RU2329575C1 - Method of manufacturing microstrip printed radiator - Google Patents

Abstract

FIELD: electric engineering.

SUBSTANCE: invention is related to technology of manufacturing microstrip printed radiators for phased antenna arrays. Technical result is achieved by the fact that in method of manufacturing microstrip printed radiator that contains the following technological operations: drilling of openings for radiator supply wiring, application of printed radiator contours on foiled double-side dielectric, etching of printed radiator, application of conducting protective mask on contours from both sides, installation of header supply core into opening, after operation "application of printed radiator contours on foiled double-side dielectric" operation is introduced "metallisation of opening for radiator supply wiring", and soldering of supply core is performed in metallised opening after operation of "installation of header supply core into opening".

EFFECT: increase of printed radiator efficiency factor and improvement of electric contact of microstrip printed radiator with supply core by means of elimination of air gap between dielectric and supply core.

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Description

The invention relates to a technology for manufacturing microstrip printed emitters for phased array antennas.

A known method for the manufacture of microstrip printed emitters [Printed circuit centimeter range. Collection of articles, ed. V.I.Sushkevich. Publishing House of Foreign lit., M., 1956. 400 pp.]. Figure 1 shows a section of the power supply hole of this method, where: 1 is a foil-coated double-sided dielectric, 2 is the air gap of the hole, 3 is a microstrip printed radiator, 4 is a supply core, 5 is a connector, 6 is solder. The selected method includes the following technological operations: drawing the contours of the printed emitter on a foil double-sided dielectric 1; drilling holes for the wiring of the emitter power; etching of the printed emitter 3; applying a conductive protective mask to the contours on both sides; installation in the hole of the supply core 4 connectors 5; soldering the supply core 4 connectors 5 solder 6 with a microstrip print emitter 3.

The reasons that impede the achievement of the technical result indicated below when using the known method include the fact that an air gap is formed between the dielectric and the supply core, which does not provide good electrical contact. In addition, the air gap is a parasitic reactivity, which leads to deterioration of the emitter, in particular, reduces the coefficient of performance (COP).

The essence of the invention is to eliminate the air gap between the dielectric and the supply core.

The technical result consists in increasing the efficiency of the printed radiator and in improving the electrical contact of the microstrip printed radiator with residential power.

The specified technical result in the implementation of the invention is achieved by the fact that in the known method of manufacturing a printed microstrip emitter, comprising the following technological operations: drawing the contours of the printed emitter on a foil double-sided dielectric, drilling a hole for the wiring of the emitter power, etching the printed emitter, applying a conductive protective mask to the circuits with both sides, installation in the hole of the supply core of the connector, the operation of metallization of the hole is additionally introduced it is for wiring the emitter power, and soldering is done in a metallized hole.

Figure 2 presents a section of the power hole according to the proposed method, where: 1 - foil-coated double-sided dielectric, 2 - metallization of the hole, 3 - microstrip printed radiator, 4 - supply core, 5 - connector, 6 - solder.

Information confirming the possibility of carrying out the invention with obtaining the above technical result: technological operations are carried out in the following sequence: drilling a hole for wiring a radiator power, applying the circuits of a printed emitter 3 to a foil-coated double-sided dielectric 1, metallizing 2 holes for wiring a radiator power, etching a printed radiator 3, applying a conductive protective mask to the circuits on both sides, installing 4 connectors 5 in the hole of the supply core, soldering rip 6 supply wire 4 in a metallized hole with microstrip print emitter 3.

The metallization process involves the following basic technological operations: preparing the surface of the hole, direct metallization, galvanic build-up of copper.

As a result of metallization of the hole for the wiring of the emitter power and filling it with solder during the soldering process, the air gap between the dielectric and the supply core is eliminated.

Thus, the above information indicates the fulfillment of the following set of conditions when using the claimed invention:

- a tool embodying the claimed method in its implementation, is intended for use in industry;

- for the claimed method in the form described in the independent clause of the claims, the possibility of its implementation using the means and methods described in the application or known prior to the priority date is confirmed.

Therefore, the claimed invention meets the condition of "industrial applicability".

Claims (1)

A method of manufacturing a microstrip print emitter, including the following technological operations: drilling holes for the wiring of the emitter power, applying the circuits of the printed emitter to a foil double-sided dielectric, etching the printed emitter, applying a conductive protective mask to the circuits on both sides, installing a connector in the feed core, characterized in that after the operation "drawing the contours of the printed emitter on a foil double-sided dielectric" is introduced the operation "metallization openings for the wiring of the emitter’s power supply ”, and the soldering of the supply core is performed in the metallized hole after the operation“ installation of the connector in the hole of the supply core ”.

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