KR910006706B1 - 발광다이오드 어레이 헤드의 제조방법 - Google Patents
발광다이오드 어레이 헤드의 제조방법 Download PDFInfo
- Publication number
- KR910006706B1 KR910006706B1 KR1019880016530A KR880016530A KR910006706B1 KR 910006706 B1 KR910006706 B1 KR 910006706B1 KR 1019880016530 A KR1019880016530 A KR 1019880016530A KR 880016530 A KR880016530 A KR 880016530A KR 910006706 B1 KR910006706 B1 KR 910006706B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- diode array
- emitting diode
- wiring
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K15/00—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers
- G06K15/02—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers
- G06K15/12—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H10W90/00—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H10W70/099—
-
- H10W70/60—
-
- H10W70/682—
-
- H10W72/073—
-
- H10W72/5522—
-
- H10W72/874—
-
- H10W72/9413—
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Led Device Packages (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (1)
- 발광다이오드 어레이 헤드의 제조방법에 있어서, 발광다이오드 어레이 소자(26)의 두께정도 홈(21)이 형성된 세라믹 기판(20)상에 외부배선(22)과 공통전극으로 이용된 1차배선(24)을 형성하는 제1공정과, 상기 홈(21)에 발광다이오드 어레이소자(26)을 접착하는 제2공정과, 상기 세라믹 기판(20)과 발광다이오드 어레이 소자(26) 상부의 전면에 절면막(30)을 형성하는 제3공정과, 상기 발광다이오드 어레이소자(26)의 개별전극(5)과 외부배선(22)이 드러나도록 절연막(30)을 선택적 에칭하여 접촉창(31)(32)를 형성하는 제4공정과, 상기 형성된 접촉창(31)(32)을 통하여 개별전극(5)과 외부배선(22)를 전기적으로 연결하는 2차배선(34)를 형성함을 특징으로 하는 발광다이오드 어레이 헤드의 제조방법.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019880016530A KR910006706B1 (ko) | 1988-12-12 | 1988-12-12 | 발광다이오드 어레이 헤드의 제조방법 |
| US07/358,161 US4936808A (en) | 1988-12-12 | 1989-05-30 | Method of making an LED array head |
| NL8901403A NL192359C (nl) | 1988-12-12 | 1989-06-02 | Werkwijze voor het vervaardigen van een LED matrixkop. |
| FR8907465A FR2641394B1 (fr) | 1988-12-12 | 1989-06-06 | Procede pour fabriquer une tete d'impression formee d'un reseau de diodes photoemissives |
| JP1178209A JPH0644642B2 (ja) | 1988-12-12 | 1989-07-12 | 発光ダイオードアレイヘッドの製造方法 |
| DE3923633A DE3923633C2 (de) | 1988-12-12 | 1989-07-17 | Verfahren zur Herstellung eines Leuchtdioden-Matrixkopfes |
| GB8926626A GB2225897B (en) | 1988-12-12 | 1989-11-24 | An led array head and a method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019880016530A KR910006706B1 (ko) | 1988-12-12 | 1988-12-12 | 발광다이오드 어레이 헤드의 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR900011053A KR900011053A (ko) | 1990-07-11 |
| KR910006706B1 true KR910006706B1 (ko) | 1991-08-31 |
Family
ID=19280066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019880016530A Expired KR910006706B1 (ko) | 1988-12-12 | 1988-12-12 | 발광다이오드 어레이 헤드의 제조방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4936808A (ko) |
| JP (1) | JPH0644642B2 (ko) |
| KR (1) | KR910006706B1 (ko) |
| DE (1) | DE3923633C2 (ko) |
| FR (1) | FR2641394B1 (ko) |
| GB (1) | GB2225897B (ko) |
| NL (1) | NL192359C (ko) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3323324B2 (ja) * | 1993-06-18 | 2002-09-09 | 株式会社リコー | 発光ダイオードおよび発光ダイオードアレイ |
| JPH07202263A (ja) * | 1993-12-28 | 1995-08-04 | Ricoh Co Ltd | 端面発光型発光ダイオード、アレイ状光源、側面受光型受光素子、受発光素子、端面発光型発光ダイオードアレイ状光源 |
| JP3194423B2 (ja) * | 1996-05-30 | 2001-07-30 | キヤノン株式会社 | 画像形成装置 |
| US6011575A (en) * | 1996-09-10 | 2000-01-04 | Konica Corporation | Image forming apparatus with line-shaped image exposure means |
| GB2329756A (en) | 1997-09-25 | 1999-03-31 | Univ Bristol | Assemblies of light emitting diodes |
| US6200134B1 (en) | 1998-01-20 | 2001-03-13 | Kerr Corporation | Apparatus and method for curing materials with radiation |
| US6867499B1 (en) | 1999-09-30 | 2005-03-15 | Skyworks Solutions, Inc. | Semiconductor packaging |
| AU7748800A (en) * | 1999-09-30 | 2001-04-30 | Alpha Industries, Inc. | Semiconductor packaging |
