PT3840024T - MODULE FOR THE CHEMICAL TREATMENT OF A SUBSTRATE - Google Patents

MODULE FOR THE CHEMICAL TREATMENT OF A SUBSTRATE

Info

Publication number: PT3840024T
Authority: PT; Portugal
Prior art keywords: module; substrate; chemical treatment; chemical; treatment
Prior art date: 2019-12-20

Application number

PT192185080T

Other languages

Portuguese (pt)

Original Assignee

Semsysco Gmbh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-12-20

Filing date

2019-12-20

Publication date

2022-04-12

2019-12-20 Application filed by Semsysco Gmbh filed Critical Semsysco Gmbh

2022-04-12 Publication of PT3840024T publication Critical patent/PT3840024T/en

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- H10P70/20—
- H10P72/0408—
- H10P72/0414—
- H10P72/0441—
- H10P72/3308—
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- H10P72/0416—
- H10P72/0426—

Landscapes

Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Cleaning Or Drying Semiconductors (AREA)
Cleaning By Liquid Or Steam (AREA)
Treatments Of Macromolecular Shaped Articles (AREA)
Application Of Or Painting With Fluid Materials (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
ing And Chemical Polishing (AREA)
Weting (AREA)

PT192185080T 2019-12-20 2019-12-20 MODULE FOR THE CHEMICAL TREATMENT OF A SUBSTRATE PT3840024T (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
EP19218508.0A EP3840024B1 (en)	2019-12-20	2019-12-20	Module for chemically processing a substrate

Publications (1)

Publication Number	Publication Date
PT3840024T true PT3840024T (en)	2022-04-12

Family

ID=69411088

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PT192185080T PT3840024T (en)	2019-12-20	2019-12-20	MODULE FOR THE CHEMICAL TREATMENT OF A SUBSTRATE

Country Status (10)

Country	Link
US (1)	US11938522B2 (en)
EP (2)	EP3840024B1 (en)
JP (2)	JP7760489B2 (en)
KR (1)	KR20220051004A (en)
CN (1)	CN114144869A (en)
MY (1)	MY195775A (en)
PL (1)	PL3840024T3 (en)
PT (1)	PT3840024T (en)
TW (1)	TWI819302B (en)
WO (1)	WO2021121949A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN114318285B (en) *	2021-12-31	2022-10-18	广东省新兴激光等离子体技术研究院	Vacuum coating equipment and coating method thereof
EP4286560A1 (en) *	2022-05-31	2023-12-06	Semsysco GmbH	Module kit for a chemical and/or electrolytic surface treatment of a substrate
DE102023211090A1 (en) *	2023-11-08	2025-05-08	Semsysco Gmbh	A CLOSURE SYSTEM FOR A TREATMENT CHAMBER

