RU2365071C1 - Electronic boards cooling device - Google Patents

Abstract

FIELD: heating systems.

SUBSTANCE: invention refers to electronics and can be used for providing the required thermal conditions of electronic equipment components and namely electronic boards. The effect is achieved by the fact that on the electronic equipment components which are the most critical relative to temperature condition of operation or which require essential temperature decrease, there additionally installed are thermoelectric batteries, thus providing good thermal contact with cold ends. The above batteries are supplied with electric power from direct current power supply. Heat is transferred from hot ends of thermoelectric batteries to the working medium available in the capacity. At that, heat is transferred from hot ends of thermoelectric batteries to the working medium by means of copper heat pipeline.

EFFECT: providing the possibility of non-uniform cooling of electronic equipment components located on electronic board.

1 dwg

Description

The invention relates to electronics and can be used to provide the required thermal regimes of elements of electronic equipment (REA), in particular electronic circuit boards.

The prototype of the invention is the device described in [1].

The device is a thin-walled metal container filled with a working substance, on which fuel elements are installed with good thermal contact. The heat dissipated by the equipment is absorbed due to the latent heat of fusion of the substance.

The disadvantage of this device is the inability to ensure uneven cooling of the REA elements installed on the electronic board, i.e. cooling various REA elements to different temperatures.

The aim of the invention is to achieve the possibility of organizing uneven cooling of REA elements placed on an electronic board.

The goal is achieved in that the CEA elements that are most critical to the temperature regime of operation or require a significant decrease in temperature are additionally installed with providing good thermal contact with cold junctions thermoelectric batteries (TEB), powered by electrical energy from a constant current source. The heat is removed from the hot junctions of the fuel-cell assembly to the working substance in the tank. Moreover, the transfer of heat from the hot junctions of the thermopile to the working substance is carried out through a copper heat pipe.

The design of the device is shown in the drawing. The device comprises a metal container 1 filled with a working substance having a great value of the heat of fusion and a melting temperature in the range of 35-65 ° C (for example, paraffin). An electronic board 2 is installed on one of the surfaces of the tank 1 with REA 3 fuel elements placed on it. The REA 3 elements, which are most critical to the temperature operating mode or require a significant temperature reduction, are additionally installed to provide good thermal contact with cold junctions of the TEB 4, powered by an electric energy from a constant current source (not shown). The heat is removed from the hot junctions of the TEB 4 by means of a copper heat pipe 5 to the working substance located in the tank 1.

The device operates as follows.

The heat coming from the REA 3 elements installed on the electronic board 2 is transferred to the metal tank 1 and through the contact surface to the working substance. Next, the working substance 2 is heated to the melting temperature and the melting process is accompanied by the absorption of heat spent on changing the state of aggregation of the substance. The heat sink due to changes in the state of aggregation of the working substance is basic and can be used to provide the necessary temperature regime for the operation of CEA 3 elements that do not require a significant decrease in temperature or are not critical to a significant amount of overheating with respect to the environment. To cool REA elements that are especially critical to overheating or require a significant temperature reduction, TEB 4 are used, which organize additional heat removal, and the cooling capacity of each TEU 4 is determined in accordance with the level of heat release of a particular REA element 3. In this case, heat is removed from hot TEU junctions also in the working substance contained in the tank 1, the amount of which is calculated based on the duration of operation of the REA 3 elements, the power of their heat generation, eploproizvoditelnosti FEB 4, as well as operating conditions. Heat is transferred from the hot junctions of the fuel and energy complex 4 to the tank 1 with the working substance by means of a copper heat conduit 5.

Literature

1. Alekseev V.A. Cooling of electronic equipment using melting substances. M .: Energy, 1975.

Claims (1)

A device for cooling electronic circuit boards containing a metal container filled with a working substance that has a great value of the heat of fusion and a melting point in the range of 35-65 ° C, on one surface of which is installed an electronic board with heat-generating elements of electronic equipment placed on it, characterized in that the elements of electronic equipment that are most critical to the temperature regime of operation or require a significant decrease in temperature are additionally set thermoelectric batteries fed with electric energy from a source of direct electric current are infused to provide good thermal contact with cold junctions, and heat is removed from their hot junctions to the working substance in the tank, and heat is transferred from hot junctions of thermoelectric batteries to the working substance by means of a copper heat conduit .