RU2513038C1 - Radioelectronic unit - Google Patents

Abstract

FIELD: radio engineering, communication.

SUBSTANCE: invention relates to radioelectronics and can be used to solve problems of removing heat from heat-loaded radioelectronic components on printed-circuit boards. In the disclosed radioelectronic unit, a heat-loaded radioelectronic component 3 is mounted on the outermost printed-circuit board 2, where said component is fitted with a heat-conducting plate 4 with fins 5 and grooves 6 in which fins 7 and grooves 8 of a heat-conducting cover 1 are inserted, respectively, when assembling the radioelectronic unit, and gaps between the fins 5 and 7 are filled with heat-conducting material 9.

EFFECT: high efficiency of removing heat from heat-loaded radioelectronic components.

1 dwg

Description

The invention relates to electronics and can be used to solve problems of heat removal from heat-loaded radio-electronic components located on printed circuit boards.

Known electronic unit [1], containing functional cells, which are heat sink bases with glued to them circuit boards with heat-loaded radio electronic components mounted on them, while the heat sink bases of adjacent cells are bonded to each other and form the walls of the housing.

The disadvantage of this device is the relatively low heat transfer through the printed circuit board between the heat-loaded electronic components and the heat sink base.

Known electronic block [2], containing a printed circuit board with a heat-loaded electronic component mounted on it with planar leads, the heat sink base of which is bonded to the heat-conducting housing of the electronic block by means of mounting sleeves through a printed circuit board.

The disadvantage of this device is the design complexity and use for heat removal only from the electronic component with planar leads, as well as their non-standard molding.

The problem to which this invention is directed, is to increase the efficiency of heat dissipation from heat-loaded electronic components.

The problem is achieved due to the fact that in the electronic block containing heat-conducting covers, a package of printed circuit boards with heat-loaded radio-electronic components installed on the extreme printed circuit boards, according to the invention, heat-conducting plates equipped with fins and grooves separating them are installed on the heat-removing surfaces of the electronic components, and the inner surfaces heat-conducting covers are also equipped with ribs included in the assembly of the electronic block into the grooves row of heat conducting plates ribs thermally loaded electronic components ensuring mutual thermal contact, the gap between heat conducting plates and fins of heat conducting fins covers filled heat conducting material.

The essential features of the claimed device in comparison with the known (closest analogue) include the installation of heat-conducting radio-electronic components of heat-conducting plates equipped with fins with grooves separating them on the heat-removing surfaces, which include fins, which are provided with the inner surfaces of the heat-removing covers.

The drawing shows a radio-electronic unit in section.

The drawing shows a heat-conducting cover 1, a printed circuit board 2, a heat-loaded radio-electronic component 3, a heat-conducting plate 4, ribs 5, grooves 6, ribs 7 of the cover, grooves 8 of the cover, heat-conducting material 9.

The proposed design of the electronic unit is as follows.

A heat-loaded radio-electronic component 3 is installed on the outer printed circuit board 2, on which a heat-conducting plate 4 with ribs 5 and grooves 6 is installed, which include ribs 7 and grooves 8 of the heat-conducting cover 1, respectively, when assembling the electronic block, and the gaps between the ribs 5 and 7 are filled with heat-conducting material 9.

The assembly of the electronic unit is as follows. A package of printed circuit boards is installed on the frame of the unit, heat-loaded radio-electronic components 3 are soldered to the end boards 2, on which heat-conducting plates 4 with ribs 5 and grooves are fixed 6. Then, a heat-conducting cover 1 with ribs 5 and grooves 6 is mounted so that the ribs 5 enter grooves 8, and the ribs 7 entered the grooves 6, previously applying heat-conducting material 9 to them, after which the cover 1 is screwed to the block frame.

In the process, heat from the heat-loaded electronic component 3 is transferred to the heat-conducting plate 4, and from it through the ribs 5 and 7 to the heat-conducting cover 1 for dissipation into the surrounding space.

The advantage of the proposed device is the ability to dissipate heat through each cover of the block. If the block is made in the form of a parallelepiped, then heat dissipation occurs through all 6 covers.

The proposed design of the electronic unit is used in on-board navigation equipment and provides the necessary temperature conditions for heat-loaded electronic components.

Information sources

1 RF Patent 2322776, IPC H05K 1/00, 2006

2 RF Patent 2105441, IPC H05K 7/20, 1996 (the closest analogue).

Claims (1)

An electronic block containing heat-conducting covers, a package of printed circuit boards with heat-loaded radio-electronic components mounted on the extreme printed circuit boards, characterized in that heat-conducting plates are provided on the heat-removing surfaces of the heat-loaded radio-electronic components, provided with fins and grooves separating them, and the inner surfaces of the heat-conducting covers are also equipped with fins, included in the assembly of the electronic block into the grooves between the edges of the heat-conducting plates of heat-loaded electronic components with mutual thermal contact, while the gap between the edges of the heat-conducting plates and the edges of the heat-conducting covers is filled with heat-conducting material.