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RU2004118246A - Способ и устройство для выполнения сквозных соединений в подложках и печатных платах - Google Patents

Способ и устройство для выполнения сквозных соединений в подложках и печатных платах Download PDF

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Publication number
RU2004118246A
RU2004118246A RU2004118246/09A RU2004118246A RU2004118246A RU 2004118246 A RU2004118246 A RU 2004118246A RU 2004118246/09 A RU2004118246/09 A RU 2004118246/09A RU 2004118246 A RU2004118246 A RU 2004118246A RU 2004118246 A RU2004118246 A RU 2004118246A
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substrate
sections
slot
adjacent
relative
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RU2004118246/09A
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RU2292680C2 (ru
Inventor
Юрген УСНЕР (DE)
Юрген УСНЕР
Андо ВЕЛЛИНГ (DE)
Андо ВЕЛЛИНГ
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Гизеке Унд Девриент Гмбх (De)
Гизеке Унд Девриент Гмбх
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27—Means for performing other operations combined with cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/18—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/18—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
    • B26F1/22—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material to form non-rectilinear cuts, e.g. for tabs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09836—Oblique hole, via or bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0207—Other than completely through work thickness or through work presented

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Monitoring And Testing Of Exchanges (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Container Filling Or Packaging Operations (AREA)

Claims (12)

1. Способ выполнения сквозных соединений в гибких подложках (1) для обеспечения электрического контакта между двумя расположенными на противоположных поверхностях (1a, 1b) подложки (1) электропроводными контактными участками (4, 41; 6, 61), при осуществлении которого в зоне этих контактных участков (4, 41) в подложке (1) режущим инструментом (9) выполняют прорезаемую под наклоном к ее поверхностям (1а, 1b) прорезь (11), отличающийся тем, что за одну рабочую операцию совместно с выполнением в подложке наклонной прорези (11) оба примыкающих к ней участка (20, 30) подложки смещают относительно друг друга, разводя их во взаимно противоположные стороны до тех пор, пока они не заскочат один за другой.
2. Способ по п.1, отличающийся тем, что обращенные друг к другу участки (20, 30) подложки смещают относительно друг друга, разводя их во взаимно противоположные стороны, с помощью отдельного толкателя (12) и/или предусмотренного на режущем инструменте захватывающего приспособления (15).
3. Способ по п.1, отличающийся тем, что обращенные друг к другу участки (20, 30) подложки смещают друг относительно друга, разводя их во взаимно противоположные стороны, под действием сжатого воздуха (13) или за счет создания разрежения (14).
4. Способ по одному из пп.1-3, отличающийся тем, что обе стадии, одна из которых предусматривает выполнение в подложке прорези, а другая - смещение обращенных друг к другу участков подложки относительно друг друга путем их разведения во взаимно противоположные стороны, выполняют не изменяя положение подложки.
5. Способ по одному из пп.1-3, отличающийся тем, что наклонную прорезь (11) в подложке (1) выполняют с наклоном под углом 45° к ее поверхностям (1а, 1b).
6. Устройство для осуществления способа по одному из пп.1-5, содержащее режущий инструмент (9), предназначенный для выполнения в подложке (1) прорезаемой в ней наклонно к обеим ее противоположным поверхностям (1a, 1b) прорези (11), и приспособление (12; 13; 14; 15) для смещения относительно друг друга двух примыкающих к прорези (11) участков (20, 30) подложки путем их разведения во взаимно противоположные стороны до их заскакивания один за другой, отличающееся тем, что режущий инструмент (9) и приспособление (12; 13; 14; 15) для смещения относительно друг друга примыкающих к прорези участков подложки расположены на одной и той же позиции обработки.
7. Устройство по п.6, отличающееся тем, что приспособление для смещения относительно друг друга примыкающих к прорези участков подложки содержит толкатель (12).
8. Устройство по п.6, отличающееся тем, что принцип работы приспособления для смещения относительно друг друга обоих примыкающих к прорези участков подложки основан на воздействии на них сжатым воздухом (13).
9. Устройство по п.6, отличающееся тем, что принцип работы приспособления для смещения относительно друг друга обоих примыкающих к прорези участков подложки основан на создании прикладываемого к ним разрежения (14).
10. Устройство по п.6, отличающееся тем, что приспособление для смещения относительно друг друга примыкающих к прорези участков подложки содержит зафиксированный на режущем инструменте (9) захватывающий крючок (15).
11. Устройство по одному из пп.6-10, отличающееся тем, что режущая кромка режущего инструмента (9) снабжена по меньшей мере одним зубцом (9b).
12. Устройство по одному из пп.6-10, отличающееся тем, что режущий инструмент (9) имеет ножевое полотно, способное пружинить перпендикулярно его плоскости.
RU2004118246A 2001-11-16 2002-11-14 Способ и устройство для выполнения сквозных соединений в подложках и печатных платах RU2292680C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10156395.7 2001-11-16
DE10156395A DE10156395A1 (de) 2001-11-16 2001-11-16 Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten

Publications (2)

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RU2004118246A true RU2004118246A (ru) 2006-01-10
RU2292680C2 RU2292680C2 (ru) 2007-01-27

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RU2004118246A RU2292680C2 (ru) 2001-11-16 2002-11-14 Способ и устройство для выполнения сквозных соединений в подложках и печатных платах

Country Status (10)

Country Link
US (1) US7207107B2 (ru)
EP (1) EP1449415B1 (ru)
JP (1) JP3981080B2 (ru)
CN (1) CN100407882C (ru)
AT (1) ATE291343T1 (ru)
DE (2) DE10156395A1 (ru)
ES (1) ES2235102T3 (ru)
PT (1) PT1449415E (ru)
RU (1) RU2292680C2 (ru)
WO (1) WO2003043394A1 (ru)

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EP1449415A1 (de) 2004-08-25
PT1449415E (pt) 2005-07-29
DE10156395A1 (de) 2003-05-28
JP3981080B2 (ja) 2007-09-26
US7207107B2 (en) 2007-04-24
DE50202510D1 (de) 2005-04-21
WO2003043394A1 (de) 2003-05-22
US20050125997A1 (en) 2005-06-16
EP1449415B1 (de) 2005-03-16
JP2005510068A (ja) 2005-04-14
CN1608398A (zh) 2005-04-20
ES2235102T3 (es) 2005-07-01
RU2292680C2 (ru) 2007-01-27
CN100407882C (zh) 2008-07-30
ATE291343T1 (de) 2005-04-15

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