KR900006016B1 - Insulating for vaccum processing of substrates - Google Patents

Abstract

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Description

Apparatus and method for vacuum processing of substrate

1 is a longitudinal cross-sectional view of a device according to the invention comprising two doors.

2 is an enlarged view of a door that is part of the device of FIG.

3a to 3d are schematic views showing the function of the door structure in the pressure drop module of the device of FIG.

4a to 4d are schematic diagrams showing the function of the door structure in the pressure raising module of the apparatus of FIG.

5 is a detailed view of the passageway of the door structure or other part of the pressure drop module or pressure rise module which is inclined 45 ° in the supply and discharge passages of the transfer medium.

FIG. 6 shows the door structure in which the outlet opening is enlarged to enable the transfer medium to fix the substrate under double floating conditions. FIG.

* Explanation of symbols for main parts of the drawings

12 substrate 14 vacuum module

18: pressure rise module 22: storage cassette

24, 76 Q: 30 Transfer media

36: duct 38, 86: inlet

42: valve plate 44, 80: outlet

58 gas phase medium 64 passage

68, 70: detector (optical cell) 78: clean module

100: home

: 상대적인 압력의 상승을 표시

: Displays the relative rise in pressure

: 상대적인 압력의 하강을 표시

: Indicates the relative pressure drop

The present invention relates to an improved apparatus for vacuuming a substrate. In Dutch patent applications 8207318 and 8300443, a double-floating transfer and processing apparatus for a substrate is described.

The conveyance and processing are carried out in a vacuum state in the associated processing module, and in the supply and discharge module of the wafer in terms of conveyance and cleaning of the wafer (substrate), the pressure sometimes drops or rises into the vacuum rather than atmospheric pressure.

In such a device, an inert gas is used and it is circulated or not circulated for reuse.

Thereby, the consumption of gaseous medium per cycle should be limited in the supply discharge module as much as possible for the following reasons. The reasons for this are: 1. The capacity of ultra-fine filter units and pumps for these gases should be kept as low as possible, and 2. The main machining should not be affected by inadequate weavers.

Moreover, the length of these modules for pressure drop and rise should be limited because their processing / transfer system is expensive. They are usually made of stainless steel.

The apparatus according to the invention is characterized in that it is suitable for such conditions and has a door portion in the supply and discharge module and includes a closing inlet and an outlet.

With the outlet closed and the inlet open at the pressure drop module, the substrate enters a tunnel through the inlet, after which a detector located at the door is activated by the substrate to impulse the control means of the inlet to close the inlet. The pressure then drops to the required vacuum at this door, after which the outlet opens. The substrate is then moved from the door through the outlet in the direction of the vacuum module. The detector located between the door and the vacuum module is activated by the substrate, after which the outlet is closed. The entrance then opens again and the next substrate can enter this door.

In the pressure rise module, this door system works in reverse. The door part contains a sealing system for adjusting the next shape of the device, at least from which the conveying gas is released. In the pressure drop module, the outlet of the door is almost completely sealed so that the pressure therein is maintained, which is lower than the pressure in the feed section. Thereby the substrate is moved towards this door by means of gas flow.

Moreover, the discharge opening in this door is opened so that a vacuum is obtained and temporarily maintained so that the degree of vacuum is not lower than that in the transfer section of the vacuum module.

As a result, the substrate exits this door and is moved towards the passage of the processing module by the transfer medium.

The outlet of the door section in the pressure rise module is opened to maintain the pressure in this section, which is slightly lower than the pressure in the transfer section of the vacuum module.

As a result, the gas flow causes the release of the substrate to exit this module and move it towards this door.

In this door where the outlet is almost sealed and a pressure rise is achieved, gas flow causes the substrate to exit the door and move to the next section of the pressure rise module.

In both door systems, the double floating conditions for the substrate in the tunnel passage are maintained and are moved without mechanical contact with the tunnel wall and the entrance. Gas buffering during the movement of the substrate to the door prevents the substrate from colliding with the valve plate at the closed outlet. Such a structure has been described in the applicant's Dutch Patent Application No. 8300443.

In any case, in a highly preferred configuration of the apparatus the release of the transport medium is partially increased to form a buffer of gas, whereby the substrate in the tunnel section maintains double floating conditions in the region of its door.

The next preferred structure of the device is characterized by having a door, the length described above, and a sufficient time to transfer the substrate at a relatively high speed, for example on the order of 100 to 200 mm / sec and also to open the outlet.

In the processing module by the gas phase buffer means, the storage buffer section for the substrate is formed for the continuous collection of the wafer and is discharged from the processing region at high speed. Thereby the substrate is released by this section about every 20 seconds, whereby the substrate is moved to the open door with a temporarily increased degree of vacuum for a short time, for example 2 seconds. The preferred structure of the door thereby comprises a relatively wide discharge channel, which is connected to an outlet having a high degree of vacuum for conveying gas, where the degree of vacuum of the other channel of this door is kept low.

Moreover, the door is fed and closed for a long time, the conveyor is opened between the vacuum module and the door and the door for only 2 seconds.

The valve plate at the outlet and the inlet is moved to a very limited length (for example 1.5 mm). Next, the use of the valve plate is enabled, which can be moved up and down in the chamber by inert gas. Other structures of the door are possible within the scope of the invention.

In FIG. 1, the processing apparatus 10 for processing the board | substrate 12 is shown.

The apparatus mainly supplies the module 14 and the substrate 12 on which the substrate 12 is processed in a vacuum state, and cleans and cleans the pressure drop module 16 and the substrate 12 which drop pressure below atmospheric pressure. And a pressure raising module 18 for raising the pressure from the vacuum state to the atmospheric pressure.

