KR900701929A - 에폭시 수지 조성물 - Google Patents
에폭시 수지 조성물Info
- Publication number
- KR900701929A KR900701929A KR1019900701341A KR900701341A KR900701929A KR 900701929 A KR900701929 A KR 900701929A KR 1019900701341 A KR1019900701341 A KR 1019900701341A KR 900701341 A KR900701341 A KR 900701341A KR 900701929 A KR900701929 A KR 900701929A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- phenolic
- group
- moles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims 20
- 229920000647 polyepoxide Polymers 0.000 title claims 20
- 239000000203 mixture Substances 0.000 title claims 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 6
- 125000003700 epoxy group Chemical group 0.000 claims 4
- 230000001588 bifunctional effect Effects 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 claims 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 150000002989 phenols Chemical class 0.000 claims 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims 1
- 229940018563 3-aminophenol Drugs 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000012783 reinforcing fiber Substances 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
Claims (11)
- 하기 성분 (A),(B),(C),(D)를 필수성분으로 함유하는 것을 특징으로 하는 에폭시 수지 조성물.(A) 2관능 에폭시 수지(B) 3관능 에폭시 수지(C) 하기식으로 대표되는 페놀화합물(단, X1-X8은 Br, Cl 또는 H를 나타내고 X1-X8중 최소한 4개는 Br 또는 Cl 나타내며, R1및 R2는 H 또는 CH3이다.)(D) 4,4´-디아미노디페닐 설폰 또는 3,3´-디아미노디페닐 설폰
- 제1항에 있어서, 2관능에폭시수지(A)가 비스페놀 A형 또는 비스페놀 F형의 에폭시 수지인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, 3관능에폭시수지(B)가 N,N,O-트리글리시딜-P-또는 m-아미노페놀, 1,1,1-(트리글리시딜 옥시페닐)메탄, N,N,O-트리글리시딜-4-아미노-m-5-또는-5-아미노-O-크레졸의 1종 또는 2종 이상의 혼합물인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, (C)성분으로 테트라브로모 비스페놀 A을 사용하는 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, A/B의 에폭시기의 몰비가 1/0.1∼1/1.2, 바람직하게는 1/0.2∼1/1.0인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, (C)의 사용량은 (A)와 (B)의 에폭시기에 대한 (C)의 페놀성 OH기의 비가 1/0.1∼1/0.7인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서,(D)의 사용량은 (A)와 (B)의 에폭시기의 몰수에서 (C)의 페놀성 OH기의 몰수를 뺀 몰수와 (D)의 NH기의 몰수의 비가 1/0.5∼1/1.2인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, (A)의 일부 또는 전부를 (B)의 준비와 혼합하여 이를 (C)의 전부와 예비 반응시키는데 적어도 (C)의 OH의 80%를 예비반응시켜 사용함을 특징으로 하는 에폭시 수지 조성물.
- 제8항에 있어서, 예비반응에 사용된 (A)/(B)의 에폭시기의 몰비는 1/0.2~1/1.4이고 (C)의 사용량은 (A)/(B)의 에폭시기의 총 몰수와 (C)의 페놀성 PH의 몰수의 몰비가 1/0.2∼1/1인 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, (D)의 사용량은 (A)와 (B)의 에폭시기의 몰수에서 (C)의 페놀성 PH기의 몰수를 뺀 몰수와 (D)의 NH기의 몰수의 비가 1/0.5∼1/1.2인 것을 특징으로 하는 에폭시 수지 조성물.
