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PL324177A1 - Method of mounting and integrated circuit on its associated circuit board and mounting unit therefor - Google Patents

Method of mounting and integrated circuit on its associated circuit board and mounting unit therefor

Info

Publication number
PL324177A1
PL324177A1 PL98324177A PL32417798A PL324177A1 PL 324177 A1 PL324177 A1 PL 324177A1 PL 98324177 A PL98324177 A PL 98324177A PL 32417798 A PL32417798 A PL 32417798A PL 324177 A1 PL324177 A1 PL 324177A1
Authority
PL
Poland
Prior art keywords
mounting
circuit board
integrated circuit
unit therefor
mounting unit
Prior art date
Application number
PL98324177A
Inventor
Stephen Wesley Macquarrie
Wayne Russell Storr
James Warren Wilson
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/783,775 external-priority patent/US6150716A/en
Application filed by Ibm filed Critical Ibm
Publication of PL324177A1 publication Critical patent/PL324177A1/en

Links

Classifications

    • H10W78/00—
    • H10W72/071—
    • H10W90/754—
PL98324177A 1997-01-15 1998-01-08 Method of mounting and integrated circuit on its associated circuit board and mounting unit therefor PL324177A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/783,775 US6150716A (en) 1995-01-25 1997-01-15 Metal substrate having an IC chip and carrier mounting

Publications (1)

Publication Number Publication Date
PL324177A1 true PL324177A1 (en) 1998-07-20

Family

ID=25130356

Family Applications (1)

Application Number Title Priority Date Filing Date
PL98324177A PL324177A1 (en) 1997-01-15 1998-01-08 Method of mounting and integrated circuit on its associated circuit board and mounting unit therefor

Country Status (10)

Country Link
JP (1) JP2903013B2 (en)
KR (1) KR100259412B1 (en)
CN (1) CN1132243C (en)
CZ (1) CZ3498A3 (en)
HU (1) HUP9701377A3 (en)
MY (1) MY127468A (en)
PL (1) PL324177A1 (en)
RU (1) RU2191445C2 (en)
SG (1) SG60170A1 (en)
TW (1) TW473887B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2331138C1 (en) * 2006-12-26 2008-08-10 Закрытое акционерное общество "Научно-производственное объединение "НИИТАЛ" (ЗАО "НПО "НИИТАЛ") Integrated circuit case
CN100580919C (en) * 2007-01-23 2010-01-13 南茂科技股份有限公司 Improved deformation of semiconductor package substrates
RU2342736C1 (en) * 2007-03-05 2008-12-27 ФГУП "Центральное конструкторское бюро автоматики" Micropack for chip mounting
RU2481754C1 (en) * 2011-09-13 2013-05-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Printed circuit board on metal substrate and method of its manufacturing
JP5912058B2 (en) 2012-03-30 2016-04-27 株式会社フジクラ Imaging module, imaging module with lens, endoscope, imaging module manufacturing method, flexible wiring board molding apparatus
CN104882531A (en) * 2015-06-08 2015-09-02 杨子龙 LED integrated light-emitting module group
CN113097162A (en) 2017-10-10 2021-07-09 北京比特大陆科技有限公司 Heat dissipation sheet, chip and circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2744685B2 (en) * 1990-08-08 1998-04-28 三菱電機株式会社 Semiconductor device
CA2056456C (en) * 1991-08-14 2001-05-08 Luc Ouellet High performance passivation for semiconductor devices
US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
US5435876A (en) * 1993-03-29 1995-07-25 Texas Instruments Incorporated Grid array masking tape process
US5635762A (en) * 1993-05-18 1997-06-03 U.S. Philips Corporation Flip chip semiconductor device with dual purpose metallized ground conductor
US5616958A (en) * 1995-01-25 1997-04-01 International Business Machines Corporation Electronic package

Also Published As

Publication number Publication date
HU9701377D0 (en) 1997-10-28
KR100259412B1 (en) 2000-06-15
CN1188984A (en) 1998-07-29
SG60170A1 (en) 1999-02-22
RU2191445C2 (en) 2002-10-20
CN1132243C (en) 2003-12-24
HUP9701377A3 (en) 2000-01-28
JP2903013B2 (en) 1999-06-07
HUP9701377A2 (en) 1998-08-28
JPH10209332A (en) 1998-08-07
KR19980070016A (en) 1998-10-26
MY127468A (en) 2006-12-29
CZ3498A3 (en) 1998-11-11
TW473887B (en) 2002-01-21

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