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PH12011000222A1 - Apparatus for wafer inspection - Google Patents

Apparatus for wafer inspection

Info

Publication number
PH12011000222A1
PH12011000222A1 PH1/2011/000222A PH12011000222A PH12011000222A1 PH 12011000222 A1 PH12011000222 A1 PH 12011000222A1 PH 12011000222 A PH12011000222 A PH 12011000222A PH 12011000222 A1 PH12011000222 A1 PH 12011000222A1
Authority
PH
Philippines
Prior art keywords
wafer
camera
continuously formed
prism sheet
stripe shape
Prior art date
Application number
PH1/2011/000222A
Inventor
Chang Keun Koo
Original Assignee
Hanmi Semiconductos Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmi Semiconductos Co Ltd filed Critical Hanmi Semiconductos Co Ltd
Publication of PH12011000222A1 publication Critical patent/PH12011000222A1/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S50/00—Monitoring or testing of PV systems, e.g. load balancing or fault identification
    • H02S50/10—Testing of PV devices, e.g. of PV modules or single PV cells
    • H02S50/15—Testing of PV devices, e.g. of PV modules or single PV cells using optical means, e.g. using electroluminescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)

Abstract

Disclosed herein is an apparatus for inspecting a wafer, a surface of which is continuously formed with a plurality of saw marks having an elongated stripe shape in one direction. The apparatus includes a transfer unit successively and horizontally transferring the wafer in one direction, a camera disposed in a transferring path for the wafer and photographing the wafer transferred by the transfer unit, a lighting unit disposed opposite the camera and providing light toward the wafer to photograph the wafer, and a prism sheet located between the camera and the lighting unit. Here, the prism sheet is continuously formed on a surface thereof with a plurality of uneven patterns having an elongated stripe shape in one direction.
PH1/2011/000222A 2010-07-13 2011-06-30 Apparatus for wafer inspection PH12011000222A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100067556A KR101115010B1 (en) 2010-07-13 2010-07-13 Apparatus for Wafer Inspection

Publications (1)

Publication Number Publication Date
PH12011000222A1 true PH12011000222A1 (en) 2013-04-08

Family

ID=45483279

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2011/000222A PH12011000222A1 (en) 2010-07-13 2011-06-30 Apparatus for wafer inspection

Country Status (4)

Country Link
KR (1) KR101115010B1 (en)
CN (1) CN102331428B (en)
PH (1) PH12011000222A1 (en)
TW (1) TWI473988B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130113677A (en) * 2012-04-06 2013-10-16 한미반도체 주식회사 Wafer inspection device
US9164043B2 (en) 2012-12-10 2015-10-20 Shenzhen China Star Optoelectronics Technology Co., Ltd. Detecting method and detecting device
CN102980897A (en) * 2012-12-10 2013-03-20 深圳市华星光电技术有限公司 Detection method and detection device
KR102161160B1 (en) 2013-10-31 2020-09-29 삼성전자주식회사 Method of inspecting a surface of a substrate and apparatus for performing the same
CN105448783A (en) * 2015-12-28 2016-03-30 江苏创基新能源有限公司 Excessive adhesive inspection device of frame element
CN108172525B (en) * 2017-12-11 2020-09-18 中建材浚鑫科技有限公司 A photovoltaic laminate stacking device and stacking method thereof
CN112737502B (en) * 2020-11-24 2022-08-26 晶澳（邢台）太阳能有限公司 Production equipment of solar cell module and volt-ampere characteristic testing method
CN112635590B (en) * 2020-12-18 2023-04-18 晶澳太阳能有限公司 Preparation method of high-efficiency monocrystalline silicon SE-PERC battery piece

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7315361B2 (en) * 2005-04-29 2008-01-01 Gsi Group Corporation System and method for inspecting wafers in a laser marking system
JP4878907B2 (en) * 2006-05-08 2012-02-15 三菱電機株式会社 Image inspection apparatus and image inspection method using the image inspection apparatus
JP2008026212A (en) * 2006-07-24 2008-02-07 Ushio Inc Pattern inspection device
KR100805076B1 (en) 2006-10-12 2008-02-20 주식회사 디이엔티 Wafer Inspection Equipment
FR2914422B1 (en) * 2007-03-28 2009-07-03 Soitec Silicon On Insulator METHOD FOR DETECTING SURFACE DEFECTS OF A SUBSTRATE AND DEVICE USING THE SAME

Also Published As

Publication number Publication date
TWI473988B (en) 2015-02-21
TW201202688A (en) 2012-01-16
KR101115010B1 (en) 2012-03-06
KR20120006860A (en) 2012-01-19
CN102331428A (en) 2012-01-25
CN102331428B (en) 2015-03-25

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