KR950006133Y1 - Solder structure of lead frame - Google Patents
Solder structure of lead frame Download PDFInfo
- Publication number
- KR950006133Y1 KR950006133Y1 KR92007183U KR920007183U KR950006133Y1 KR 950006133 Y1 KR950006133 Y1 KR 950006133Y1 KR 92007183 U KR92007183 U KR 92007183U KR 920007183 U KR920007183 U KR 920007183U KR 950006133 Y1 KR950006133 Y1 KR 950006133Y1
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- substrate
- printed circuit
- circuit board
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
내용 없음.No content.
Description
제 1 도는 본 고안의 리드 프레임을 기판에 솔더링한 상태의 단면도.1 is a cross-sectional view of a lead frame of the present invention soldered to a substrate.
제 2 도는 제 1 도의 적용상태 단면도.2 is a cross-sectional view of the application state of FIG.
제 3 도는 종래의 리드 프레임용 기판에 솔더링한 상태의 단면도.3 is a cross-sectional view of a conventional lead frame substrate soldered.
제 4 도는 제 3 도의 적용상태 단면도.4 is a cross-sectional view of the application state of FIG.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 리드 프레임 12 : 절곡부10: lead frame 12: bent portion
S : 기판 P : 인쇄회로기판S: Board P: Printed Circuit Board
본 고안은 인쇄회로기판과 기판을 연결시키기 위한 리드 프레임의 솔더링 구조에 관한 것으로, 특히 리드 프레임에 솔더링된 기판이 인쇄회로기판과의 조립시에 기판과 인쇄회로기판이 서로 면접촉을 이루게 하여 제품특성상 받는 압력을 최소화시켜 기판의 파손을 방지할 수 있는 리드 프레임의 솔더링 구조에 관한 것이다.The present invention relates to a soldering structure of a lead frame for connecting a printed circuit board and a board, and in particular, when the board soldered to the lead frame is assembled with the printed circuit board, the board and the printed circuit board make surface contact with each other. It relates to a soldering structure of a lead frame that can minimize the pressure received due to the nature to prevent breakage of the substrate.
종래의 리드 프레임의 솔더링 구조는 제 3 도 및 제 4 도에 도시된 바와 같이 클립 타입(clip type)의 리드 프레임(50)은 그 상부의 형상이 대략형상의 양 단부(52)(52a)와 그 사이로 삽입부(54)가 형성되어 기판(S)을 상기 삽입부(54)에 삽입하고 솔더링한 다음 제 4 도에 도시된 바와 같이 리드 프레임(50)에 솔더링된 기판(S)을 인쇄회로기판(P)에 취부하게 되는데, 리드 프레임(50)의 하단부(52a)의 저면과 인쇄회로기판(P)의 상면이 서로 면접촉이 이루어져 취부하게 되어 결국 기판(S)의 인쇄회로기판(P)사이에 하단부(52a) 만큼의 두께 공간부(G)가 형성되는 것이다.The soldering structure of the conventional lead frame has a clip type lead frame 50 as shown in FIGS. 3 and 4. An insertion portion 54 is formed between both ends 52 and 52a of the shape so that the substrate S is inserted into the insertion portion 54 and soldered, and then the lead frame 50 is shown in FIG. The soldered substrate S is mounted on the printed circuit board P. The bottom surface of the lower end 52a of the lead frame 50 and the upper surface of the printed circuit board P are in surface contact with each other. As a result, a thickness space portion G corresponding to the lower end portion 52a is formed between the printed circuit boards P of the substrate S.
상기와 같은 구조에서는 제품의 특성상 기판(S)의 상면이 압력을 받게 되면 기판(S)과 인쇄회로기판(P)의 공간부(G)가 형성되어 기판(S)이 리드 프레임(50)의 하단부(52a)로부터 찌그러지거나 또는 파단되어 기판(S)을 손상시키는 문제점과 아울러, 다른 문제점은 기판(S)을 삽입부(54)에 삽입한 다음 솔더링을 실시하게 되므로 삽입에 따른 시간이 소요되어 생산성을 저하시키게 되는 것이다.In the above structure, when the upper surface of the substrate S is subjected to pressure due to the characteristics of the product, the space G of the substrate S and the printed circuit board P is formed to form the substrate S of the lead frame 50. In addition to the problem of damaging the substrate S by being crushed or broken from the lower end 52a, another problem is that the inserting the substrate S is inserted into the inserting portion 54 and then soldering is performed. It will lower productivity.
본 고안은 상기한 문제점을 감안하여 기판이 압력을 받게 되더라도 이를 극복하여 기판의 파단을 방지하고 기판에 리드 프레임의 솔더링을 간단하게 하여 생산성을 향상시킬 수 있는 리드 프레임의 솔더링 구조를 제공하는데 그 목적이 있다.In view of the above problems, the present invention overcomes this problem even when the substrate is subjected to pressure, thereby preventing the breakage of the substrate and simplifying the soldering of the lead frame to the substrate, thereby providing a lead frame soldering structure capable of improving productivity. There is this.
