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KR960009774A - Clock fault detection circuit of all electronic switch - Google Patents

Clock fault detection circuit of all electronic switch Download PDF

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Publication number
KR960009774A
KR960009774A KR1019940019402A KR19940019402A KR960009774A KR 960009774 A KR960009774 A KR 960009774A KR 1019940019402 A KR1019940019402 A KR 1019940019402A KR 19940019402 A KR19940019402 A KR 19940019402A KR 960009774 A KR960009774 A KR 960009774A
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South Korea
Prior art keywords
clock
fault
signal
elements connected
circuit
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019940019402A
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Korean (ko)
Inventor
오환규
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김광호
삼성전자 주식회사
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Priority to KR1019940019402A priority Critical patent/KR960009774A/en
Publication of KR960009774A publication Critical patent/KR960009774A/en
Withdrawn legal-status Critical Current

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  • Synchronisation In Digital Transmission Systems (AREA)
  • Manipulation Of Pulses (AREA)

Abstract

1. 청구범위에 기재된 발명이 속한 기술분야; 전전자 교환기의 클럭 폴트 검출기술이다.1. the technical field to which the invention described in the claims belongs; It is a clock fault detection technology of an electronic switch.

2. 발명이 해결하려고 하는 기술적 과제; 고집적화가 용이한 클럭 폴트 검출회로를 제공함에 있다.2. The technical problem to be solved by the invention; The present invention provides a clock fault detection circuit that can be easily integrated.

3. 발명의 해결방법의 요지; 발명의 회로는 차례로 연결된 다수의 지연소자를 포함하며, 입력클럭이 제1레벨로서 미리 설정된 클럭구간동안 인가될시 제1폴트 신호를 제공하는 제1검출부와; 차례로 연결된 다수의 지연소자를 포함하며, 상기 입력클럭이 상기 제1레벨과 반대인 제2레벨로서 상기 미리 설정된 클럭 구간동안 인가될시 제2폴트신호를 제공하는 제2검출부와; 상기 제1, 2검출부의 제1, 2폴트신호를 게이팅하여 클럭 폴트신호를 발생하는 신호 발생부를 포함한다. 여기서, 상기 제1, 2검출부는 D타입 플립플롭 회로들로 구성되어 있으며, 상기 미리 설정된 클럭 구간은 상기 입력클럭을 소정 분주한 클럭으로서 사용하는 기준 클럭의 정수배 구간에 대응된다.3. Summary of the Solution of the Invention; The circuit of the invention comprises a plurality of delay elements connected in turn, the first detecting portion providing a first fault signal when an input clock is applied for a preset clock period as a first level; A second detecting unit including a plurality of delay elements connected in sequence and providing a second fault signal when the input clock is applied as the second level opposite to the first level during the preset clock period; And a signal generator for gating the first and second fault signals of the first and second detectors to generate a clock fault signal. Here, the first and second detectors are configured of D-type flip-flop circuits, and the preset clock period corresponds to an integer multiple of a reference clock using the input clock as a predetermined divided clock.

4. 발명의 중요한 용도; 교환 시스템의 클헉 감시용에 사용된다.4. Significant use of the invention; Used for clock monitoring of the exchange system.

※선택도: [제2도]※ Selectivity: [Figure 2]

Description

전전자 교환기의 클럭 폴트 검출회로Clock fault detection circuit of all electronic switch

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명의 클럭 폴트 검출 회로도이다.2 is a clock fault detection circuit diagram of the present invention.

Claims (5)

전전자 교환기에서 입력 클럭의 폴트를 검출하기 위한 회로에 있어서 ; 차레로 연결된 다수의 지연소자를 포함하며, 상기 입력클럭이 제1레벨로서 미리 설정된 클럭구간동안 인가될지 제1폴트 신호를 제공하는 제1검출부와; 차례로 연결된 다수의 지연소자를 포함하며, 상기 입력클럭이 상기 제1레벨과 반대인 제2레벨로서 상기 미리 설정된 클럭 구간동안 인가될시 제2폴트신호를 제공하는 제2검출부와; 상기 제1, 2검출부의 제1, 2폴트신호를 게이팅하여 클럭 플트신호를 발생하는 신호 발생부를 포함하는 것을 특징으로 하는 회로.A circuit for detecting a fault of an input clock in an all-electronic exchange, comprising: A first detection unit including a plurality of delay elements connected in turn and providing a first fault signal whether the input clock is applied during a preset clock period as a first level; A second detecting unit including a plurality of delay elements connected in sequence and providing a second fault signal when the input clock is applied as the second level opposite to the first level during the preset clock period; And a signal generator for generating a clock float signal by gating the first and second fault signals of the first and second detectors. 제1항에 있어서, 상기 지연소자는 D 타입 플립플롭으로 구성됨을 특징으로 한는 회로.The circuit of claim 1, wherein the delay element is configured of a D type flip-flop. 제2항에 있어서, 상기 미리 설정된 클럭 구간은 상기 입력클럭을 소정 분주한 클럭으로서 사용하는 기준 클럭의 정수배 구간에 대응하는 것을 특징으로 하는 회로.The circuit according to claim 2, wherein the predetermined clock section corresponds to an integer multiple section of a reference clock using the input clock as a predetermined divided clock. 제1항에 있어서, 상기 신호 발생부는 상기 제1, 2폴트신호를 오아 게이팅하는 오아 게이트로 구성됨을 특징으로 하는 회로.2. The circuit of claim 1, wherein the signal generator comprises an ora gate for orating the first and second fault signals. 전자식 교환기에서 입력 클럭의 폴트상태를 검출하기 위한 디지탈 회로에 있어서, 차례로 연결된 다수의 플립플롭 소자를 포함하며, 상기 입력클럭이 하이레벨로서 미리 설정된 클럭구간동안 인가될시 제1폴트 신호를 제공하는 제1검출 수단과; 차례로 연결된 다수의 플릴플릅 소자를 포함하며, 상기 입력클럭이 로우레벨로서 상기 미리 설정된 클럭 구간동안 인가될시 제2폴트신호를 제공하는 제2검출 수단과; 상기 제1. 2검출 수단의 제1, 2폴트신호틀 논리합하여 클럭 폴트신호를 발생하는 폴드신호 발생 수단을 가짐을 특징으로 하는 회로.A digital circuit for detecting a fault state of an input clock in an electronic exchange, comprising: a plurality of flip-flop elements connected in turn, the first clock signal being provided as a high level to provide a first fault signal when applied for a preset clock period; First detecting means; A second detecting means including a plurality of flipple elements connected in turn and providing a second fault signal when the input clock is applied as the low level during the predetermined clock period; The first. And a fold signal generating means for generating a clock fault signal by ORing the first and second fault signal frames of the second detecting means. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940019402A 1994-08-06 1994-08-06 Clock fault detection circuit of all electronic switch Withdrawn KR960009774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940019402A KR960009774A (en) 1994-08-06 1994-08-06 Clock fault detection circuit of all electronic switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940019402A KR960009774A (en) 1994-08-06 1994-08-06 Clock fault detection circuit of all electronic switch

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KR960009774A true KR960009774A (en) 1996-03-22

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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
KR100392854B1 (en) * 1999-08-24 2003-07-28 엘지전자 주식회사 Clock Monitor Appratus Of Switching System
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
KR100392854B1 (en) * 1999-08-24 2003-07-28 엘지전자 주식회사 Clock Monitor Appratus Of Switching System
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19940806

PG1501 Laying open of application
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WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid