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KR980006138A - Wafer Sawing Method - Google Patents

Wafer Sawing Method Download PDF

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Publication number
KR980006138A
KR980006138A KR1019960020181A KR19960020181A KR980006138A KR 980006138 A KR980006138 A KR 980006138A KR 1019960020181 A KR1019960020181 A KR 1019960020181A KR 19960020181 A KR19960020181 A KR 19960020181A KR 980006138 A KR980006138 A KR 980006138A
Authority
KR
South Korea
Prior art keywords
wafer
chips
sawing
sawing method
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019960020181A
Other languages
Korean (ko)
Inventor
이관재
송영희
Original Assignee
김광호
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자주식회사 filed Critical 김광호
Priority to KR1019960020181A priority Critical patent/KR980006138A/en
Publication of KR980006138A publication Critical patent/KR980006138A/en
Withdrawn legal-status Critical Current

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Classifications

    • H10P54/00—
    • H10P72/7402—
    • H10P72/7416—

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

본 발명은 쏘잉 공정이 실시되는 동안 칩들의 상, 하면 가장자리르 따라 챔버를 형성하거나 칩들의 후면에 홈들을 형성하여 성형 수지와 상기 칩들의 표면 가장자리에 스트레스가 집중되는 것을 방지하여 LOC 반도체 칩 패키지의 신뢰성을 향상시킨다.According to the present invention, a chamber is formed along upper and lower edges of chips or grooves are formed on the rear surfaces of chips during the sawing process, thereby preventing stress from being concentrated on the molding resin and the surface edges of the chips. Improve reliability

Description

웨이퍼 쏘잉 방법Wafer Sawing Method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 의한 웨이퍼 쏘잉 방법을 나타낸 상태도.2 is a state diagram showing a wafer sawing method according to the present invention.

Claims (5)

웨이퍼 쏘잉 방법에 있어서, 웨이퍼의 후면에 접착 테이프를 접착한 후 상기 웨이퍼의 전면을 칩들을 위한 크기로 한정하도록 소정의 형태로 커팅하는 단계와, 상기 웨이퍼의 전면을 별도의 다른 접착 테이프에 접착한 후 상기 웨이퍼의 후면을 칩들을 위한 크기로 한정하도록 소정의 형태로 커팅하는 단계와, 상기 후면의 커팅된 영역을 따라 상기 웨이퍼를 스크라이빙하여 각각의 칩들을 분리하는 단계를 포함하는 웨이퍼 쏘잉 방법.A method of sawing a wafer, the method comprising: bonding an adhesive tape to a rear surface of a wafer and cutting the front surface of the wafer into a predetermined shape to limit the size of the wafer to chips; and attaching the front surface of the wafer to another adhesive tape. And then cutting the back surface of the wafer into a predetermined shape to define a size for the chips, and scribing the wafer along the cut area of the back surface to separate the respective chips. . 제1항에 있어서, 상기 웨이퍼의 상, 하면을 베벨 커팅하는 것을 특징으로 하는 웨이퍼 쏘잉 방법.The wafer sawing method according to claim 1, wherein the upper and lower surfaces of the wafer are beveled. 제1항 또는 제2항에 있어서, 상기 웨이퍼의 두께보다 작은 깊이로 베벨 커팅하는 것을 특징으로 하는 웨이퍼 쏘잉 방법.The wafer sawing method according to claim 1 or 2, wherein the wafer is beveled to a depth smaller than the thickness of the wafer. 웨이퍼 쏘잉 방법에 있어서, 웨이퍼의 전면에 접착 테이프를 접착한 후 분리될 칩들에 해당하는 영역의 상기 웨이퍼의 후면에 소정의 깊이로 홈들을 형성한 후 상기 웨이퍼의 후면을 스크라이빙하여 칩들을 각각 분리하는 것을 특징으로 하는 웨이퍼 쏘잉 방법.In the wafer sawing method, after the adhesive tape is adhered to the front surface of the wafer, grooves are formed at a predetermined depth in the back surface of the wafer in the region corresponding to the chips to be separated, and then the back surfaces of the wafer are scribed to form chips. Wafer sawing method characterized in that the separation. 제4항에 있어서, 상기 홈들의 깊이가 상기 웨이퍼의 두께보다 작은 것을 특징으로 하는 웨이퍼 쏘잉 방법.5. The method of claim 4, wherein the depth of the grooves is less than the thickness of the wafer.
KR1019960020181A 1996-06-07 1996-06-07 Wafer Sawing Method Withdrawn KR980006138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960020181A KR980006138A (en) 1996-06-07 1996-06-07 Wafer Sawing Method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960020181A KR980006138A (en) 1996-06-07 1996-06-07 Wafer Sawing Method

Publications (1)

Publication Number Publication Date
KR980006138A true KR980006138A (en) 1998-03-30

Family

ID=66284753

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960020181A Withdrawn KR980006138A (en) 1996-06-07 1996-06-07 Wafer Sawing Method

Country Status (1)

Country Link
KR (1) KR980006138A (en)

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