- 하기 성분 (A),(B),(C),(D),(E)를 필수성분으로 함유하는 것을 특징으로 하는 에폭시 수지 조성물.(A) 2관능 에폭시 수지(B) 3관능 에폭시 수지(C) 하기식으로 대표되는 페놀 화합물(단, X1-X8은 Br, Cl 또는 H를 나타내고 X1-X8중 최소한 4개는 Br 또는 Cl 나타내며 R1및 R2는 H 또는 CH3이다.)(D) 4,4´-디아미노디페닐설폰 또는 3,3´-디아미노디페닐 설폰(E) 보강용 섬유※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP1988/001212 WO1990006334A1 (fr) | 1987-06-02 | 1988-11-30 | Resine epoxyde |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR900701929A true KR900701929A (ko) | 1990-12-05 |
| KR940001169B1 KR940001169B1 (ko) | 1994-02-16 |
Family
ID=13930912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019900701341A Expired - Lifetime KR940001169B1 (ko) | 1988-11-30 | 1988-11-30 | 에폭시 수지 조성물 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5053475A (ko) |
| EP (1) | EP0397860B1 (ko) |
| KR (1) | KR940001169B1 (ko) |
| DE (1) | DE3856311T2 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5593770A (en) * | 1989-10-25 | 1997-01-14 | Thiokol Corporation | Chemorheologically tailored matrix resin formulations containing anhydride curing agents |
| US5545278A (en) * | 1989-10-25 | 1996-08-13 | Thiokol Corporation | Method for increasing fiber strength translation in composition pressure vessels using matrix resin formulations containing anhydride curing agents and surface-active agents |
| EP0705856A2 (en) * | 1994-10-07 | 1996-04-10 | Shell Internationale Researchmaatschappij B.V. | Epoxy resin composition for semiconductor encapsulation |
| GB201717639D0 (en) * | 2017-10-26 | 2017-12-13 | Cytec Ind Inc | Resin compositions and resin infusion process |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57109829A (en) * | 1980-12-26 | 1982-07-08 | Asahi Chem Ind Co Ltd | Manufacturing of prepreg |
| JPS58122927A (ja) * | 1982-01-19 | 1983-07-21 | Yuka Shell Epoxy Kk | プリプレグの製造方法 |
| US4588778A (en) * | 1983-05-12 | 1986-05-13 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Toughening reinforced epoxy composites with brominated polymeric additives |
| US4550129A (en) * | 1983-05-12 | 1985-10-29 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Toughening reinforced epoxy composites with brominated polymeric additives |
| JPS59217722A (ja) * | 1983-05-26 | 1984-12-07 | Toray Ind Inc | 炭素繊維プリプレグ用エポキシ樹脂組成物 |
| US4603157A (en) * | 1984-05-23 | 1986-07-29 | Mitsubishi Rayon Co., Ltd. | Intermediate for composite material |
| JPS61148226A (ja) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | 塗料用及び積層板用固体状エポキシ樹脂 |
| US4605710A (en) * | 1985-04-05 | 1986-08-12 | Minnesota Mining And Manufacturing Company | High temperature wire coating powder |
| JPH0778138B2 (ja) * | 1985-12-16 | 1995-08-23 | 東レ株式会社 | 繊維強化プリプレグ用樹脂組成物 |
| US4663400A (en) * | 1986-04-28 | 1987-05-05 | The Dow Chemical Company | Epoxy resins prepared from trisphenols and dicyclopentadiene |
| EP0249263A3 (en) * | 1986-06-09 | 1990-07-11 | Shell Internationale Researchmaatschappij B.V. | Thermoplastic polymer composition having thermosetting processing characteristics |
| JPH0610249B2 (ja) * | 1986-06-30 | 1994-02-09 | 三菱レイヨン株式会社 | エポキシ樹脂組成物 |
| JPH0655808B2 (ja) * | 1988-01-29 | 1994-07-27 | 三菱レイヨン株式会社 | エポキシ樹脂組成物 |
-
1988
- 1988-11-30 KR KR1019900701341A patent/KR940001169B1/ko not_active Expired - Lifetime
- 1988-11-30 EP EP89900141A patent/EP0397860B1/en not_active Expired - Lifetime
- 1988-11-30 US US07/499,343 patent/US5053475A/en not_active Expired - Lifetime
- 1988-11-30 DE DE3856311T patent/DE3856311T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5053475A (en) | 1991-10-01 |
| DE3856311T2 (de) | 1999-08-26 |
| DE3856311D1 (de) | 1999-04-08 |
| EP0397860A1 (en) | 1990-11-22 |
| EP0397860A4 (en) | 1991-09-11 |
| EP0397860B1 (en) | 1999-03-03 |
| KR940001169B1 (ko) | 1994-02-16 |
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