured element (11) are symmetrically installed to each other, in the lower part of the backplane board (6) through holes (12) are made.

EFFECT: technical result is to increase the efficiency of forced fan cooling of electronic components located inside the housing of the multiservice transport platform.

5 cl, 6 dwg

Description

The invention is claimed - the case of a multiservice transport platform, the constructive solution of which provides a certain way of removing heat from the device.

This invention relates to communication means and is intended to remove heat from a device in which modular-interface units of backbone communication networks are located, allowing, for example, to organize networks based on OTN technologies (Optical Transport Network - optical transport networks), DWDM (Dense Wavelength- Division Multiplexing-Dense Wavelength Division Multiplexing).

In the process of operation, any electronic device generates heat and heats up, in connection with which in the modern world the issue of cooling communication equipment located inside premises, electrical and / or server cabinets, the so-called external and internal cooling, is quite acute. An external cooling system ensures that the devices can be used in well-ventilated areas at an appropriate temperature. The internal heat dissipation system in modern equipment is designed in such a way as to ensure cooling of all internal components that generate heat during operation. There are various studies to create effective cooling for communication devices. Manufacturers install their own cooling system and integrate it into their equipment for versatility.

At this time, several technical solutions are known for the problems of heat removal from communication devices.

Known patent for the invention "Installation of an electronic circuit board and a method of close stacking of boards and cooling of the same" (US patent US 5991163, IPC H05K 7/10, publication date 11/23/1999, other patent numbers: CA 2350135 A1, EP 1166607 A1, WO 2000030421 A1), which discusses a design for mounting boards, allowing the installation of working electronic boards strictly vertically, while the upper and lower walls of the structure are perforated, allowing air to enter freely. Cooling air flows from bottom to top through the entire structure.

The disadvantage of this technical solution is the vertical direction of the free passage of cooling air through the structure, since the lower and upper walls may not have open access to the cooling air or it may be limited, which will lead to the absence or limitation of the cooling process of the device. Accordingly, the specified device must be used with a significant free space below and above, however, this is difficult to apply, due to the fact that in most cases, during operation, network equipment is located in vertical cabinets, installing it one above the other. As a result, blocking or restricting free access of cooling air from the lower and / or upper sides of the device structure will significantly affect the cooling efficiency of the working electronic boards, which can lead to their overheating.

Known patent for the invention "Fan cooling device for cooling electronic components" (RF patent No. 2378808, IPC H05K 7/20, publication date 01/10/2010), used in telecommunication base stations with air cooling in places open to the effects of various weather conditions, which contains a protective cover for the air inlet in the housing, which houses the electronic components. A protective cover with a filter element allows purified air to enter the interior of the device.

A patent for the invention "Compact device for cooling printed circuit boards located inside a cage" is known from the prior art (German patent DE69800586, IPC H05K 7/20, G06F1 / 20, publication date 03/14/2001, other patent numbers, EP0886463, JPH1114776), in which shows a design with the possibility of cooling printed circuit boards located in a support structure (cage), where a uniform flow of a large volume of high static pressure cooling gas by means of a fan is realized, while reducing environmental noise. Air flows through the printed circuit boards, thereby cooling them.

The disadvantage of the above technical solutions is the use of a blowing fan or fans on the rear wall of the device, providing air flow through it due to the formation of low pressure in the body of the device. With this ventilation method, stagnant zones of heated air can form, in particular if electronic components (boards) are installed across the air flow, which can lead to a decrease in the efficiency of cooling the electronic components and the heating of the device case.

A patent for the invention "Housing and cooling system for electronic equipment" is known from the prior art (US patent No. US 10575433 B2, IPC H05K 7/20, H05K 5/06, H05K 7/14, publication date 02/25/2020), selected as prototype, which discloses the design of the case and the cooling system, providing forced air cooling of several compartments of electronic components, at the same time isolating them from the environment and keeping them free from contamination due to harmful dust, dirt, water, corrosive substances and other foreign matter in the air Tel. The chilled ambient air intake duct contains a ribbed core located between the electronics compartments, so that ambient air entering from the air intake through the common duct is pumped out through the fans and removes the heat generated by the electronic components inside the sealed compartments.

The disadvantages of this technical solution is that the main cooling flow of atmospheric air passes through the channel between the compartments in which the electronic components are located and, accordingly, only the compartment wall heated from them is cooled, while the electronic components are not cooled, but only give off heat to the compartment wall. Thus, there is no direct cooling by the air flow of the electronic components that are heated during operation. It is likely that through the openings in the walls of the compartments, small amounts of atmospheric air passes through the compartments, but at the same time there can also form stagnant zones with an increased air temperature.

