KR900019203A - 반도체 장치와 반도체 장치를 사용한 전자장치 - Google Patents

반도체 장치와 반도체 장치를 사용한 전자장치

Info

Publication number: KR900019203A
Authority: KR; South Korea
Prior art keywords: devices; semiconductor devices; semiconductor; electronic; electronic devices
Prior art date: 1989-05-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

KR1019900007261A

Other languages

English (en)

Other versions

KR940008335B1 (ko

Inventor

아끼라 다나까

가즈지 야마다

다다히꼬 미요시

간지 오쯔까

Original Assignee

가부시기가이샤 히다찌 세이사꾸쇼

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-05-20

Filing date

1990-05-21

Publication date

1990-12-24

1990-05-21 Application filed by 가부시기가이샤 히다찌 세이사꾸쇼 filed Critical 가부시기가이샤 히다찌 세이사꾸쇼

1990-12-24 Publication of KR900019203A publication Critical patent/KR900019203A/ko

1994-09-12 Application granted granted Critical

1994-09-12 Publication of KR940008335B1 publication Critical patent/KR940008335B1/ko

2010-05-21 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10W74/111—
- H10W99/00—
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H10W40/778—
- H10W74/016—
- H10W90/401—
- H10W72/877—
- H10W90/726—

Landscapes

Engineering & Computer Science (AREA)
Metallurgy (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Wire Bonding (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

KR1019900007261A 1989-05-20 1990-05-21 반도체 장치와 반도체 장치를 사용한 전자장치 Expired - Fee Related KR940008335B1 (ko)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP89-127556		1989-05-20
JP1127556A JP2667510B2 (ja)	1989-05-20	1989-05-20	半導体装置およびこれを用いた電子装置

Publications (2)

Publication Number	Publication Date
KR900019203A true KR900019203A (ko)	1990-12-24
KR940008335B1 KR940008335B1 (ko)	1994-09-12

Family

ID=14962939

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1019900007261A Expired - Fee Related KR940008335B1 (ko)	1989-05-20	1990-05-21	반도체 장치와 반도체 장치를 사용한 전자장치

Country Status (5)

Country	Link
EP (1)	EP0399300B1 (ko)
JP (1)	JP2667510B2 (ko)
KR (1)	KR940008335B1 (ko)
CA (1)	CA2017080C (ko)
DE (1)	DE69031323T2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04354342A (ja) *	1991-05-31	1992-12-08	Kawasaki Steel Corp	半導体装置
USRE44685E1 (en)	1994-04-28	2013-12-31	Opentv, Inc.	Apparatus for transmitting and receiving executable applications as for a multimedia system, and method and system to order an item using a distributed computing system
JP3367299B2 (ja) *	1994-11-11	2003-01-14	セイコーエプソン株式会社	樹脂封止型半導体装置およびその製造方法
US6189030B1 (en)	1996-02-21	2001-02-13	Infoseek Corporation	Method and apparatus for redirection of server external hyper-link references
JP4492257B2 (ja) *	2004-08-26	2010-06-30	富士電機システムズ株式会社	半導体モジュールおよびその製造方法
JP5017332B2 (ja) *	2009-08-24	2012-09-05	株式会社日立製作所	インバータ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4132856A (en) *	1977-11-28	1979-01-02	Burroughs Corporation	Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
BE897058A (fr) *	1982-06-25	1983-12-16	Sandoz Sa	Utilisation d'un derive du spiro-succinimide dans le traitement de la demence du type alzheimer
US4890152A (en) *	1986-02-14	1989-12-26	Matsushita Electric Works, Ltd.	Plastic molded chip carrier package and method of fabricating the same
JPS6454338U (ko) *	1987-09-30	1989-04-04

1989
- 1989-05-20 JP JP1127556A patent/JP2667510B2/ja not_active Expired - Fee Related
1990
- 1990-05-10 DE DE69031323T patent/DE69031323T2/de not_active Expired - Fee Related
- 1990-05-10 EP EP90108799A patent/EP0399300B1/en not_active Expired - Lifetime
- 1990-05-17 CA CA002017080A patent/CA2017080C/en not_active Expired - Fee Related
- 1990-05-21 KR KR1019900007261A patent/KR940008335B1/ko not_active Expired - Fee Related

Also Published As

Publication number	Publication date
JPH02306654A (ja)	1990-12-20
JP2667510B2 (ja)	1997-10-27
DE69031323D1 (de)	1997-10-02
EP0399300B1 (en)	1997-08-27
EP0399300A3 (en)	1991-05-02
DE69031323T2 (de)	1998-01-29
EP0399300A2 (en)	1990-11-28
KR940008335B1 (ko)	1994-09-12
CA2017080C (en)	1995-04-18
CA2017080A1 (en)	1990-11-20