| US6415505B1 (en) * | 1999-11-15 | 2002-07-09 | Amkor Technology, Inc. | Micromachine package fabrication method |
| US7320593B2 (en) | 2000-03-08 | 2008-01-22 | Tir Systems Ltd. | Light emitting diode light source for curing dental composites |
| KR101164758B1 (ko) | 2002-07-25 | 2012-07-12 | 조나단 에스. 담 | 경화용 발광 다이오드를 사용하기 위한 방법 및 장치 |
| US7182597B2 (en) * | 2002-08-08 | 2007-02-27 | Kerr Corporation | Curing light instrument |
| WO2004038759A2 (en) * | 2002-08-23 | 2004-05-06 | Dahm Jonathan S | Method and apparatus for using light emitting diodes |
| CN101800183B (zh) * | 2002-11-13 | 2013-02-06 | 日本冲信息株式会社 | 具有半导体薄膜的组合半导体装置 |
| DE10353679A1 (de) * | 2003-11-17 | 2005-06-02 | Siemens Ag | Kostengünstige, miniaturisierte Aufbau- und Verbindungstechnik für LEDs und andere optoelektronische Module |
| CA2589570C (en) | 2004-06-15 | 2010-04-13 | Henkel Corporation | High power led electro-optic assembly |
| DE102004047061B4 (de) * | 2004-09-28 | 2018-07-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| DE102004050371A1 (de) * | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer drahtlosen Kontaktierung |
| CN100530714C (zh) * | 2004-09-30 | 2009-08-19 | 奥斯兰姆奥普托半导体有限责任公司 | 具有无线接触的光电子器件 |
| KR101047683B1 (ko) * | 2005-05-17 | 2011-07-08 | 엘지이노텍 주식회사 | 와이어 본딩이 불필요한 발광소자 패키징 방법 |
| US8113830B2 (en) * | 2005-05-27 | 2012-02-14 | Kerr Corporation | Curing light instrument |
| US8047686B2 (en) * | 2006-09-01 | 2011-11-01 | Dahm Jonathan S | Multiple light-emitting element heat pipe assembly |
| DE102008025318A1 (de) * | 2008-05-27 | 2009-12-10 | Setrinx S.A.R.L. | Leuchtchip und Leuchtvorrichtung mit einem solchen |
| US9072572B2 (en) | 2009-04-02 | 2015-07-07 | Kerr Corporation | Dental light device |
| US9066777B2 (en) | 2009-04-02 | 2015-06-30 | Kerr Corporation | Curing light device |
| US20110089531A1 (en) * | 2009-10-16 | 2011-04-21 | Teledyne Scientific & Imaging, Llc | Interposer Based Monolithic Microwave Integrate Circuit (iMMIC) |
| WO2011133973A1 (en) * | 2010-04-23 | 2011-10-27 | Cree, Inc. | Light emitting device array assemblies and related methods |
| DK2506370T3 (en) | 2011-03-30 | 2016-01-18 | Huawei Tech Co Ltd | Submount device for VCSELs |
| US20140001622A1 (en) * | 2012-06-27 | 2014-01-02 | Infineon Technologies Ag | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages |
| US20140015405A1 (en) * | 2012-07-12 | 2014-01-16 | Elementech International Co., Ltd. | Light emitting diode module |
| US20140048824A1 (en) * | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
| JP6024957B2 (ja) * | 2012-09-24 | 2016-11-16 | 東芝ライテック株式会社 | 発光装置および照明装置 |
| CN103594462A (zh) * | 2013-11-07 | 2014-02-19 | 昆山开威电子有限公司 | Led集成封装结构及其封装方法 |
| WO2018117361A1 (ko) * | 2016-12-23 | 2018-06-28 | 주식회사 루멘스 | 마이크로 엘이디 모듈 및 그 제조방법 |
| CN114864565A (zh) * | 2022-04-28 | 2022-08-05 | 深圳信息职业技术学院 | 一种led芯片模组及其制备方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3290539A (en) * | 1963-09-16 | 1966-12-06 | Rca Corp | Planar p-nu junction light source with reflector means to collimate the emitted light |
| US3914137A (en) * | 1971-10-06 | 1975-10-21 | Motorola Inc | Method of manufacturing a light coupled monolithic circuit by selective epitaxial deposition |
| US3860424A (en) * | 1971-12-30 | 1975-01-14 | Bell Telephone Labor Inc | Led display |
| US3936694A (en) * | 1973-12-28 | 1976-02-03 | Sony Corporation | Display structure having light emitting diodes |
| US3964157A (en) * | 1974-10-31 | 1976-06-22 | Bell Telephone Laboratories, Incorporated | Method of mounting semiconductor chips |
| JPS5429239B2 (ko) * | 1974-12-04 | 1979-09-21 | ||
| US4040078A (en) * | 1976-05-11 | 1977-08-02 | Bell Telephone Laboratories, Incorporated | Opto-isolators and method of manufacture |
| US4165474A (en) * | 1977-12-27 | 1979-08-21 | Texas Instruments Incorporated | Optoelectronic displays using uniformly spaced arrays of semi-sphere light-emitting diodes |
