KR960009774A - Clock fault detection circuit of all electronic switch - Google Patents
Clock fault detection circuit of all electronic switch Download PDFInfo
- Publication number
- KR960009774A KR960009774A KR1019940019402A KR19940019402A KR960009774A KR 960009774 A KR960009774 A KR 960009774A KR 1019940019402 A KR1019940019402 A KR 1019940019402A KR 19940019402 A KR19940019402 A KR 19940019402A KR 960009774 A KR960009774 A KR 960009774A
- Authority
- KR
- South Korea
- Prior art keywords
- clock
- fault
- signal
- elements connected
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- Synchronisation In Digital Transmission Systems (AREA)
- Manipulation Of Pulses (AREA)
Abstract
1. 청구범위에 기재된 발명이 속한 기술분야; 전전자 교환기의 클럭 폴트 검출기술이다.1. the technical field to which the invention described in the claims belongs; It is a clock fault detection technology of an electronic switch.
2. 발명이 해결하려고 하는 기술적 과제; 고집적화가 용이한 클럭 폴트 검출회로를 제공함에 있다.2. The technical problem to be solved by the invention; The present invention provides a clock fault detection circuit that can be easily integrated.
3. 발명의 해결방법의 요지; 발명의 회로는 차례로 연결된 다수의 지연소자를 포함하며, 입력클럭이 제1레벨로서 미리 설정된 클럭구간동안 인가될시 제1폴트 신호를 제공하는 제1검출부와; 차례로 연결된 다수의 지연소자를 포함하며, 상기 입력클럭이 상기 제1레벨과 반대인 제2레벨로서 상기 미리 설정된 클럭 구간동안 인가될시 제2폴트신호를 제공하는 제2검출부와; 상기 제1, 2검출부의 제1, 2폴트신호를 게이팅하여 클럭 폴트신호를 발생하는 신호 발생부를 포함한다. 여기서, 상기 제1, 2검출부는 D타입 플립플롭 회로들로 구성되어 있으며, 상기 미리 설정된 클럭 구간은 상기 입력클럭을 소정 분주한 클럭으로서 사용하는 기준 클럭의 정수배 구간에 대응된다.3. Summary of the Solution of the Invention; The circuit of the invention comprises a plurality of delay elements connected in turn, the first detecting portion providing a first fault signal when an input clock is applied for a preset clock period as a first level; A second detecting unit including a plurality of delay elements connected in sequence and providing a second fault signal when the input clock is applied as the second level opposite to the first level during the preset clock period; And a signal generator for gating the first and second fault signals of the first and second detectors to generate a clock fault signal. Here, the first and second detectors are configured of D-type flip-flop circuits, and the preset clock period corresponds to an integer multiple of a reference clock using the input clock as a predetermined divided clock.
4. 발명의 중요한 용도; 교환 시스템의 클헉 감시용에 사용된다.4. Significant use of the invention; Used for clock monitoring of the exchange system.
※선택도: [제2도]※ Selectivity: [Figure 2]
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도는 본 발명의 클럭 폴트 검출 회로도이다.2 is a clock fault detection circuit diagram of the present invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940019402A KR960009774A (en) | 1994-08-06 | 1994-08-06 | Clock fault detection circuit of all electronic switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940019402A KR960009774A (en) | 1994-08-06 | 1994-08-06 | Clock fault detection circuit of all electronic switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR960009774A true KR960009774A (en) | 1996-03-22 |
Family
ID=66697769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940019402A Withdrawn KR960009774A (en) | 1994-08-06 | 1994-08-06 | Clock fault detection circuit of all electronic switch |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR960009774A (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6281568B1 (en) | 1998-10-21 | 2001-08-28 | Amkor Technology, Inc. | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad |
| US6469369B1 (en) | 1999-06-30 | 2002-10-22 | Amkor Technology, Inc. | Leadframe having a mold inflow groove and method for making |
| US6476478B1 (en) | 1999-11-12 | 2002-11-05 | Amkor Technology, Inc. | Cavity semiconductor package with exposed leads and die pad |
| US6475827B1 (en) | 1999-10-15 | 2002-11-05 | Amkor Technology, Inc. | Method for making a semiconductor package having improved defect testing and increased production yield |
| US6501161B1 (en) | 1999-10-15 | 2002-12-31 | Amkor Technology, Inc. | Semiconductor package having increased solder joint strength |
| US6525406B1 (en) | 1999-10-15 | 2003-02-25 | Amkor Technology, Inc. | Semiconductor device having increased moisture path and increased solder joint strength |
| US6555899B1 (en) | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
| KR100392854B1 (en) * | 1999-08-24 | 2003-07-28 | 엘지전자 주식회사 | Clock Monitor Appratus Of Switching System |
| US6605866B1 (en) | 1999-12-16 | 2003-08-12 | Amkor Technology, Inc. | Stackable semiconductor package and method for manufacturing same |
