RU2017144086A - Припойная соединительная структура и способ пленкообразования - Google Patents
Припойная соединительная структура и способ пленкообразования Download PDFInfo
- Publication number
- RU2017144086A RU2017144086A RU2017144086A RU2017144086A RU2017144086A RU 2017144086 A RU2017144086 A RU 2017144086A RU 2017144086 A RU2017144086 A RU 2017144086A RU 2017144086 A RU2017144086 A RU 2017144086A RU 2017144086 A RU2017144086 A RU 2017144086A
- Authority
- RU
- Russia
- Prior art keywords
- powdered material
- aluminum
- connecting structure
- mixed
- film formation
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims 4
- 230000015572 biosynthetic process Effects 0.000 title claims 3
- 210000004556 brain Anatomy 0.000 title 1
- 239000012254 powdered material Substances 0.000 claims 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 8
- 239000000463 material Substances 0.000 claims 6
- 229910052782 aluminium Inorganic materials 0.000 claims 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 5
- 229910045601 alloy Inorganic materials 0.000 claims 4
- 239000000956 alloy Substances 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 239000010931 gold Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 238000010288 cold spraying Methods 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Claims (14)
1. Припойная соединительная структура, которую необходимо соединить с элементом посредством материала припоя, содержащая:
основной материал из алюминия и
металлическую пленку, полученную на основном материале из алюминия, причем металлическая пленка образуется способом холодного распыления, в котором используют смешанный порошкообразный материал, причем смешанный порошкообразный материал является смесью (i) первого порошкообразного материала, который содержит любое из никеля (Ni), золота (Аu), цинка (Zn), серебра (Ag) и меди (Сu) или сплава двух или более их видов, и (ii) второго порошкообразного материала, который содержит олово (Sn) или Sn-содержащий сплав.
2. Припойная соединительная структура по п. 1, в которой:
первый порошкообразный материал содержит Ni;
второй порошкообразный материал содержит Sn; и
смешанный порошкообразный материал содержит первый порошкообразный материал в массовом отношении не менее 80% и не более 95%.
3. Способ пленкообразования для получения металлической пленки на основном материале из алюминия, предусматривающий стадии:
холодного распыления на основном материале из алюминия смешанного порошкообразного материала, который является смесью (i) первого порошкообразного материала, который содержит любое из никеля (Ni), золота (Аu), цинка (Zn), серебра (Ag) и меди (Сu) или сплава двух или более их видов, и (ii) второго порошкообразного материала, который содержит олово (Sn) или Sn-содержащий сплав, чтобы получить металлическую пленку на основном материале из алюминия.
4. Способ пленкообразования по п. 3, в котором:
первый порошкообразный материал содержит Ni;
второй порошкообразный материал содержит Sn; и
смешанный порошкообразный материал содержит первый порошкообразный материал в массовом отношении не менее 80% и не более 95%.
5. Припойная соединительная структура по п. 1 или 2, причем припойную соединительную структуру используют в качестве перемычки элемента или сборной шины.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-101235 | 2015-05-18 | ||
| JP2015101235A JP6472323B2 (ja) | 2015-05-18 | 2015-05-18 | 成膜方法 |
| PCT/JP2016/064122 WO2016185996A1 (ja) | 2015-05-18 | 2016-05-12 | 半田接続構造、及び成膜方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| RU2017144086A true RU2017144086A (ru) | 2019-06-17 |
| RU2017144086A3 RU2017144086A3 (ru) | 2019-10-01 |
| RU2716176C2 RU2716176C2 (ru) | 2020-03-06 |
Family
ID=57319993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2017144086A RU2716176C2 (ru) | 2015-05-18 | 2016-05-12 | Припойная соединительная структура и способ пленкообразования |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20180161942A1 (ru) |
| EP (1) | EP3299492B1 (ru) |
| JP (1) | JP6472323B2 (ru) |
| RU (1) | RU2716176C2 (ru) |
| TW (1) | TWI641441B (ru) |
| WO (1) | WO2016185996A1 (ru) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019127599A (ja) * | 2018-01-19 | 2019-08-01 | タツタ電線株式会社 | バスバー、及びバスバーの製造方法 |
