PH12012000300A1 - Sheet-molded chip-scale package - Google Patents
Sheet-molded chip-scale packageInfo
- Publication number
- PH12012000300A1 PH12012000300A1 PH1/2012/000300A PH12012000300A PH12012000300A1 PH 12012000300 A1 PH12012000300 A1 PH 12012000300A1 PH 12012000300 A PH12012000300 A PH 12012000300A PH 12012000300 A1 PH12012000300 A1 PH 12012000300A1
- Authority
- PH
- Philippines
- Prior art keywords
- sheet
- scale package
- molded chip
- die
- conductive pillar
- Prior art date
Links
Classifications
-
- H10W72/012—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packaging Frangible Articles (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Embodiments include but are not limited to apparatuses and systems including a microelectronic device including a die having a first surface and a second surface opposite the first surface, a conductive pillar formed on the first surface of the die, and an encapsulant material encasing the die, including covering the first surface, the second surface, and at least a portion of a side surface of the conductive pillar. Methods for making the same also are described.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/252,083 US8487435B2 (en) | 2008-09-09 | 2011-10-03 | Sheet-molded chip-scale package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PH12012000300A1 true PH12012000300A1 (en) | 2015-07-10 |
Family
ID=48022351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH1/2012/000300A PH12012000300A1 (en) | 2011-10-03 | 2012-10-03 | Sheet-molded chip-scale package |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103035589B (en) |
| PH (1) | PH12012000300A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9362191B2 (en) * | 2013-08-29 | 2016-06-07 | Infineon Technologies Austria Ag | Encapsulated semiconductor device |
| US10797019B2 (en) | 2016-08-31 | 2020-10-06 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method for manufacturing the same |
| CN111584478B (en) * | 2020-05-22 | 2022-02-18 | 甬矽电子(宁波)股份有限公司 | Laminated chip packaging structure and laminated chip packaging method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7476980B2 (en) * | 2006-06-27 | 2009-01-13 | Infineon Technologies Ag | Die configurations and methods of manufacture |
| US7829380B2 (en) * | 2006-10-31 | 2010-11-09 | Qimonda Ag | Solder pillar bumping and a method of making the same |
-
2012
- 2012-10-03 PH PH1/2012/000300A patent/PH12012000300A1/en unknown
- 2012-10-08 CN CN201210378005.9A patent/CN103035589B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103035589B (en) | 2017-01-04 |
| CN103035589A (en) | 2013-04-10 |
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