[go: up one dir, main page]

PH12015000103A1 - Processing method for stacked substrate - Google Patents

Processing method for stacked substrate

Info

Publication number
PH12015000103A1
PH12015000103A1 PH12015000103A PH12015000103A PH12015000103A1 PH 12015000103 A1 PH12015000103 A1 PH 12015000103A1 PH 12015000103 A PH12015000103 A PH 12015000103A PH 12015000103 A PH12015000103 A PH 12015000103A PH 12015000103 A1 PH12015000103 A1 PH 12015000103A1
Authority
PH
Philippines
Prior art keywords
substrate
laser processed
processing method
pair
stacked substrate
Prior art date
Application number
PH12015000103A
Other versions
PH12015000103B1 (en
Inventor
Satoshi Kumazawa
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of PH12015000103A1 publication Critical patent/PH12015000103A1/en
Publication of PH12015000103B1 publication Critical patent/PH12015000103B1/en

Links

Classifications

    • H10P54/00—
    • H10W10/00—
    • H10W10/01—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Laser Beam Processing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)

Abstract

Disclosed herein is a processing method for a stacked substrate composed of a first substrate and a second substrate attached through an adhesive layer to the first substrate, the stacked substrate being formed with a plurality of streets each having a predetermined width. The processing method includes a laser processed groove forming step of applying a laser beam having an absorption wavelength to the stacked substrate along the streets from the side of the second substrate, thereby forming a pair of laser processed grooves along the opposite side edges of each street so that each laser processed groove has a depth reaching the first substrate, and a cutting step of cutting the area defined between the pair of laser processed grooves in each street by using a cutting blade having a thickness smaller than the spacing between the pair of laser processed grooves after performing the laser processed groove forming step.
PH12015000103A 2014-04-11 2015-04-08 Processing method for stacked substrate PH12015000103B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014081541A JP6234312B2 (en) 2014-04-11 2014-04-11 Multilayer substrate processing method

Publications (2)

Publication Number Publication Date
PH12015000103A1 true PH12015000103A1 (en) 2016-10-17
PH12015000103B1 PH12015000103B1 (en) 2016-10-17

Family

ID=54275584

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015000103A PH12015000103B1 (en) 2014-04-11 2015-04-08 Processing method for stacked substrate

Country Status (5)

Country Link
JP (1) JP6234312B2 (en)
KR (1) KR102256562B1 (en)
CN (1) CN104979183B (en)
PH (1) PH12015000103B1 (en)
TW (1) TWI640038B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6890885B2 (en) * 2017-04-04 2021-06-18 株式会社ディスコ Processing method
JP7062449B2 (en) * 2018-01-23 2022-05-06 株式会社ディスコ How to cut the workpiece
DE102019124181B4 (en) 2018-09-28 2023-06-15 Taiwan Semiconductor Manufacturing Co., Ltd. Singulation method for stacked semiconductor components and stacked semiconductor device
US11081392B2 (en) 2018-09-28 2021-08-03 Taiwan Semiconductor Manufacturing Co., Ltd. Dicing method for stacked semiconductor devices
KR102152007B1 (en) * 2020-03-18 2020-09-04 주식회사 탑 엔지니어링 Method and apparatus for cutting substrate

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02208954A (en) * 1989-02-08 1990-08-20 Fujitsu Ltd Manufacture of semiconductor device
US6838299B2 (en) * 2001-11-28 2005-01-04 Intel Corporation Forming defect prevention trenches in dicing streets
JP2005064231A (en) * 2003-08-12 2005-03-10 Disco Abrasive Syst Ltd How to divide a plate
JP4422463B2 (en) * 2003-11-07 2010-02-24 株式会社ディスコ Semiconductor wafer dividing method
JP4509820B2 (en) 2005-02-15 2010-07-21 東京エレクトロン株式会社 Heat treatment plate temperature setting method, heat treatment plate temperature setting device, program, and computer-readable recording medium recording the program
US7265034B2 (en) * 2005-02-18 2007-09-04 Taiwan Semiconductor Manufacturing Company, Ltd. Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade
JP2007165789A (en) * 2005-12-16 2007-06-28 Olympus Corp Manufacturing method of semiconductor device
JP2007294729A (en) * 2006-04-26 2007-11-08 Fujikura Ltd Manufacturing method of semiconductor package
US8629532B2 (en) * 2007-05-08 2014-01-14 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer with assisting dicing structure and dicing method thereof
JP2008307646A (en) 2007-06-15 2008-12-25 Disco Abrasive Syst Ltd Cutting equipment
JP2009021476A (en) 2007-07-13 2009-01-29 Disco Abrasive Syst Ltd Wafer division method
JP5536344B2 (en) * 2009-01-09 2014-07-02 株式会社ディスコ Laser processing equipment
JP5381240B2 (en) * 2009-03-31 2014-01-08 凸版印刷株式会社 IC chip and manufacturing method thereof
JP2011146552A (en) * 2010-01-15 2011-07-28 Toshiba Corp Semiconductor device manufacturing method and semiconductor device
JP5431989B2 (en) * 2010-01-29 2014-03-05 株式会社ディスコ Laser processing equipment
JP5995428B2 (en) * 2011-11-11 2016-09-21 株式会社ディスコ Manufacturing method of chip with cover
US8871613B2 (en) * 2012-06-18 2014-10-28 Semiconductor Components Industries, Llc Semiconductor die singulation method

Also Published As

Publication number Publication date
KR20150118024A (en) 2015-10-21
JP2015204314A (en) 2015-11-16
TW201546890A (en) 2015-12-16
CN104979183A (en) 2015-10-14
KR102256562B1 (en) 2021-05-25
TWI640038B (en) 2018-11-01
PH12015000103B1 (en) 2016-10-17
JP6234312B2 (en) 2017-11-22
CN104979183B (en) 2019-06-14

Similar Documents

Publication Publication Date Title
EA201691781A1 (en) METHOD OF CUTTING OF LAMINATED SUPERHTHON GLASS LAYER
MY185736A (en) Dividing method of workpiece and laser processing apparatus
IL250225B (en) Side cutting tool and manufacturing method
PH12015000103A1 (en) Processing method for stacked substrate
MX390431B (en) CORROSION RESISTANT BUSHING.
WO2015095151A3 (en) Laser processing of slots and holes
MY180538A (en) Wafer producing method
MY190869A (en) Wafer processing method
MX377356B (en) METHODS OF MANUFACTURING SECURITY DOCUMENTS AND SECURITY DEVICES.
MX2016015671A (en) Methods and apparatus for elastic deactivation in a laminate.
WO2015113026A3 (en) Edge chamfering by mechanically processing laser cut glass
EP3091102A4 (en) Hard coating, cutting tool, and hard coating manufacturing method
PL3661692T3 (en) Method for laser cutting flat workpieces
MY177494A (en) Wafer producing method
MY198103A (en) Wafer processing method
EP3202527A4 (en) Method for cutting polarizing plate and polarizing plate cut using same
TW201614353A (en) Narrow pre-deposition laser edge deletion
MX2016016607A (en) METHOD FOR FINISHING TEMPERED GEARS.
FI20145757A7 (en) Cutting tool and manufacturing method
EP3308896A4 (en) Laser machining apparatus and laser cutting method
EP3075559A4 (en) Transparent laser marking sheet, laminate, and method for laser marking
EP3142476A4 (en) Cutting blade with transverse hardened regions
IL255614B (en) New compound, material for forming a thin layer and method for producing a thin layer
MY190870A (en) Wafer processing method
EP3266493A4 (en) Transdermal absorption sheet, and method for manufacturing same