LT2014504A - Skaidrių terpių lazerinis pjovimo būdas ir įrenginys - Google Patents
Skaidrių terpių lazerinis pjovimo būdas ir įrenginysInfo
- Publication number
- LT2014504A LT2014504A LT2014504A LT2014504A LT2014504A LT 2014504 A LT2014504 A LT 2014504A LT 2014504 A LT2014504 A LT 2014504A LT 2014504 A LT2014504 A LT 2014504A LT 2014504 A LT2014504 A LT 2014504A
- Authority
- LT
- Lithuania
- Prior art keywords
- laser radiation
- focal planes
- pulses
- different
- different wavelengths
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000003698 laser cutting Methods 0.000 title 1
- 230000005855 radiation Effects 0.000 abstract 6
- 230000003111 delayed effect Effects 0.000 abstract 1
- 230000002123 temporal effect Effects 0.000 abstract 1
- 239000012780 transparent material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
- B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
Išradimas yra susijęs su skaidrių terpių lazeriniu pjovimu, pagrįstu dviejų ultra-trumpų impulsų lazerinės spinduliuotės bangos ilgių panaudojimu ir jų laikiniu ir/arba erdviniu suderinimu. Pasiūlytas būdas apima dviejų skirtingų bangos ilgių impulsinės lazerio spinduliuotės pluošto fokusavimą apdirbamos skaidrios terpės viduje jos pjovimo srityje skirtingose fokusavimo plokštumose pagal apdirbamos terpės gylį, kur minėtų skirtingų bangos ilgių lazerio spinduliuočių impulsai į jų fokusavimo plokštumas ateina skirtingu laiku, kur ilgesnio bangos ilgio lazerio spinduliuotės impulsai yra užvėlinti trumpesnio bangos ilgio spinduliuotės impulsų atžvilgiu. Pjovimo greitį ir kokybę valdo eksperimentiškai parenkant minėtų skirtingų bangos ilgių lazerio spinduliuočių impulsų užvėlinimo laiką, jų fokusavimo plokštumų erdvinę padėtį viena kitos atžvilgiu bei skirtingų bangos ilgių spinduliuočių impulsų energijų santykį.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT2014504A LT6240B (lt) | 2014-05-16 | 2014-05-16 | Skaidrių terpių lazerinis pjovimo būdas ir įrenginys |
| LTEP15157127.0T LT2944412T (lt) | 2014-05-16 | 2015-03-02 | Skaidrių terpių lazerinis pjovimo būdas ir įrenginys |
| EP15157127.0A EP2944412B1 (en) | 2014-05-16 | 2015-03-02 | Method and apparatus for laser cutting of transparent media |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT2014504A LT6240B (lt) | 2014-05-16 | 2014-05-16 | Skaidrių terpių lazerinis pjovimo būdas ir įrenginys |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| LT2014504A true LT2014504A (lt) | 2015-11-25 |
| LT6240B LT6240B (lt) | 2016-01-25 |
Family
ID=52589300
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LT2014504A LT6240B (lt) | 2014-05-16 | 2014-05-16 | Skaidrių terpių lazerinis pjovimo būdas ir įrenginys |
| LTEP15157127.0T LT2944412T (lt) | 2014-05-16 | 2015-03-02 | Skaidrių terpių lazerinis pjovimo būdas ir įrenginys |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LTEP15157127.0T LT2944412T (lt) | 2014-05-16 | 2015-03-02 | Skaidrių terpių lazerinis pjovimo būdas ir įrenginys |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2944412B1 (lt) |
| LT (2) | LT6240B (lt) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017203655B4 (de) * | 2017-03-07 | 2019-08-22 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Formung von Strahlung für die Laserbearbeitung |
| US11482826B2 (en) * | 2018-01-12 | 2022-10-25 | Ricoh Company, Ltd. | Optical processing apparatus, optical processing method, and optically-processed product production method |
| CN109623155B (zh) * | 2018-11-14 | 2020-07-10 | 吉林大学 | 利用多光子激发进行近4π立体角飞秒激光直写加工的方法及应用 |
| LT6791B (lt) * | 2019-05-15 | 2020-12-28 | Uab "Altechna R&D" | Skaidrių medžiagų apdirbimo būdas ir įrenginys |
| US11646228B2 (en) * | 2019-09-11 | 2023-05-09 | Chongqing Institute Of East China Normal University | Stealth dicing method including filamentation and apparatus thereof |
| CN112003119B (zh) * | 2020-07-30 | 2022-03-04 | 北京空间机电研究所 | 一种长寿命双色双脉冲飞秒激光产生装置及方法 |
| CN112620964B (zh) * | 2021-03-15 | 2021-06-04 | 金洲数控(北京)软件技术有限公司 | 一种基于包覆建模的激光加工控制方法 |
| US12313856B2 (en) * | 2021-04-08 | 2025-05-27 | Corning Incorporated | Real-time modification of line focus intensity distribution |
| CN114406497B (zh) * | 2022-02-22 | 2023-12-19 | 宁波飞纳激光科技有限公司 | 一种激光加工系统 |
| CN116329741B (zh) * | 2023-04-27 | 2025-10-24 | 杭州银湖激光科技有限公司 | 一种玻璃切割方法 |
| CN116252054B (zh) * | 2023-04-28 | 2025-10-17 | 杭州银湖激光科技有限公司 | 一种玻璃的激光切割方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4838531B2 (ja) * | 2005-04-27 | 2011-12-14 | サイバーレーザー株式会社 | 板状体切断方法並びにレーザ加工装置 |
| US9138913B2 (en) | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| JP2007142000A (ja) | 2005-11-16 | 2007-06-07 | Denso Corp | レーザ加工装置およびレーザ加工方法 |
| KR20070097189A (ko) * | 2006-03-28 | 2007-10-04 | 삼성전자주식회사 | 기판 절단 방법 및 이에 사용되는 기판 절단 장치 |
| JP5103054B2 (ja) * | 2007-04-27 | 2012-12-19 | サイバーレーザー株式会社 | レーザによる加工方法およびレーザ加工装置 |
| EP2593266A4 (en) | 2010-07-12 | 2017-04-26 | Rofin-Sinar Technologies, Inc. | Method of material processing by laser filamentation |
-
2014
- 2014-05-16 LT LT2014504A patent/LT6240B/lt not_active IP Right Cessation
-
2015
- 2015-03-02 EP EP15157127.0A patent/EP2944412B1/en not_active Not-in-force
- 2015-03-02 LT LTEP15157127.0T patent/LT2944412T/lt unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2944412A1 (en) | 2015-11-18 |
| LT2944412T (lt) | 2017-02-10 |
| LT6240B (lt) | 2016-01-25 |
| EP2944412B1 (en) | 2016-11-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BB1A | Patent application published |
Effective date: 20151125 |
|
| FG9A | Patent granted |
Effective date: 20160125 |
|
| MM9A | Lapsed patents |
Effective date: 20170516 |