It is known from physics that the best heat transfer is carried out by directly finding the heated element in a cooling medium, since direct heat transfer is carried out and the coolant removes heat from the heated element. At the same time, with a constant flow, heat transfer is better, since the temperature difference at the inlet is constant.

The object of the present invention is to provide an optimized forced air cooling of electronic components located in the housing of a multiservice transport platform, where the access of cooling air is difficult.

The technical result of the proposed technical solution is to increase the efficiency of forced fan cooling of electronic components located inside the case of the multiservice transport platform.

The specified technical result is achieved by the fact that in the case of the multiservice transport platform, containing walls, while the side walls are made with perforations, a backplane with connectors, cavities for placing boards with electronic components, fan blocks, according to the present invention, the backplane is located parallel to the rear wall and at a distance from it, each of the fan blocks is installed at the corresponding side wall of the case and parallel to it, additional fans are installed in the space between the rear wall and the backplane, located symmetrically to each other at the corresponding side walls, a figured element rigidly fixed to the backplane and to the walls of the body, the edges of which form closed spaces with the corresponding side and bottom walls, and the backplane is made with through holes in its lower part. The figured element can be made trapezoidal and fixed with a smaller base to the lower wall of the housing, and the larger base is placed outside the trapezoidal shape of the element, so that the ribs of the larger base are rigidly fixed to the side walls of the housing above the installed additional fans. The figured element can be made single or composite. The edges of the figured element can be bent at the edges.

The design of the case of the multiservice transport platform implies the location of electronic components, in particular boards, in the lower part of the case, which is difficult to access for direct cooling by means of the air flow from the fans, since it is located under the main cavity for placing electronic components, and under the fan blocks that provide their cooling ... Placing the backplane board at a distance from the rear wall of the device case allows creating additional space that can be used for directing air flow from the additional fan to hard-to-reach places, in particular the lower part of the case.

Installing additional fans in the space between the back panel and the backplane, in addition to the already installed fan trays on the corresponding side panels, increases the rate and volume of cooling air flowing into and out of the chassis.

An additional fan that blows air into the chassis creates excess pressure in the space between the backplane and the back of the chassis on the corresponding side, and an additional fan that blows creates a reduced pressure on the other side, thereby improving air intake and exhaust heat from electronic components.

The installation of the shaped element in the space between the connecting plate and the rear wall provides for the formation of a closed space near the corresponding additional fan, in which a zone of overpressure or underpressure is created. Making holes in the lower part of the unifying board ensures the direction of the flow of cooling air coming from the fan to hard-to-reach places of the device or the outlet of the air flow from the case of the device. In addition, the through holes in the unifying board act as a diffuser, increasing the speed of the flow passing through them, respectively, increasing the speed and volume of heat removal from the device. However, the flow rate must also match the cooling efficiency of the electronic components. This is due to the fact that if the flow rate of the coolant is too high, then the heat exchange is ineffective, since the residence time of the heated element inside the coolant is not enough, and if the speed of the coolant is too low, then the coolant can take on the temperature of the heated element and not take away a sufficient amount of heat.

Thus, based on the results of mathematical modeling and experimental physical simulations of the cooling air flow in the device case, technical characteristics of additional fans, geometric parameters of a figured element forming a closed space near additional fans, and geometric characteristics of through holes in the backplane board were determined to ensure a certain volume and the air flow rate inside the device in order to achieve an optimized heat dissipation from the device body.

These signs are essential for solving the problem and achieving the specified technical result. The claimed invention is illustrated by a drawing. The figures show images of the proposed technical solution, as well as a picture of heat transfer inside the lower part of the housing of the multiservice transport platform.

Description of drawings:

FIG. 1 is an isometric front view of the body of a multiservice transport platform;

FIG. 2 is a rear isometric view of the multiservice transport platform body;

FIG. 3 is a side view of the body;

FIG. 4 is a rear view of the body;

FIG. 5 - figured element (isometric view);

FIG. 6 is a picture of the temperature distribution inside the case of a multiservice transport platform.

Figures 1-4 show an example of the implementation of the body of a multiservice transport platform, which contains walls: rear 1, lower 2, upper 3 and side 4, made with perforation 5; a backplane board 6, located parallel to the rear wall 1 and at a distance L from it, guides 7 in the cavity for placing electronic components, electronic components 8 installed in the lower part of the housing and fan units 9, each of which is installed along the corresponding side wall 4. With one on the side of the case of the multiservice transport platform between the side wall 4 and the corresponding block of fans 9, a filter (not indicated by the position) can be installed to prevent contamination from entering the case.