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6227788U (en) *	1985-08-06	1987-02-19
US6240938B1 (en) *	1996-05-29	2001-06-05	Steag Microtech Gmbh	Device for treating substrates in a fluid container
JP2000308857A (en) *	1999-04-27	2000-11-07	Tokyo Electron Ltd	Method and device for liquid treatment
US6457199B1 (en) *	2000-10-12	2002-10-01	Lam Research Corporation	Substrate processing in an immersion, scrub and dry system
US6532974B2 (en) *	2001-04-06	2003-03-18	Akrion Llc	Process tank with pressurized mist generation
US6726848B2 (en) *	2001-12-07	2004-04-27	Scp Global Technologies, Inc.	Apparatus and method for single substrate processing
US20080000495A1 (en) *	2001-12-07	2008-01-03	Eric Hansen	Apparatus and method for single substrate processing
JP3948960B2 (en) *	2002-01-16	2007-07-25	東京エレクトロン株式会社	Ultrasonic cleaning equipment
US7156927B2 (en) *	2002-04-03	2007-01-02	Fsi International, Inc.	Transition flow treatment process and apparatus
US6875289B2 (en) *	2002-09-13	2005-04-05	Fsi International, Inc.	Semiconductor wafer cleaning systems and methods
KR20040041763A (en) *	2002-11-11	2004-05-20	삼성전자주식회사	semiconductor wafer washing system and method there of
JP2006093334A (en) *	2004-09-22	2006-04-06	Ses Co Ltd	Substrate processing equipment
US7775219B2 (en) *	2006-12-29	2010-08-17	Applied Materials, Inc.	Process chamber lid and controlled exhaust
US20080163890A1 (en) *	2007-01-10	2008-07-10	Applied Materials, Inc.	Tunable megasonics cavitation process using multiple transducers for cleaning nanometer particles without structure damage
JP2009125734A (en)	2007-11-28	2009-06-11	Nidec Sankyo Corp	Cleaning apparatus
JP2010125375A (en)	2008-11-27	2010-06-10	Nidec Sankyo Corp	Cleaning device
KR20100066010A (en) *	2008-12-09	2010-06-17	세메스 주식회사	Method and apparatus for cleaning and drying substrates
JP2011165694A (en)	2010-02-04	2011-08-25	Sumco Corp	Ultrasonic cleaning method and ultrasonic cleaning device for wafer
JP5923300B2 (en) *	2011-12-28	2016-05-24	株式会社Ｓｃｒｅｅｎホールディングス	Substrate processing apparatus and substrate processing method
JP6040092B2 (en) *	2013-04-23	2016-12-07	株式会社荏原製作所	Substrate plating apparatus and substrate plating method
JP2015185632A (en) *	2014-03-24	2015-10-22	株式会社荏原製作所	substrate processing apparatus
US11335550B2 (en) *	2017-09-08	2022-05-17	Acm Research (Shanghai) Inc.	Method and apparatus for cleaning semiconductor wafer

2019
- 2019-12-20 PL PL19218508T patent/PL3840024T3/en unknown
- 2019-12-20 PT PT192185080T patent/PT3840024T/en unknown
- 2019-12-20 EP EP19218508.0A patent/EP3840024B1/en active Active
- 2019-12-20 EP EP22156530.2A patent/EP4016597A1/en not_active Withdrawn
2020
- 2020-12-01 JP JP2022508518A patent/JP7760489B2/en active Active
- 2020-12-01 US US17/787,876 patent/US11938522B2/en active Active
- 2020-12-01 KR KR1020227010347A patent/KR20220051004A/en not_active Ceased
- 2020-12-01 MY MYPI2022000527A patent/MY195775A/en unknown
- 2020-12-01 CN CN202080051525.1A patent/CN114144869A/en active Pending
- 2020-12-01 WO PCT/EP2020/084037 patent/WO2021121949A1/en not_active Ceased
2021
- 2021-04-30 TW TW110115820A patent/TWI819302B/en active
2025
- 2025-06-02 JP JP2025091632A patent/JP2025124795A/en active Pending

Also Published As

Publication number	Publication date
PL3840024T3 (en)	2022-05-09
JP2022546224A (en)	2022-11-04
TW202224054A (en)	2022-06-16
KR20220051004A (en)	2022-04-25
WO2021121949A1 (en)	2021-06-24
MY195775A (en)	2023-02-13
CN114144869A (en)	2022-03-04
US20230226578A1 (en)	2023-07-20
US11938522B2 (en)	2024-03-26
EP3840024A1 (en)	2021-06-23
TWI819302B (en)	2023-10-21
JP7760489B2 (en)	2025-10-27
JP2025124795A (en)	2025-08-26
EP3840024B1 (en)	2022-02-16
EP4016597A1 (en)	2022-06-22

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EP3598856C0 (en)	2024-09-18	WIRING SUBSTRATE
PT3840024T (en)	2022-04-12	MODULE FOR THE CHEMICAL TREATMENT OF A SUBSTRATE
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DK3765563T3 (en)	2022-06-20	BIODEGRADABLE COATINGS FOR BIODEGRADABLE SUBSTRATES
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