본 고안은 상기한 목적을 달성하기 위하여 인쇄회로기판과 기판 연결을 실시하는 리드 프레임의 솔더링 구조에 있어서, 그 하면에 기판(S)의 일측단부 상면을 맞대어 솔더링할 수 있는자형 절골부(12)를 리드프레임(10)의 상단부에 형성하여 구성되는 것을 특징으로 하는 리드 프레임의 솔더링구조를 제공하여주면, 이를 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.The present invention in the soldering structure of the lead frame for connecting the printed circuit board and the board in order to achieve the above object, it can be soldered against the lower surface of the upper end of one side of the substrate (S) Providing a soldering structure of the lead frame, characterized in that formed in the upper end of the lead frame 10, the bone shape section 12, it will be described in detail by the accompanying drawings as follows.
제 1 도는 본 고안의 리드 프레임의 기판에 솔더링한 상태를 나타낸 도면으로, 리드 프레임(10)의 상단부가자 형상의 절곡부(12)를 형성하여 기판(S)을 상기 절곡부(12)의 저면에 삽입하여 솔더링하도록 구성된 것으로, 도면 중 미 설명부호 P은 인쇄회로 기판을 나타낸 것이다.1 is a view showing a state of soldering to the substrate of the lead frame of the present invention, the upper end of the lead frame 10 The bent portion 12 is formed to be formed to solder the substrate S by inserting the substrate S into the bottom of the bent portion 12. In the drawing, reference numeral P denotes a printed circuit board.
제 2 도는 본 고안의 적용상태를 나타낸 도면으로, 리드 프레임(10)의 절곡부(12)에 솔더링된 기판(S)이 인쇄회로기판(P)에 취부되어 있다. 즉 리드 프레임(10)의 절곡부(12) 저면에 솔더링된 기판(S)의 저면이 인쇄회로기판(P)의 상면에 서로 면접촉되어 기판(S)이 외부로부터 압력을 받게되더라도 이 기판(S)에 작용하는 힘이 인쇄회로기판(P)에 전달 분해되어 결국 압력을 감쇄시키게 되어서 기판(S)을 보호하게 되는 것이다.2 is a view showing an application state of the present invention, the substrate (S) soldered to the bent portion 12 of the lead frame 10 is mounted on the printed circuit board (P). That is, even if the bottom surface of the substrate S soldered to the bottom surface of the bent portion 12 of the lead frame 10 is in surface contact with each other on the upper surface of the printed circuit board P, the substrate S may receive pressure from the outside. The force acting on S) is transferred to the printed circuit board P to be decomposed to eventually reduce the pressure to protect the substrate S.
한편 기판(S)에 리드 프레임(10)의 솔더링 시간을 단축시키는 효과를 가지게 되는 것이다.On the other hand, the soldering time of the lead frame 10 to the substrate (S) is to have the effect.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92007183U KR950006133Y1 (en) | 1992-04-29 | 1992-04-29 | Solder structure of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92007183U KR950006133Y1 (en) | 1992-04-29 | 1992-04-29 | Solder structure of lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930024378U KR930024378U (en) | 1993-11-27 |
| KR950006133Y1 true KR950006133Y1 (en) | 1995-07-29 |
Family
ID=19332409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92007183U Expired - Lifetime KR950006133Y1 (en) | 1992-04-29 | 1992-04-29 | Solder structure of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR950006133Y1 (en) |
-
1992
- 1992-04-29 KR KR92007183U patent/KR950006133Y1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR930024378U (en) | 1993-11-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| UA0108 | Application for utility model registration |
Comment text: Application for Utility Model Registration Patent event code: UA01011R08D Patent event date: 19920429 |
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| UA0201 | Request for examination |
Patent event date: 19920429 Patent event code: UA02012R01D Comment text: Request for Examination of Application |
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| UG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| UE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event code: UE09021S01D Patent event date: 19950128 |
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| UG1604 | Publication of application |
Patent event code: UG16041S01I Comment text: Decision on Publication of Application Patent event date: 19950624 |
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| E701 | Decision to grant or registration of patent right | ||
| UE0701 | Decision of registration |
Patent event date: 19951030 Comment text: Decision to Grant Registration Patent event code: UE07011S01D |
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| REGI | Registration of establishment | ||
| UR0701 | Registration of establishment |
Patent event date: 19951129 Patent event code: UR07011E01D Comment text: Registration of Establishment |
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| UR1002 | Payment of registration fee |
Start annual number: 1 End annual number: 3 Payment date: 19951129 |
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| UR1001 | Payment of annual fee |
Payment date: 19980701 Start annual number: 4 End annual number: 6 |
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| UR1001 | Payment of annual fee |
Payment date: 20010707 Start annual number: 7 End annual number: 9 |
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| FPAY | Annual fee payment |
Payment date: 20040727 Year of fee payment: 12 |
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| UR1001 | Payment of annual fee |
Payment date: 20040727 Start annual number: 10 End annual number: 12 |
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| EXPY | Expiration of term | ||
| UC1801 | Expiration of term |
Termination category: Expiration of duration Termination date: 20080110 |