| US10702939B2 (en) * | 2018-04-05 | 2020-07-07 | Hamilton Sundstrand Corporation | Cold-spray braze material deposition |
| JP2020131271A (ja) * | 2019-02-25 | 2020-08-31 | 株式会社神戸製鋼所 | 異種金属接合体の製造方法及び異種金属接合体 |
| CN114434039B (zh) * | 2021-01-15 | 2024-07-30 | 重庆理工大学 | 一种铜铝异材低温互连的焊料及焊接方法 |
| TWI793589B (zh) * | 2021-05-05 | 2023-02-21 | 艾姆勒科技股份有限公司 | 散熱基材結構及其形成方法 |
| US12140386B2 (en) | 2021-07-07 | 2024-11-12 | Amulaire Thermal Technology, Inc. | Heat-dissipating substrate structure |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545505A (en) * | 1978-09-25 | 1980-03-31 | Ricoh Co Ltd | Solderable aluminum material |
| RU2029791C1 (ru) * | 1991-05-22 | 1995-02-27 | Научно-исследовательский институт порошковой металлургии с опытным производством | Способ получения порошковых покрытий |
| JP2001164379A (ja) * | 1999-12-08 | 2001-06-19 | Ebara Corp | 表面処理方法及び接合方法 |
| JP2006068765A (ja) * | 2004-09-01 | 2006-03-16 | Toshiba Corp | 接合体及び接合方法 |
| GB2447486A (en) * | 2007-03-14 | 2008-09-17 | Sandvik Osprey Ltd | A brazing piece comprising a composite material including an inorganic flux |
| JP2011212684A (ja) * | 2010-03-31 | 2011-10-27 | Hitachi Ltd | 金属接合部材及びその製造方法 |
| JP5549996B2 (ja) * | 2010-06-15 | 2014-07-16 | 住友電気工業株式会社 | アルミタブリード用のフープ状部材 |
| MY160929A (en) * | 2010-08-31 | 2017-03-31 | Nissan Motor | Joining method of aluminum-based metal |
| JP2013125952A (ja) * | 2011-12-16 | 2013-06-24 | Toyota Motor Corp | 半導体装置 |
| JP2015137384A (ja) * | 2014-01-21 | 2015-07-30 | トヨタ自動車株式会社 | 金属皮膜およびその成膜方法 |
-
2015
- 2015-05-18 JP JP2015101235A patent/JP6472323B2/ja active Active
-
2016
- 2016-05-11 TW TW105114604A patent/TWI641441B/zh active
- 2016-05-12 EP EP16796389.1A patent/EP3299492B1/en active Active
- 2016-05-12 WO PCT/JP2016/064122 patent/WO2016185996A1/ja not_active Ceased
- 2016-05-12 RU RU2017144086A patent/RU2716176C2/ru active
- 2016-05-12 US US15/571,057 patent/US20180161942A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| TWI641441B (zh) | 2018-11-21 |
| WO2016185996A1 (ja) | 2016-11-24 |
| JP6472323B2 (ja) | 2019-02-20 |
| EP3299492B1 (en) | 2023-08-02 |
| US20180161942A1 (en) | 2018-06-14 |
| EP3299492A1 (en) | 2018-03-28 |
| RU2017144086A3 (ru) | 2019-10-01 |
| TW201701984A (zh) | 2017-01-16 |
| EP3299492A4 (en) | 2018-11-21 |
| JP2016216771A (ja) | 2016-12-22 |
| RU2716176C2 (ru) | 2020-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2017144086A (ru) | Припойная соединительная структура и способ пленкообразования | |
| PH12018502683B1 (en) | Copper alloy bonding wire for semiconductor devices | |
| MX2021012411A (es) | Aleaciones de soldadura libres de plata, libres de plomo. | |
| WO2016012754A3 (en) | Low temperature high reliability tin alloy for soldering | |
| MX2019002670A (es) | Soldadura de lmpa: aleacion de punto de fusion bajo, libre de plomo y uso de la misma. | |
| MY154604A (en) | Solder alloy, solder paste, and electronic circuit board | |
| MY162428A (en) | Solder alloy, solder composition, solder paste, and electronic circuit board | |
| MY160989A (en) | Lead-free solder alloy | |
| EP2801435A3 (en) | Solder paste | |
| PH12014500905A1 (en) | High temperature reliability alloy | |
| MY154044A (en) | Solder alloy, solder paste, and electronic circuit board | |
| MY188659A (en) | Solder alloy, solder paste, and electronic circuit board | |
| MY164343A (en) | Solder alloy, solder paste, and electronic circuit board | |
| EP4299238A3 (en) | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications | |
| PH12019501934A1 (en) | Solder material, solder paste, formed solder and solder joint | |
| WO2012153925A3 (ko) | 브레이징 합금 | |
| MX2018002650A (es) | Aleaciones para soldadura sin plomo de alta confiabilidad. | |
| MX2023011401A (es) | Aleacion de soldadura, bola de soldadura y junta de soldadura. | |
| PH12016000121A1 (en) | Silver alloy bonding wire and method of manufacturing the same | |
| JP2016047555A5 (ru) | ||
| MX2013009113A (es) | Aleacion de soldadura para audio. | |
| WO2019094241A3 (en) | Cost-effective lead-free solder alloy for electronic applications | |
| PH12020550954A1 (en) | Solder alloy and solder joint | |
| MY165589A (en) | Lead-free solder alloy for terminal preliminary plating, and electronic component | |
| PH12018501861A1 (en) | Lead-free solder alloy, electronic circuit substrate, and electronic control device |