In the space between the rear wall 1 and the backplane 6 on both sides of the case, in addition to the fan blocks, additional fans 10 are symmetrically installed to each other, which may have the same technical characteristics as the fans of the block 9. In addition, in the space between the rear wall 1 and backplane board 6 there is a figured element 11 ..

The figured element 11, in the embodiment shown in the figures, is made in a trapezoidal shape. The figured element 11 is fixed with its smaller base to the lower wall 2 of the body, and its larger base, which is carried out beyond the side edges of the trapezoidal shape, and with its ribs is rigidly fixed to the side walls 4 above the additional fans 10, so that the edges of the lateral sides of the trapezoidal shape of the figured element 11 form closed spaces with the corresponding side walls 4 and the bottom wall 3 of the housing, inside which the corresponding additional fans 10 are located.

In the exemplary embodiment of the figured element 11 shown in the figures, its edges are bent to simplify rigid attachment to the walls of the housing of the multiservice transport platform.

In the lower part of the backing board 6 in the area formed by the shaped element 11 of the closed space, through holes 12 are made.

Figure 6 shows a picture of the distribution of the temperature of the air flow inside the body of the multiservice transport platform.

Forced ventilation in the claimed invention is carried out as follows:

Fan units 9 and additional fans 10 installed in the case on the one hand work for blowing air into the case, on the other hand they work for blowing out. In the presented example of the implementation of the device, the air movement is from right to left, when viewed from the front. Such operation of the block of fans 9 and additional fans 10 allows, due to the formation of overpressure on one side of the case and reduced pressure on the other side, to provide a directed air flow into the case and thereby provide optimal forced ventilation with a certain speed and volume of cooling air flow and, accordingly, optimal heat transfer. Electronic components (not shown in the figures), which can be installed horizontally in the middle of the case in the cavity for electronic components along the rails 7, are cooled by a direct flow of air entering the case from the fan unit 9. Electronic components 8, which are installed in the lower part of the case the devices are cooled by a directed air flow coming from an additional fan 10 through a through hole 12 in the board connecting 6 from the closed space formed by the figured element 11 and the rear 1 and the corresponding side 4 walls of the device case. The closed space at the additional fan 10, operating for blowing, allows to form a zone of overpressure and thereby direct the increased air flow through the through hole 12 in the uniting board 6.On the other side of the platform case, the second additional fan 10, like the entire block of fans 9, working for blowing, allows you to create a reduced pressure in the corresponding closed space formed by the figured element 11 and the rear 1 and the corresponding side 4 walls of the platform body. As a result, hot air, which removes heat from the electronic components from the lower part of the body, enters the second closed space through the second a through hole 12 in the uniting board 6 and by means of an additional fan 10 goes outside the device.

Such a structural design of the case of the multiservice transport platform allows to optimize forced fan cooling of the case and to reduce the temperature of electronic components located in the lower part of the case to 58 ° Celsius, in the presented version, which ensures stable operation of electronic components without the risk of overheating.

The claimed technical solution presented in the figures has been implemented. Thus, the claimed invention fully realizes the set task, is implemented and industrially applicable.

Claims (5)

1. The case of a multiservice transport platform, containing walls, while the side walls are made with perforations, a backplane with connectors, cavities for placing electronic components, fan blocks, characterized in that the backplane is located parallel to the rear wall and at a distance from it, each of fan blocks are installed at the corresponding side wall of the case and parallel to it, in the space between the rear wall and the backplane board, additional fans are installed, located symmetrically to each other at the corresponding side walls, and a figured element rigidly fixed to the backplane board and to the walls of the case, the face of the figured element form closed spaces with the corresponding side and bottom walls, while the backplane is made with through holes in its lower part. 2. The body of the multiservice transport platform according to claim 1, characterized in that the figured element is made of trapezoidal shape and is fixed with a smaller base to the lower wall of the body, and the larger base is placed outside the shape of the trapezoid of the element, so that its ribs are rigidly fixed to the side walls of the body above installed additional fans. 3. The body of the multiservice transport platform according to claim 1, characterized in that the figured element can be made in one piece. 4. The body of the multiservice transport platform according to claim 1, characterized in that the figured element can be made composite. 5. The body of the multiservice transport platform according to claim 1, characterized in that the edges of the figured element can be bent at the edges.

Images