| US4241277A (en) * | 1979-03-01 | 1980-12-23 | Amp Incorporated | LED Display panel having bus conductors on flexible support |
| FR2491714A1 (fr) * | 1980-10-06 | 1982-04-09 | Radiotechnique Compelec | Dispositif semi-conducteur a diodes electroluminescentes localisees et son procede de fabrication |
| GB2115198A (en) * | 1982-02-19 | 1983-09-01 | British Steel Corp | Improvements in or relating to visual display instrument component assemblies |
| JPS6089988A (ja) * | 1983-10-24 | 1985-05-20 | Toshiba Corp | 複写機用ledアレイ光源 |
| JPS60136788A (ja) * | 1983-12-26 | 1985-07-20 | 日本ビクター株式会社 | Led平面パネルデイスプレイの製作法 |
| US4611886A (en) * | 1983-12-29 | 1986-09-16 | At&T Bell Laboratories | Integrated optical circuit package |
| JPS6129562A (ja) * | 1984-07-20 | 1986-02-10 | Sanyo Electric Co Ltd | 印字用発光ダイオ−ド |
| WO1986002045A1 (fr) * | 1984-09-27 | 1986-04-10 | Sanyo Electric Co., Ltd. | Tete imprimante optique pour appareil a impression optique |
| EP0206176B1 (en) * | 1985-06-28 | 1992-01-02 | Takiron Co. Ltd. | An optical guide matrix for a dot-matrix luminous display |
-
1988
- 1988-12-12 KR KR1019880016530A patent/KR910006706B1/ko not_active Expired
-
1989
- 1989-05-30 US US07/358,161 patent/US4936808A/en not_active Expired - Lifetime
- 1989-06-02 NL NL8901403A patent/NL192359C/nl not_active IP Right Cessation
- 1989-06-06 FR FR8907465A patent/FR2641394B1/fr not_active Expired - Lifetime
- 1989-07-12 JP JP1178209A patent/JPH0644642B2/ja not_active Expired - Fee Related
- 1989-07-17 DE DE3923633A patent/DE3923633C2/de not_active Expired - Lifetime
- 1989-11-24 GB GB8926626A patent/GB2225897B/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB2225897A (en) | 1990-06-13 |
| FR2641394B1 (fr) | 1994-01-07 |
| DE3923633A1 (de) | 1990-06-13 |
| GB8926626D0 (en) | 1990-01-17 |
| KR900011053A (ko) | 1990-07-11 |
| GB2225897B (en) | 1992-12-23 |
| DE3923633C2 (de) | 1994-12-22 |
| FR2641394A1 (fr) | 1990-07-06 |
| NL192359C (nl) | 1997-06-04 |
| JPH02174274A (ja) | 1990-07-05 |
| JPH0644642B2 (ja) | 1994-06-08 |
| NL192359B (nl) | 1997-02-03 |
| US4936808A (en) | 1990-06-26 |
| NL8901403A (nl) | 1990-07-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910006706B1 (ko) | 발광다이오드 어레이 헤드의 제조방법 | |
| EP0319907B1 (en) | Light emitting diode array chip and method of fabricating the same | |
| US7180099B2 (en) | Semiconductor apparatus with thin semiconductor film | |
| US5134340A (en) | Light-emitting diode printhead | |
| KR20030007061A (ko) | 발광 다이오드 어레이 | |
| US6211537B1 (en) | LED array | |
| JPH0828551B2 (ja) | アレイレーザ | |
| JPS62261465A (ja) | 光プリンタヘツド | |
| EP0510274A1 (en) | Light emitting diode printhead | |
| KR910003277B1 (ko) | 발광다이오우드 어레이의 제조방법 | |
| JPS63274563A (ja) | 光プリンタヘッド用モノリシック発光素子アレイ | |
| JP3592786B2 (ja) | 画像装置 | |
| EP0079904A1 (en) | Light emitting diode array devices and image transfer systems | |
| JP2004195946A (ja) | 光プリンタヘッド | |
| JP3623092B2 (ja) | 光プリンタヘッド | |
| KR900006320B1 (ko) | 발광다이오드 어레이의 전극 형성방법 | |
| JPH07314772A (ja) | Ledヘッドの製造方法 | |
| JPH098345A (ja) | 発光ダイオードアレイチップ | |
| JPH08162674A (ja) | 画像装置 | |
| JPH10332989A (ja) | 光素子モジュールとその製造方法 | |
| JPS62271765A (ja) | 光プリンタヘツド | |
| JP3322979B2 (ja) | 画像装置 | |
| CN112259573A (zh) | 微型发光二极管显示器 | |
| JPH07336495A (ja) | 画像装置 | |
| JPH02305482A (ja) | 半導体光電変換装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 14 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 15 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 16 |
|
| FPAY | Annual fee payment |
Payment date: 20070801 Year of fee payment: 17 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 17 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20080901 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20080901 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |