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PH12022551575A1 - Curable resin film, composite sheet, and method for manufacturing semiconductor chip - Google Patents

Curable resin film, composite sheet, and method for manufacturing semiconductor chip

Info

Publication number
PH12022551575A1
PH12022551575A1 PH1/2022/551575A PH12022551575A PH12022551575A1 PH 12022551575 A1 PH12022551575 A1 PH 12022551575A1 PH 12022551575 A PH12022551575 A PH 12022551575A PH 12022551575 A1 PH12022551575 A1 PH 12022551575A1
Authority
PH
Philippines
Prior art keywords
resin film
test piece
curable resin
semiconductor chip
strain
Prior art date
Application number
PH1/2022/551575A
Other languages
English (en)
Inventor
Tomotaka Morishita
Taku Nemoto
Tomonori Shinoda
Keisuke Shinomiya
Sakurako Tamura
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12022551575A1 publication Critical patent/PH12022551575A1/en

Links

Classifications

    • H10W74/131—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H10P52/00—
    • H10P54/00—
    • H10P95/00—
    • H10W72/20—
    • H10W74/01—
    • H10W74/012—
    • H10W74/10—
    • H10W74/15—
    • H10W74/40—
    • H10W95/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H10W72/012—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Forklifts And Lifting Vehicles (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
PH1/2022/551575A 2019-12-27 2020-12-25 Curable resin film, composite sheet, and method for manufacturing semiconductor chip PH12022551575A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019239012 2019-12-27
JP2020031717 2020-02-27
PCT/JP2020/049014 WO2021132679A1 (ja) 2019-12-27 2020-12-25 硬化性樹脂フィルム、複合シート、及び半導体チップの製造方法

Publications (1)

Publication Number Publication Date
PH12022551575A1 true PH12022551575A1 (en) 2023-11-29

Family

ID=76574525

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2022/551575A PH12022551575A1 (en) 2019-12-27 2020-12-25 Curable resin film, composite sheet, and method for manufacturing semiconductor chip

Country Status (6)

Country Link
JP (2) JP7033237B2 (zh)
KR (2) KR102916116B1 (zh)
CN (2) CN114930504B (zh)
PH (1) PH12022551575A1 (zh)
TW (1) TWI877281B (zh)
WO (2) WO2021132680A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023234201A1 (zh) * 2022-06-02 2023-12-07

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3664432B2 (ja) * 2000-05-18 2005-06-29 カシオ計算機株式会社 半導体装置およびその製造方法
US7741397B2 (en) * 2004-03-17 2010-06-22 Dow Global Technologies, Inc. Filled polymer compositions made from interpolymers of ethylene/α-olefins and uses thereof
JP2006028400A (ja) * 2004-07-20 2006-02-02 Hitachi Chem Co Ltd 緩衝性カバーフィルムを備えた接着シート並びに半導体装置及びその製造方法
KR20080003002A (ko) * 2005-04-27 2008-01-04 린텍 가부시키가이샤 시트상 언더필재 및 반도체장치의 제조방법
JP5380806B2 (ja) * 2006-08-31 2014-01-08 日立化成株式会社 接着シート、一体型シート、半導体装置、及び半導体装置の製造方法
JP5830250B2 (ja) 2011-02-15 2015-12-09 日東電工株式会社 半導体装置の製造方法
KR20140036308A (ko) * 2011-07-08 2014-03-25 스미또모 베이크라이트 가부시키가이샤 다이싱 테이프 일체형 접착 시트, 반도체 장치, 다층 회로 기판 및 전자 부품
JP5951207B2 (ja) * 2011-09-14 2016-07-13 リンテック株式会社 ダイシング・ダイボンディングシート
JP6328987B2 (ja) * 2014-04-22 2018-05-23 デクセリアルズ株式会社 半導体装置の製造方法
US9508623B2 (en) 2014-06-08 2016-11-29 UTAC Headquarters Pte. Ltd. Semiconductor packages and methods of packaging semiconductor devices
TWI657510B (zh) 2014-10-02 2019-04-21 日商住友電木股份有限公司 半導體裝置之製造方法及半導體裝置
JP2015092594A (ja) * 2014-12-10 2015-05-14 日東電工株式会社 保護層形成用フィルム
EP3352204A4 (en) * 2015-11-04 2019-03-20 Lintec Corporation CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET
TWI641494B (zh) * 2015-11-04 2018-11-21 日商琳得科股份有限公司 第一保護膜形成用片、第一保護膜形成方法以及半導體晶片的製造方法
KR102587310B1 (ko) * 2015-11-04 2023-10-10 린텍 가부시키가이샤 경화성 수지 필름 및 제1 보호막 형성용 시트
JP6950907B2 (ja) * 2015-11-04 2021-10-13 リンテック株式会社 半導体装置の製造方法
WO2018066302A1 (ja) * 2016-10-05 2018-04-12 リンテック株式会社 第１保護膜形成用シート
JP6975006B2 (ja) * 2016-12-26 2021-12-01 リンテック株式会社 ワークの製造方法
JP7098221B2 (ja) 2017-09-08 2022-07-11 株式会社ディスコ ウェーハの加工方法
JP7233377B2 (ja) * 2017-11-17 2023-03-06 リンテック株式会社 熱硬化性樹脂フィルム及び第１保護膜形成用シート
JP7064184B2 (ja) 2017-12-11 2022-05-10 日東電工株式会社 ダイシングテープ一体型封止用シート及び半導体装置の製造方法
WO2019181447A1 (ja) * 2018-03-20 2019-09-26 リンテック株式会社 加工品の製造方法及び粘着性積層体

Also Published As

Publication number Publication date
KR20220122999A (ko) 2022-09-05
WO2021132680A1 (ja) 2021-07-01
CN114930504A (zh) 2022-08-19
CN114930503A (zh) 2022-08-19
TWI877281B (zh) 2025-03-21
JP7675659B2 (ja) 2025-05-13
TW202140663A (zh) 2021-11-01
CN114930504B (zh) 2026-01-16
JPWO2021132679A1 (zh) 2021-07-01
KR20220122998A (ko) 2022-09-05
TW202140641A (zh) 2021-11-01
JP7033237B2 (ja) 2022-03-09
KR102904195B1 (ko) 2025-12-26
JPWO2021132680A1 (zh) 2021-07-01
WO2021132679A1 (ja) 2021-07-01
KR102916116B1 (ko) 2026-01-22

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