| US6616436B1 (en) | 1999-10-15 | 2003-09-09 | Amkor Technology, Inc. | Apparatus for manufacturing semiconductor packages |
| US6627976B1 (en) | 1999-10-15 | 2003-09-30 | Amkor Technology, Inc. | Leadframe for semiconductor package and mold for molding the same |
| US6646339B1 (en) | 1999-10-15 | 2003-11-11 | Amkor Technology, Inc. | Thin and heat radiant semiconductor package and method for manufacturing |
| US6677663B1 (en) | 1999-12-30 | 2004-01-13 | Amkor Technology, Inc. | End grid array semiconductor package |
| US6677662B1 (en) | 1999-10-15 | 2004-01-13 | Amkor Technology, Inc. | Clamp and heat block assembly for wire bonding a semiconductor package assembly |
| US6696747B1 (en) | 1999-10-15 | 2004-02-24 | Amkor Technology, Inc. | Semiconductor package having reduced thickness |
| US6730544B1 (en) | 1999-12-20 | 2004-05-04 | Amkor Technology, Inc. | Stackable semiconductor package and method for manufacturing same |
| US6753597B1 (en) | 1999-12-16 | 2004-06-22 | Amkor Technology, Inc. | Encapsulated semiconductor package including chip paddle and leads |
| US6756658B1 (en) | 2001-04-06 | 2004-06-29 | Amkor Technology, Inc. | Making two lead surface mounting high power microleadframe semiconductor packages |
| US6847103B1 (en) | 1999-11-09 | 2005-01-25 | Amkor Technology, Inc. | Semiconductor package with exposed die pad and body-locking leadframe |
| US6853059B1 (en) | 1999-10-15 | 2005-02-08 | Amkor Technology, Inc. | Semiconductor package having improved adhesiveness and ground bonding |
-
1994
- 1994-08-06 KR KR1019940019402A patent/KR960009774A/en not_active Withdrawn
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6281568B1 (en) | 1998-10-21 | 2001-08-28 | Amkor Technology, Inc. | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad |
| US6469369B1 (en) | 1999-06-30 | 2002-10-22 | Amkor Technology, Inc. | Leadframe having a mold inflow groove and method for making |
| KR100392854B1 (en) * | 1999-08-24 | 2003-07-28 | 엘지전자 주식회사 | Clock Monitor Appratus Of Switching System |
| US6627976B1 (en) | 1999-10-15 | 2003-09-30 | Amkor Technology, Inc. | Leadframe for semiconductor package and mold for molding the same |
| US6501161B1 (en) | 1999-10-15 | 2002-12-31 | Amkor Technology, Inc. | Semiconductor package having increased solder joint strength |
| US6525406B1 (en) | 1999-10-15 | 2003-02-25 | Amkor Technology, Inc. | Semiconductor device having increased moisture path and increased solder joint strength |
| US6555899B1 (en) | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
| US6475827B1 (en) | 1999-10-15 | 2002-11-05 | Amkor Technology, Inc. | Method for making a semiconductor package having improved defect testing and increased production yield |
| US6853059B1 (en) | 1999-10-15 | 2005-02-08 | Amkor Technology, Inc. | Semiconductor package having improved adhesiveness and ground bonding |
| US6616436B1 (en) | 1999-10-15 | 2003-09-09 | Amkor Technology, Inc. | Apparatus for manufacturing semiconductor packages |
| US6646339B1 (en) | 1999-10-15 | 2003-11-11 | Amkor Technology, Inc. | Thin and heat radiant semiconductor package and method for manufacturing |
| US6677662B1 (en) | 1999-10-15 | 2004-01-13 | Amkor Technology, Inc. | Clamp and heat block assembly for wire bonding a semiconductor package assembly |
| US6696747B1 (en) | 1999-10-15 | 2004-02-24 | Amkor Technology, Inc. | Semiconductor package having reduced thickness |
| US6847103B1 (en) | 1999-11-09 | 2005-01-25 | Amkor Technology, Inc. | Semiconductor package with exposed die pad and body-locking leadframe |
| US6476478B1 (en) | 1999-11-12 | 2002-11-05 | Amkor Technology, Inc. | Cavity semiconductor package with exposed leads and die pad |
| US6753597B1 (en) | 1999-12-16 | 2004-06-22 | Amkor Technology, Inc. | Encapsulated semiconductor package including chip paddle and leads |
| US6605866B1 (en) | 1999-12-16 | 2003-08-12 | Amkor Technology, Inc. | Stackable semiconductor package and method for manufacturing same |
| US6730544B1 (en) | 1999-12-20 | 2004-05-04 | Amkor Technology, Inc. | Stackable semiconductor package and method for manufacturing same |
| US6677663B1 (en) | 1999-12-30 | 2004-01-13 | Amkor Technology, Inc. | End grid array semiconductor package |
| US6756658B1 (en) | 2001-04-06 | 2004-06-29 | Amkor Technology, Inc. | Making two lead surface mounting high power microleadframe semiconductor packages |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19940806 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |