RU2210529C1 - Integrated micropump - Google Patents

Abstract

FIELD: integrated electronics+ADs- microsystems, microcapillary devices using electro-hydrodynamic effect. SUBSTANCE: newly introduced in integrated micropump that has electrode in the form of reticular-structure semiconductor wafer with V-shaped holes throughout its entire thickness and insulating layer are metal layer that functions as second electrode and dielectric film used as electrodes-insulating layer whose thickness dictates electrode working gap+ADs- dielectric film and metal layer are provided with through holes matched with narrow part of V-shaped hole. EFFECT: reduced size and enhanced delivery of device. 1 cl, 4 dwg

Description

 The invention relates to the field of integrated electronics and microsystem technology, and more particularly to microcapillary devices using an electrohydrodynamic effect.

 The known design of the micropump of the thermopneumatic principle of operation manufactured using LIGA technology (see V.A. Kolesnikov, T.Ya. Rakhimbabaev. Microfluidic systems and their implementation using LIGA technology, journal "Microsystem technology", 1, 1999 , pp. 15-21, Fig. 2). The design of the micropump (Fig. 1) contains a semiconductor wafer (1), inlet and outlet valves (2, 3) that allow fluid flow in one direction, a titanium wire (4), a working volume (5) with a membrane (6), and a pump chamber (7), electrodes (8).

 Signs of this analogue common with the claimed device are the presence of a semiconductor wafer and electrodes.

 The reason that impedes the achievement of the technical result is the design complexity, as well as the use of rare-earth, expensive materials (titanium).

 An integrated micropump is known to be low power at 2.3 V (see Kwang-Seor Yun, and other. "A Micropump Driven by Continuous Electrowetting Actuation for Low Voltage and Power Operations". Proc. Of the 14th IEEE MEMS 2001, Technical Digest, Orlango, Florida, USA, pp 487-490). The design of the micropump (figure 2) contains a semiconductor wafer made of rubberized silicon (1), inlet and outlet membranes (2, 3), inlet and outlet copper valves (4, 5), a silicon channel (6), a working area (7), filled with an electrolyte, in which there is a droplet of mercury (8), platinum electrodes (9).

 Signs of this analogue common with the claimed device are the presence of a semiconductor wafer and electrodes.

 The reason that impedes the achievement of the technical result is the design complexity, as well as the use of "rubberized" silicon, the use of harmful (mercury) and expensive (platinum) materials.

 Of the known closest in technical essence to the claimed object is a silicon micropump (see A. Richter. Silicon micropump - a new achievement of microprocessing, "Electronics (Electronics)" 8 (837), 1990, pp. 7-8).

 The prototype is a silicon micropump (figure 3), consisting of two electrodes (1, 2), placed one above the other and representing two semiconductor wafers with V-shaped holes (4) forming a mesh structure. The electrodes are separated by an insulating layer (3), which is an insulating pad.

 The pump does not contain any moving parts, does not wear out, has high reliability and is easy to manufacture.

 The signs of this prototype, common with the claimed device, are the presence of an electrode, which is a semiconductor wafer with V-shaped holes that form a mesh structure, and an insulating layer.

 The reason that impedes the achievement of the technical result is the need to combine two mesh electrodes with each other. These circumstances limit the minimum size limits of the device and reduce performance.

 The problem to which the invention is directed, is to reduce the size of the micropump and increase the productivity of the device.

 To achieve this goal, in a micropump containing an electrode made of a semiconductor wafer, which is a mesh structure with V-holes throughout its thickness, and an insulating layer, the second electrode is a metal layer, and the insulating layer is a dielectric film separating the electrodes, thickness which determines the working gap between the electrodes, and in the dielectric film and the metal layer there are through holes corresponding to the narrow part of the V-shaped hole.

 Figure 4 shows the topology (a) and structure (b) of the integrated micropump.

 The integral micropump contains a semiconductor wafer (1), which is a mesh structure with V-shaped openings (4) over its entire thickness, turning their narrow part into through holes (5) into a dielectric film (2) and a metal layer (3).

 If this micropump is placed in a tube, on one side of which a polar liquid (containing ions or dipoles) is fed and a voltage is applied to the semiconductor wafer (1) and the metal layer (3) separated by a dielectric film (2), then the interaction between the inhomogeneous high electric field arising between the narrow part of the V-shaped hole (4) and the metal layer (3), and the ions or dipoles of the liquid, forces will appear that act on the particles of the liquid, which will lead to the movement of the liquid through the through holes (5) in one direction.

 The integrated micropump contains, in contrast to the prototype, a dielectric film as the insulating layer, the thickness of which determines the working gap between the semiconductor wafer and the metal layer, and its decrease allows to reduce the working voltage in the gap at the same field strength, i.e. increase the productivity of the device by 1.5-3 times. And the use of a metal layer avoids combining and fixing the electrodes.

Claims (1)

 An integrated micropump containing an electrode made of a semiconductor wafer, which is a mesh structure with V-holes throughout its thickness, and an insulating layer, characterized in that the second electrode is a metal layer, and the insulating layer is a dielectric film separating the electrodes, the thickness which determines the working gap between the electrodes, and in the dielectric film and the metal layer there are made through holes corresponding to the narrow part of the V-shaped hole.

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