Publication	Publication Date	Title
KR910008793A (ko)	1991-05-31	반도체장치 및 그 제조방법
KR900010988A (ko)	1990-07-11	반도체 집적회로장치
KR900008673A (ko)	1990-06-03	반도체집적회로장치
KR910007164A (ko)	1991-04-30	반도체장치 및 그 제조방법
KR900019215A (ko)	1990-12-24	반도체장치 및 그의 제조방법
DE69026164D1 (de)	1996-05-02	Halbleitende integrierte Schaltung
KR890017789A (ko)	1989-12-18	반도체 집적회로장치
KR900017269A (ko)	1990-11-15	반도체 집적회로 장치
KR890015360A (ko)	1989-10-30	반도체장치 및 그 제조방법
DE69031671D1 (de)	1997-12-11	Integrierte Halbleiterschaltung
KR890013797A (ko)	1989-09-26	반도체장치와 그 사용방법
KR900015301A (ko)	1990-10-26	반도체장치 및 그 제조방법
KR900015310A (ko)	1990-10-26	반도체장치와 그 제조방법
DE69026487D1 (de)	1996-05-15	Kartenartige Halbleiteranordnung
DE69032019D1 (de)	1998-03-12	Elektronisches Gerät
DE69031609D1 (de)	1997-11-27	Halbleiteranordnung
KR900015277A (ko)	1990-10-26	반도체장치 및 그 제조방법
DE69026226D1 (de)	1996-05-02	Integrierte Halbleiterschaltung
KR900019203A (ko)	1990-12-24	반도체 장치와 반도체 장치를 사용한 전자장치
KR900019242A (ko)	1990-12-24	반도체장치 및 그 제조방법
DE69029226D1 (de)	1997-01-09	Halbleiteranordnung
DE69025825D1 (de)	1996-04-18	Halbleiteranordnung
DE69027586D1 (de)	1996-08-01	Halbleiteranordnung
DE69333124D1 (de)	2003-09-04	Halbleiteranordnung und Schaltung
KR900011014A (ko)	1990-07-11	반도체 집적회로장치

Legal Events

Date	Code	Title	Description
1990-05-21	PA0109	Patent application	St.27 status event code: A-0-1-A10-A12-nap-PA0109
1990-05-21	R17-X000	Change to representative recorded	St.27 status event code: A-3-3-R10-R17-oth-X000
1990-12-24	PG1501	Laying open of application	St.27 status event code: A-1-1-Q10-Q12-nap-PG1501
1991-05-17	A201	Request for examination
1991-05-17	P11-X000	Amendment of application requested	St.27 status event code: A-2-2-P10-P11-nap-X000
1991-05-17	P13-X000	Application amended	St.27 status event code: A-2-2-P10-P13-nap-X000
1991-05-17	PA0201	Request for examination	St.27 status event code: A-1-2-D10-D11-exm-PA0201
1994-08-18	G160	Decision to publish patent application
1994-09-12	PG1605	Publication of application before grant of patent	St.27 status event code: A-2-2-Q10-Q13-nap-PG1605
1994-12-12	E701	Decision to grant or registration of patent right
1994-12-12	PE0701	Decision of registration	St.27 status event code: A-1-2-D10-D22-exm-PE0701
1995-01-05	GRNT	Written decision to grant
1995-01-05	PR0701	Registration of establishment	St.27 status event code: A-2-4-F10-F11-exm-PR0701
1995-01-05	PR1002	Payment of registration fee	St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1
1997-08-08	PR1001	Payment of annual fee	St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4
1997-12-22	FPAY	Annual fee payment	Payment date: 19971222 Year of fee payment: 7
1997-12-22	PR1001	Payment of annual fee	St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5
1999-01-13	R18-X000	Changes to party contact information recorded	St.27 status event code: A-5-5-R10-R18-oth-X000
1999-03-05	PN2301	Change of applicant	St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301
2001-09-13	LAPS	Lapse due to unpaid annual fee
2001-09-13	PC1903	Unpaid annual fee	St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20010913 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE
2002-06-11	PC1903	Unpaid annual fee	St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20010913
2004-10-27	R18-X000	Changes to party contact information recorded	St.27 status event code: A-5-5-R10-R18-oth-X000
2018-06-15	P22-X000	Classification modified	St.27 status event code: A-4-4-P10-P22-nap-X000
2026-01-06	P22-X000	Classification modified	St.27 status event code: A-4-4-P10-P22-nap-X000