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KR910000832A - 인터레벨 유전체 및 기질 피복물용의 저유전상수 및 저수분흡수율을 갖는 폴리이미드 및 코폴리이미드 - Google Patents

인터레벨 유전체 및 기질 피복물용의 저유전상수 및 저수분흡수율을 갖는 폴리이미드 및 코폴리이미드 Download PDF

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KR910000832A
KR910000832A KR1019890008924A KR890008924A KR910000832A KR 910000832 A KR910000832 A KR 910000832A KR 1019890008924 A KR1019890008924 A KR 1019890008924A KR 890008924 A KR890008924 A KR 890008924A KR 910000832 A KR910000832 A KR 910000832A
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bis
silicon
copolyimide
polyimide
substrate
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진 뷰우러 엘리슨
리챠드 노윅키 닐
에릭 피야르 더글라스
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랄프 챨스 메더스트
아모코 코포레이션
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
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Abstract

내용 없음

Description

인터레벨 유전체 및 기질 피복물용의 저유전상수 및 저수분흡수율을 갖는 폴리이미드 및 코폴리이미드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (23)

  1. 인터레베 유전체 구조물 또는 기질상의 얇은 피복막 형태인, 2,2-비스(3,4-디카복시페닐) 프로판이무수물, 2,2-비스(3,4-디카복시페닐)헥사플루오로 프로판 이무수물 및 이들 각각의 에스테르 및 산중에서 선택된 화합물, 및 3,5-디아미노-t-부틸벤젠, 3,5-디아미노벤조트플루오라이드, 4,4'-비스(p-아미노 페녹시)비페닐, 4,4'-비스(4-아미노-2-트리플루오로메틸)비페닐, 2,2-비스〔4-(p-아미노페녹시)페닐〕프로판 및 3',5-디아미노-1,3,3,6'-테트라메틸-1-(4'-토릴)인단중에서 선택된 방향족 디아민으로부터 제조된 저 유전상수, 저 수분흡수율 및 고 Tg를 갖는 열적으로 안정된 폴리이미드 또는 코폴리이미드.
  2. 제 1 항에 있어서, 인터레벨 유전체 구조 형태의 폴리이미드 또는 코폴리이미드.
  3. 제 1 항에 있어서, 기질상 피복물 형태의 폴리이미드 또는 코폴리이미드.
  4. 제 1 항에 있어서, 산 또는 무수물이 2,2-비스(3,4-디카르복시페닐)헥사플루오로프로판이고 방향족 디아민이 3,5-디아미노-t-부틸벤젠, 4,4'-비스(p-아미노 페녹시)비페닐또는 4,4'-비스(4-아미노-2-트리플루오로메틸페녹시)비페닐인 폴리이미드 또는 코폴리이미드
  5. 제 4 항에 있어서, 인터레벨 유전체 구조 형태의 폴리이미드 또는 코폴리이미드.
  6. 제 4 항에 있어서, 기질상 피복물 형태의 폴리이미드 또는 코폴리이미드.
  7. 제 3 항에 있어서, 기질이 실리콘, 실리콘 디옥사이드, 실리콘 니트라이드, 실리콘 옥시니트라이드, 알루미늄 니트라이드, 갈륨 니트라이드, 알루미늄 옥사이드, 베릴륨 옥사이드, 탄탈륨 니트라이드중에서 선택되는 폴리이미드 또는 코폴리이미드.
  8. 제 1 항에 있어서, 기질이 실리콘, 실리콘 디옥사이드, 실리콘 니트라이드, 실리콘 옥시니트라이드, 알루미늄 니트라이드, 갈륨 니트라이드, 알루미늄 옥사이드, 베릴륨 옥사이드, 탄탈륨 니트라이드 및 2차 중합중에서 선택되는 폴리이미드 또는 코폴리이미드.
  9. 용매 존재하에 방향족 디아민과 화합물을 중합시켜 폴리이미드 또는 코폴리이미드를 제조하여 폴리암산을 함유하는 용액을 만들고; 기질에 용액을 도포하고; 용매를 증발시켜 약 1내지 약 30μ 두께의 폴리이미드 또는 코폴리이미드 피복층을 제조함을 특징으로 하여, 제1항의 기질 피복물을 제조하는 방법.
  10. 용매 존재하에 방향족 디아민과 화합물을 중합시켜 폴리이미드 또는 코폴리이미드를 제조하여 폴리암산을 함유하는 용액을 만들고; 기질상에 용액을 도포하고; 용매를 증발시켜 1내지 30μ 두께의 폴리이미도 또는 코폴리이미드의 피복층을 제조하고; 상기 피복층을 금속 또는 무기물의 상부 접착층에 겹쳐 놓음을 특징으로 하여, 제1항의 인터레벨 유전체 구조물을 제조하는 방법.
  11. 제 9 항에 있어서, 화합물이 2,2-비스(3,4-디카복시페닐) 헥사플루오로프로판 이무수물이고, 디아민은 2,2-비스(4-아미노페닐) 프로판인 방법.
  12. 제 10 항에 있어서, 화합물이 2,2-비스(3,4-디카복시페닐) 헥사플루오로프로판 이무수물이고, 디아민은 4,4-비스(P-아미노페녹시) 비페닐 또는 4,4'-비스(4-이미노-2-트리플루오로메틸페녹시)비페닐중에서 선택하는 방법.
  13. 제 9 항에 있어서, 도포를 스핀 코팅으로 행하는 방법.
  14. 제 10 항에 있어서, 도포를 스핀 코팅으로 행하는 방법.
  15. 제 11 항에 있어서, 도포를 스핀 코팅으로 행하는 방법.
  16. 제 12 항에 있어서, 도포를 스핀 코팅으로 행하는 방법.
  17. 방향족 디아민이 2,2-비스(4-아미노페닐)프로판, m-페닐렌-디아민 및 p-페닐렌아민중에서 선택되고, 금속 또는 무기 물질의 얇은 접착 층에 겹쳐진 기질상에 피복된 인터레벨 유전체 구조물.
  18. 제 17항에 있어서, 기질이 실리콘, 실리콘 디옥사이드, 실리콘 니트라이드, 실리콘 옥시니트라이드, 알루미늄 니트라이드, 갈륨 니트라이드, 알루미늄 옥사이드, 베릴륨 옥사이드 또는 탄탈륨 니트라이드 중에서 선택되는 인터레벨 유전체 구조물.
  19. 제 17항에 있어서, 기질이 실리콘, 실리콘 디옥사이드, 또는 갈륨 아르제나이드인 인터레벨 유전체 구조물.
  20. 제 17항에 있어서, 방향족 디아민이 2,2-비스(4-아미노페닐)프로판인 인터레벨 유전체 구조물.
  21. 제 20 항에 있어서, 기질이 실리콘, 실리콘 디옥사이드, 실리콘 니트라이드, 실리콘 옥시니트라이드, 알루미늄 니트라이드, 갈륨 아르제라이드, 알루미늄 옥사이드, 베릴륨 옥사이드 또는 탄탈륨 니트라이드인 인터레벨 유전체 구조.
  22. 제 20 항에 있어서, 기질이 실리콘, 실리콘 디옥사이드 또는 갈륨 아르제나이드인 인터레벨 구조물.
  23. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890008924A 1988-06-28 1989-06-28 인터레벨 유전체 및 기질 피복물용의 저유전상수 및 저수분흡수율을 갖는 폴리이미드 및 코폴리이미드 Ceased KR910000832A (ko)

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