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PT4332144T - Composição adesiva curável de um componente (1k) - Google Patents

Composição adesiva curável de um componente (1k)

Info

Publication number
PT4332144T
PT4332144T PT221938954T PT22193895T PT4332144T PT 4332144 T PT4332144 T PT 4332144T PT 221938954 T PT221938954 T PT 221938954T PT 22193895 T PT22193895 T PT 22193895T PT 4332144 T PT4332144 T PT 4332144T
Authority
PT
Portugal
Prior art keywords
component
adhesive composition
curable adhesive
curable
composition
Prior art date
Application number
PT221938954T
Other languages
English (en)
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Publication of PT4332144T publication Critical patent/PT4332144T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/372—Sulfides, e.g. R-(S)x-R'
    • C08K5/3725—Sulfides, e.g. R-(S)x-R' containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PT221938954T 2022-09-05 2022-09-05 Composição adesiva curável de um componente (1k) PT4332144T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP22193895.4A EP4332144B1 (en) 2022-09-05 2022-09-05 One component (1k) curable adhesive composition

Publications (1)

Publication Number Publication Date
PT4332144T true PT4332144T (pt) 2025-07-09

Family

ID=87696164

Family Applications (1)

Application Number Title Priority Date Filing Date
PT221938954T PT4332144T (pt) 2022-09-05 2022-09-05 Composição adesiva curável de um componente (1k)

Country Status (10)

Country Link
US (1) US20250197700A1 (pt)
EP (1) EP4332144B1 (pt)
JP (1) JP2025529293A (pt)
KR (1) KR20250065599A (pt)
CN (1) CN119790090A (pt)
ES (1) ES3034838T3 (pt)
PL (1) PL4332144T3 (pt)
PT (1) PT4332144T (pt)
TW (1) TW202421751A (pt)
WO (1) WO2024052060A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4644500A1 (en) 2024-04-30 2025-11-05 Henkel AG & Co. KGaA Two-component (2k) curable adhesive composition

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3113708A (en) 1961-08-09 1963-12-10 Jr William E Moulic Magnetic tape drive mechanism and control therefor
DE1593791A1 (de) 1966-05-04 1970-10-01 Ciba Geigy Latente Haerter und stabile hitzegehaertete Epoxydmassen
US3535342A (en) 1968-02-07 1970-10-20 Dow Chemical Co Process for making alkylene carbonates
US3855040A (en) 1972-07-03 1974-12-17 Loctite Corp Anaerobic compositions
US4250311A (en) 1974-05-02 1981-02-10 General Electric Company P, As, and Sb hexafluoride onium salts as photoinitiators
GB1512982A (en) 1974-05-02 1978-06-01 Gen Electric Salts
IT1034323B (it) 1975-03-17 1979-09-10 Anic Spa Procedimento per la preparazione di alchilencarbonati
US4171240A (en) 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
US4216288A (en) 1978-09-08 1980-08-05 General Electric Company Heat curable cationically polymerizable compositions and method of curing same with onium salts and reducing agents
GB8307613D0 (en) 1983-03-18 1983-04-27 Bp Chem Int Ltd Carbonates
JPS6072917A (ja) 1983-09-30 1985-04-25 Ajinomoto Co Inc エポキシ樹脂用潜在性硬化剤
DE3529263A1 (de) 1985-08-16 1987-02-19 Hoechst Ag Verfahren zur herstellung von 2-oxo-1,3-dioxolanen
US4990281A (en) 1985-08-30 1991-02-05 Loctite Corporation Adhesion promoting primer activator for an anaerobic compositions
US4731146A (en) 1985-08-30 1988-03-15 Loctite Corporation Adhesion promoting primer activator for anaerobic compositions
DE3600602A1 (de) 1986-01-11 1987-07-16 Hoechst Ag Verfahren zur herstellung von 2-oxo-1,3-dioxolanen
US4729797A (en) 1986-12-31 1988-03-08 International Business Machines Corporation Process for removal of cured epoxy
US4833226A (en) 1987-08-26 1989-05-23 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
IE891601L (en) 1989-05-18 1990-11-18 Loctite Ireland Ltd Latent hardeners for epoxy resin compositions
US5650261A (en) 1989-10-27 1997-07-22 Rohm And Haas Company Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system
US5084586A (en) 1990-02-12 1992-01-28 Minnesota Mining And Manufacturing Company Novel initiators for cationic polymerization
US5124417A (en) 1990-02-12 1992-06-23 Minnesota Mining And Manufacturing Company Initiators for cationic polymerization
JPH051225A (ja) 1991-06-25 1993-01-08 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
US5554664A (en) 1995-03-06 1996-09-10 Minnesota Mining And Manufacturing Company Energy-activatable salts with fluorocarbon anions
US5811473A (en) 1996-04-02 1998-09-22 Loctite Corporation Primer activator composition for anaerobic adhesives
US20080196828A1 (en) 1999-07-14 2008-08-21 Gilbert Michael D Electrically Disbonding Adhesive Compositions and Related Methods
US7332218B1 (en) 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
IE20000440A1 (en) 2000-05-31 2003-04-02 Loctite R & D Ltd Semi-Solid one- or two-part compositions
JP4752131B2 (ja) 2001-05-16 2011-08-17 味の素株式会社 エポキシ樹脂用潜在性硬化剤及び硬化性エポキシ樹脂組成物
US20040204551A1 (en) 2003-03-04 2004-10-14 L&L Products, Inc. Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith
US20070269659A1 (en) 2006-05-17 2007-11-22 Eic Laboratories, Inc. Electrically disbondable compositions and related methods
JP5248791B2 (ja) 2007-03-07 2013-07-31 株式会社Ａｄｅｋａ エポキシ樹脂用硬化剤組成物及びそれを用いた硬化性エポキシ樹脂組成物
GB2502554B (en) 2012-05-30 2016-02-03 Henkel Ireland Ltd Primers
US20140287299A1 (en) 2013-03-25 2014-09-25 Apple Inc. Heat-Debonding Adhesives
CN105073821B (zh) 2013-04-05 2017-11-03 气体产品与化学公司 包含羟烷基氨基环烷烃的单组分环氧固化剂
EP3199344B1 (en) * 2016-02-01 2022-04-13 Henkel AG & Co. KGaA Electrical debonding of pu hot melt adhesives by use of conductive inks
EP3835386B8 (en) * 2019-12-13 2024-01-10 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
EP3835383B1 (en) * 2019-12-13 2023-04-12 Henkel AG & Co. KGaA One component (1k) curable adhesive composition

Also Published As

Publication number Publication date
JP2025529293A (ja) 2025-09-04
EP4332144B1 (en) 2025-06-04
PL4332144T3 (pl) 2025-10-13
EP4332144A1 (en) 2024-03-06
CN119790090A (zh) 2025-04-08
WO2024052060A1 (en) 2024-03-14
US20250197700A1 (en) 2025-06-19
TW202421751A (zh) 2024-06-01
ES3034838T3 (en) 2025-08-25
KR20250065599A (ko) 2025-05-13

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