[go: up one dir, main page]

LT3311947T - Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas - Google Patents

Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas

Info

Publication number
LT3311947T
LT3311947T LTEP17193886.3T LT17193886T LT3311947T LT 3311947 T LT3311947 T LT 3311947T LT 17193886 T LT17193886 T LT 17193886T LT 3311947 T LT3311947 T LT 3311947T
Authority
LT
Lithuania
Prior art keywords
methods
laser processing
beam spots
axisymmetric beam
transparent workpieces
Prior art date
Application number
LTEP17193886.3T
Other languages
English (en)
Inventor
Garrett Andrew Piech
Sergio Tsuda
James Andrew West
Ravindra Kumar AKARAPU
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59930287&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=LT3311947(T) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from NL2017998A external-priority patent/NL2017998B1/en
Application filed by Corning Incorporated filed Critical Corning Incorporated
Publication of LT3311947T publication Critical patent/LT3311947T/lt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
LTEP17193886.3T 2016-09-30 2017-09-28 Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas LT3311947T (lt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662402337P 2016-09-30 2016-09-30
NL2017998A NL2017998B1 (en) 2016-12-14 2016-12-14 Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots

Publications (1)

Publication Number Publication Date
LT3311947T true LT3311947T (lt) 2019-12-27

Family

ID=59930287

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEP17193886.3T LT3311947T (lt) 2016-09-30 2017-09-28 Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas

Country Status (2)

Country Link
EP (2) EP3597353A1 (lt)
LT (1) LT3311947T (lt)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
JP2017521259A (ja) 2014-07-08 2017-08-03 コーニング インコーポレイテッド 材料をレーザ加工するための方法および装置
LT3169477T (lt) 2014-07-14 2020-05-25 Corning Incorporated Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami
WO2016154284A1 (en) 2015-03-24 2016-09-29 Corning Incorporated Laser cutting and processing of display glass compositions
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
DE102018204250B4 (de) * 2018-03-20 2023-10-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Laserstrahlschneiden von Werkstücken
JP2022519724A (ja) * 2019-02-08 2022-03-24 コーニング インコーポレイテッド パルスレーザビーム焦点レンズおよび蒸気エッチングを使用して透明なワークピースをレーザ加工するための方法
US11344972B2 (en) * 2019-02-11 2022-05-31 Corning Incorporated Laser processing of workpieces
KR20210141570A (ko) 2019-03-21 2021-11-23 코닝 인코포레이티드 환형 볼텍스 레이저 빔을 사용하는 유리-기반 물체에 마이크로-홀을 형성하기 위한 시스템 및 방법
CN114096371B (zh) * 2019-05-17 2024-02-02 康宁股份有限公司 用于透明工件的大角度激光加工的相位修改准非衍射激光射束
EP3990209B1 (en) 2019-07-01 2023-10-04 Corning Incorporated Method of laser processing of transparent workpieces using curved quasi-non-diffracting laser beams
EP4078270A4 (en) * 2019-12-19 2024-01-03 Thermo Scientific Portable Analytical Instruments Inc. Adjustable extended focus raman system
DE102020117213A1 (de) * 2020-06-30 2021-12-30 Schott Ag Glaskeramikartikel, Verfahren zu dessen Herstellung und dessen Verwendung
US12434331B2 (en) * 2020-09-11 2025-10-07 Corning Incorporated Laser forming non-square edges in transparent workpieces using modified airy beams
DE102020132700A1 (de) * 2020-12-08 2022-06-09 Trumpf Laser- Und Systemtechnik Gmbh Hochenergieglasschneiden
DE102020132797A1 (de) * 2020-12-09 2022-06-09 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung zum Bearbeiten eines Materials
DE102020134198A1 (de) 2020-12-18 2022-06-23 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Trennen eines Materials
DE102020134197A1 (de) 2020-12-18 2022-06-23 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Trennen eines Materials
DE102021100675B4 (de) 2021-01-14 2022-08-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zum Zerteilen eines transparenten Werkstücks
CN115041815B (zh) * 2021-02-26 2025-10-10 深圳市大族半导体装备科技有限公司 一种脆性材料的激光加工系统及加工方法
DE102021123801A1 (de) 2021-06-02 2022-12-08 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks
WO2022253606A1 (de) 2021-06-02 2022-12-08 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und vorrichtung zur laserbearbeitung eines werkstücks
DE102021123962A1 (de) 2021-09-16 2023-03-16 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks
DE102021130129A1 (de) 2021-11-18 2023-05-25 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Laserbearbeitung eines Werkstücks
DE102022110353A1 (de) 2022-04-28 2023-11-02 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Trennung eines Werkstücks
KR102889888B1 (ko) 2022-05-26 2025-11-21 트룸프 (차이나) 컴퍼니 리미티드 공작물의 레이저 가공 방법
DE102022115711A1 (de) 2022-06-23 2023-12-28 Schott Ag Verfahren und Vorrichtung zum Bearbeiten von Werkstücken
DE102022130022A1 (de) 2022-11-14 2024-05-16 Trumpf Laser Gmbh Verfahren und Vorrichtung zur Laserbearbeitung eines Werkstücks
DE102022131536A1 (de) 2022-11-29 2024-05-29 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Lasersystem zum Trennen eines Werkstücks
CN115856066A (zh) * 2022-12-01 2023-03-28 暨南大学 一种基质辅助激光解吸飞行时间的光路系统及质谱仪
CN115647578A (zh) * 2022-12-28 2023-01-31 歌尔股份有限公司 激光加工方法
CN119270499B (zh) * 2024-09-13 2025-10-03 中国人民解放军63892部队 一种近场等效远场激光光斑的光路设计方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4880820B2 (ja) * 2001-01-19 2012-02-22 株式会社レーザーシステム レーザ支援加工方法
JP4418282B2 (ja) * 2004-03-31 2010-02-17 株式会社レーザーシステム レーザ加工方法
DE102006042280A1 (de) 2005-09-08 2007-06-06 IMRA America, Inc., Ann Arbor Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
US8338744B2 (en) 2006-11-30 2012-12-25 Sumitomo Electric Industries, Ltd. Condensing optical system, laser processing method and apparatus, and manufacturing method of brittle material blank
WO2009012913A1 (de) 2007-07-21 2009-01-29 Keming Du Optische anordnung zur erzeugung von multistrahlen
US9701581B2 (en) * 2009-06-04 2017-07-11 Corelase Oy Method and apparatus for processing substrates using a laser
FR2989294B1 (fr) 2012-04-13 2022-10-14 Centre Nat Rech Scient Dispositif et methode de nano-usinage par laser
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
DE102014201739B4 (de) 2014-01-31 2021-08-12 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitungsvorrichtung sowie Verfahren zum Erzeugen zweier Teilstrahlen
EP2913137A1 (de) 2014-02-26 2015-09-02 Bystronic Laser AG Laserbearbeitungsvorrichtung und Verfahren
LT3169477T (lt) * 2014-07-14 2020-05-25 Corning Incorporated Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami
DE102014213775B4 (de) 2014-07-15 2018-02-15 Innolas Solutions Gmbh Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
KR102138964B1 (ko) 2014-11-19 2020-07-28 트룸프 레이저-운트 시스템테크닉 게엠베하 비대칭 광학 빔 정형을 위한 시스템
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams

Also Published As

Publication number Publication date
EP3311947A1 (en) 2018-04-25
EP3597353A1 (en) 2020-01-22
EP3311947B1 (en) 2019-11-20

Similar Documents

Publication Publication Date Title
LT3311947T (lt) Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas
PL3661692T3 (pl) Sposób cięcia laserowego płytowych przedmiotów obrabianych
LT2965852T (lt) Lazerinio pluošto formuotuvas
SG10201608478VA (en) Laser processing apparatus
SG10201505770SA (en) Laser beam spot shape detection method
SG10201602703WA (en) Laser processing apparatus
LT2965853T (lt) Medžiagos apdorojimas, naudojant pailgintuosius lazerio spindulius
SG10201602308RA (en) Laser processing apparatus
GB201712639D0 (en) Method for laser machining inside materials
LT3302866T (lt) Puslaidininkinio ruošinio raižymo lazeriu būdas naudojant padalintus lazerio pluoštus
SG10201607633RA (en) Laser processing apparatus
HUE050188T2 (hu) Kezdeti távolságfelvétel lézeres megmunkálásához
EP3154772A4 (en) Methods for processing three-dimensional printed objects using microwave radiation
EP3251784A4 (en) Laser processing machine and laser processing method
SG10201508134VA (en) Workpiece Processing Method
PL3145685T3 (pl) Sposób, urządzenie i ploter laserowy do obróbki przedmiotów
SG10201506677UA (en) Laser processing apparatus
SG10201607299WA (en) Laser processing apparatus
SG11201703670PA (en) Machining apparatus for workpiece
SG11201709412PA (en) Workpiece processing apparatus
SG10201510549SA (en) Laser machining apparatus
EP3308896A4 (en) Laser machining apparatus and laser cutting method
SG10201700917TA (en) Workpiece processing method
PL3124163T3 (pl) Układ i sposób obróbki laserowej
SG10201704121WA (en) Leakage laser beam detecting method