[go: up one dir, main page]

LT2010065A - Stencil for solder paste or glue application - Google Patents

Stencil for solder paste or glue application

Info

Publication number
LT2010065A
LT2010065A LT2010065A LT2010065A LT2010065A LT 2010065 A LT2010065 A LT 2010065A LT 2010065 A LT2010065 A LT 2010065A LT 2010065 A LT2010065 A LT 2010065A LT 2010065 A LT2010065 A LT 2010065A
Authority
LT
Lithuania
Prior art keywords
stencil
solder paste
stencil printing
glue application
perforation
Prior art date
Application number
LT2010065A
Other languages
Lithuanian (lt)
Other versions
LT5825B (en
Inventor
Michail ČERKASOV
Original Assignee
Uab "Laser Stencil Europe", ,
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uab "Laser Stencil Europe", , filed Critical Uab "Laser Stencil Europe", ,
Priority to LT2010065A priority Critical patent/LT5825B/en
Publication of LT2010065A publication Critical patent/LT2010065A/en
Publication of LT5825B publication Critical patent/LT5825B/en

Links

Landscapes

  • Printing Plates And Materials Therefor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

This invention relates to stencil printing equipment production and stencil printing technology. Stencil of solid metal for application of solder paste or glue in the field of stencil printing technology. For better quality and more solid tighteningon the frame the perforation in the peripheral areas is carried out as rectangular shaped holes. When it is linked towards the center of the stencil the perforation holes part is rounded oval shape, and in the corners there are rounded cutouts.
LT2010065A 2010-09-06 2010-09-06 Stencil for solder paste or glue application LT5825B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
LT2010065A LT5825B (en) 2010-09-06 2010-09-06 Stencil for solder paste or glue application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LT2010065A LT5825B (en) 2010-09-06 2010-09-06 Stencil for solder paste or glue application

Publications (2)

Publication Number Publication Date
LT2010065A true LT2010065A (en) 2012-03-26
LT5825B LT5825B (en) 2012-04-25

Family

ID=45840995

Family Applications (1)

Application Number Title Priority Date Filing Date
LT2010065A LT5825B (en) 2010-09-06 2010-09-06 Stencil for solder paste or glue application

Country Status (1)

Country Link
LT (1) LT5825B (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2264460B (en) 1992-06-03 1994-02-16 David Godfrey Williams Improved stencil or mask for applying solder to circuit boards and support frame
GB2276589B (en) 1993-04-03 1996-07-31 David Godfrey Williams Improved stencil or mask for applying solder to circuit boards
US6158339A (en) 1999-01-29 2000-12-12 Alpha Metals, Inc. Stencil holder assembly for use with solder paste stencil printers
DE20316711U1 (en) 2003-10-29 2004-03-04 Limab Gmbh Viscose paste printing apparatus e.g. for solder paste for mounting components on circuit boards, has massive pressing piece, printing stencil made of flexible material and substrate carrier
DE502005004095D1 (en) 2004-10-25 2008-06-26 Metaq Gmbh Printing template, clamping frame for clamping the printing stencil and method and apparatus for producing the printing stencil
SE527993C2 (en) 2004-12-10 2006-08-01 Hp Etch Ab Solder paste stencil and method of manufacturing the same
JP4817139B2 (en) 2004-12-22 2011-11-16 株式会社プロセス・ラボ・ミクロン Mask for stencil printing and manufacturing method thereof
DE102005054225A1 (en) 2005-11-14 2007-05-16 Bernd Fromm Stencil holder for screen printing for mounting components on circuit board
KR100801010B1 (en) 2006-06-30 2008-02-04 한국 고덴시 주식회사 Remote control receiving module and manufacturing method thereof
CN101318401B (en) 2007-06-08 2010-12-29 富葵精密组件(深圳)有限公司 Screen printing plate and manufacturing method thereof
CN101301808B (en) 2008-04-11 2010-12-15 深圳光韵达光电科技股份有限公司 Surface mounting technology print stencil net frame

Also Published As

Publication number Publication date
LT5825B (en) 2012-04-25

Similar Documents

Publication Publication Date Title
AU2018260808A1 (en) Compounds and uses thereof for the modulation of hemoglobin
WO2016080645A3 (en) Ammonia synthesis apparatus
EP3093098A4 (en) Solder alloy, solder paste and electronic circuit board
WO2015057654A3 (en) Techniques for enabling asynchronous communications using unlicensed radio frequency spectrum
MY180206A (en) Compounds and uses thereof for the modulation of hemoglobin
SG179972A1 (en) Process for production of core-shell particles, core-shell particles, and paste composition and sheet composition which contain same
MX2015011509A (en) Compounds and uses thereof for the modulation of hemoglobin.
EP3205647A3 (en) 2-(pyrimidin-5-yl)-thiopyrimidine derivatives as hsp70 and hsc70 modulators for the treatment of proliferative disorders
TWI561128B (en) Print circuit board and method of manufacturing the same
EP3326745A4 (en) Solder alloy, solder paste, and electronic circuit board
ZA201008398B (en) An electrochemically active composition,methods of making,and uses thereof
EP2471185A4 (en) Integrated circuits, communication units and methods of cancellation of intermodulation distortion
WO2011107186A3 (en) Compounds for electronic devices
WO2011057706A8 (en) Materials for electronic devices
ZA201503360B (en) Intaglio printing press and method of monitoring operation of the same
EP2465973A3 (en) Plating catalyst and method
WO2012023691A3 (en) Printing composition and a printing method using the same
EP2524763A4 (en) Solder paste
EP3335829A4 (en) Flux composition, solder paste composition, and electronic circuit board
EP2537961A4 (en) Electrode base, negative electrode for aqueous solution electrolysis using same, method for producing the electrode base, and method for producing the negative electrode for aqueous solution electrolysis
EP3000612A4 (en) Structure and stencil printing plate which have been subjected to wettability-improving surface modification, and processes for producing both
MX2012006423A (en) Cosmetic powder bead compositions.
MY165607A (en) Solder alloy, solder paste, and electronic circuit board
MY174720A (en) Communication method and user equipment in mixed cellular and d2d network
PH12013500275A1 (en) Novel trpv3 modulators

Legal Events

Date Code Title Description
MM9A Lapsed patents

Effective date: 20150906