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RU2001110013A - Low temperature soldering flux - Google Patents

Low temperature soldering flux

Info

Publication number
RU2001110013A
RU2001110013A RU2001110013/02A RU2001110013A RU2001110013A RU 2001110013 A RU2001110013 A RU 2001110013A RU 2001110013/02 A RU2001110013/02 A RU 2001110013/02A RU 2001110013 A RU2001110013 A RU 2001110013A RU 2001110013 A RU2001110013 A RU 2001110013A
Authority
RU
Russia
Prior art keywords
low temperature
soldering flux
temperature soldering
water
hydrochloric acid
Prior art date
Application number
RU2001110013/02A
Other languages
Russian (ru)
Other versions
RU2204466C2 (en
Inventor
Александр Матвеевич Никитинский
Евгений Александрович Герасимов
Original Assignee
Александр Матвеевич Никитинский
Евгений Александрович Герасимов
Filing date
Publication date
Application filed by Александр Матвеевич Никитинский, Евгений Александрович Герасимов filed Critical Александр Матвеевич Никитинский
Priority to RU2001110013/02A priority Critical patent/RU2204466C2/en
Priority claimed from RU2001110013/02A external-priority patent/RU2204466C2/en
Publication of RU2001110013A publication Critical patent/RU2001110013A/en
Application granted granted Critical
Publication of RU2204466C2 publication Critical patent/RU2204466C2/en

Links

Claims (1)

Флюс для низкотемпературной пайки, содержащий хлорид цинка, хлорид аммония, соляную кислоту и воду, отличающийся тем, что он дополнительно содержит карбамид и гидроксиламин гидрохлорид при следующем соотношении компонентов, мас.%:Low temperature brazing flux containing zinc chloride, ammonium chloride, hydrochloric acid and water, characterized in that it additionally contains urea and hydroxylamine hydrochloride in the following ratio, wt.%: Хлорид цинка 10-40Zinc Chloride 10-40 Хлорид аммония 1-4,5Ammonium Chloride 1-4.5 Соляная кислота 2-5Hydrochloric acid 2-5 Карбамид 0,1-1Urea 0.1-1 Гидроксиламин гидрохлорид 0,05-1Hydroxylamine Hydrochloride 0.05-1 Вода ОстальноеWater Else
RU2001110013/02A 2001-04-12 2001-04-12 Flux for low-temperature soldering RU2204466C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
RU2001110013/02A RU2204466C2 (en) 2001-04-12 2001-04-12 Flux for low-temperature soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2001110013/02A RU2204466C2 (en) 2001-04-12 2001-04-12 Flux for low-temperature soldering

Publications (2)

Publication Number Publication Date
RU2001110013A true RU2001110013A (en) 2003-05-10
RU2204466C2 RU2204466C2 (en) 2003-05-20

Family

ID=20248411

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2001110013/02A RU2204466C2 (en) 2001-04-12 2001-04-12 Flux for low-temperature soldering

Country Status (1)

Country Link
RU (1) RU2204466C2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104646867A (en) * 2015-01-30 2015-05-27 铜陵新鑫焊材有限公司 Copper gas welding solvent and preparation method thereof
CN113681199B (en) * 2021-07-31 2024-01-09 浙江大学山东工业技术研究院 High-performance inorganic soldering flux without strong acid and preparation method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU761206A1 (en) * 1978-12-15 1980-09-17 Nikolaj V Vvedenskij Flux for welding readily-fusable solder
RU2149089C1 (en) * 1998-08-07 2000-05-20 Открытое акционерное общество "ГАЗ" Flux for soldering with fusible solders

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