The substrate is continuously sent from the supply cassette 20, and the processed substrate (wafer) is collected in the storage cassette 22. In module 16 the door 24 is located between the supply section 26 and the vacuum section 28. Together with the release of the transfer medium 30 from the vacuum section 28 together with the medium from the processing module 14 via a common discharge duct 32, the supply section 26 of the door 24 It has discharge ducts 34 and 36.

Furthermore, as shown in FIG. 2, the door 24 has an inlet portion 38 having a valve plate 42 located in the chamber 40 and an outlet portion having a valve plate located in the chamber 46. 44).

The gaseous medium 58 is supplied to the chamber 40 through the supply channels 50 and 52 and the chamber 46 through the supply channels 54 and 56 for movement of the valve plates 42 and 48. Such a medium may be the same as in the case of transporters. Thereby it is possible to replace one of the gaseous media with a spring structure to restore the valve plate to its original position in accordance with an aspect of the invention.

Further, the valve plates 42 and 48 are provided with holes 60 and 62 so that the substrate can pass through the passage 64.

In Figures 3a-3d the function of the door 24 is schematically illustrated.

As in FIG. 2, in FIG. 3A, the substrate 12 enters the supply section 26 and is moved along the direction of the door 24 by a plurality of micro flows of gas 30. As shown in FIG. The pressure in the passage 64 in this door is lower than the pressure in the section 26, which is achieved by a slightly higher vacuum at the outlet 34 than in the duct.

Moreover, the valve plate 42 of the inlet portion 38 is located at the lowest portion having a passage through which the substrate can pass.

The valve plate 48 of the outlet 44 is located thereon and seals the passage 64 from the vacuum section 28. In that way the substrate can be moved in the direction of the door 24.

In Fig. 3g, it enters the door 24 of the substrate 12, and as a sensor, a photo cell 68 is activated to send the above-described signal to the control means of the inlet 38. And the valve plate 42 is moved to the upper sealing position by the release of the gas medium 58 passing through the channel 52 and the medium passing through the channel 50 (shown in FIG. 2).

The substrate is moved to this door by means of gas flow 30.

The valve plate 48 is opened (shown in FIG. 3C) by applying a delayed signal (for example, a 0.2 second delay) to the control means of the outlet 44, and then the substrate is moved through the hole 62. This is done by a high degree of vacuum in the vacuum section 28.

Moreover, the sensor signals the control of the door 38, so that the door 38 is opened again.

In that way, the operation cycle is completed and the next substrate is supplied via the supply section 26. It is also not necessary for the substrate to be supplied to the supply section only in the supply cassette.

The speed of the substrate 12 in the processing module 14 is limited to approximately 5 mm per second, 150 substrates (wafers) are processed per hour and it takes 24 seconds for the substrate to pass through the apparatus.

Since the passage speed of the substrate in the supply module is 100 mm per second, it is enough time for the full operation of the door 24.

The pressure increase module 18 is positioned after the outlet 72 of the electro-optic module 14. As a result, the wafer 12 moves from the door back through the vacuum section 74 to the storage cassette 22 through the cleaning module 78.

As shown in Figs. 4A to 4D, the function of the door 76 is as follows.

The outlet 80 is closed at the door 76 and the discharge of the transfer medium 30 through the discharge channel 82 opened at the door is increased, so that the required vacuum degree is obtained, maintained and as shown in FIG. It is greater than the degree of vacuum in the transfer section 116 of the module 14. In addition, the inlet 86 is opened. The substrate 12 enters the door 76 through the open entrance. This activates the optical cell 88, which is the detector, to signal the inlet 86 and the control circuit of the valve 84, which causes it to be sealed as shown in Figure 4b. In a short time of less than 0.3 seconds, the conveying medium 30 is supplied to the door feeder so that the pressure in this small tunnel increases to the pressure of atmospheric pressure. Detector 88 also provides a delayed impulse to the control circuit of outlet 80, after which the outlet opens for 0.5 seconds.

As a result, the substrate 12 is sent to this section 78 through this open outlet 80 and shown in FIGS. 4C and 4D. In FIG. 4C the valve 84 is still closed, which makes it possible to exert an excess pressure on the tunnel passage 90 to direct the substrate 12 out of the door 76.

In any case, as shown in FIG. 4D, the optical cell 92 is activated by the passage of the substrate 12 and as a result sends an impulse to the control circuit of the outlet portion 80, and the passage 90 is closed.

The substrate 12 enters the storage cassette 22 through the clean section 78 through the clean section 78 for bluish blue.

The activated sensitizer 92 applies an impulse to the control circuits of the inlet 86 and the valve 84 whereby the medium is released through the outlet channel 82 first opened and the inlet is opened.

As a result, the pressure in the water drops below the degree of vacuum in the conveyor section 116 of the module 14.

After the inlet 86 is opened, the cycle is repeated again for the next substrate.

Within the scope of the present invention, the system and structure of the device may be modified. That is, for example, the cassette is not used and the substrate is sent from the transfer module and stored in the transfer module, or there may be no double floating transfer of the substrate.

As shown in FIG. 5, the conveyor structure tilted at 45 [deg.] Reliably sends the transfer medium on the substrate and consumes only a very limited amount.

The transfer medium is fed toward the tunnel path 104 through the common channel 94, the interconnected channel 96, the common channel 98 and the plurality of grooves 100, which are located next to each other in the segment 102. This releases the medium out of the passageway 104 and sends it to the common release channel 108 through a channel connected to the discharge groove 106. Segment 102 is located on mounting plate 110.

The stationery antique 24 'is shown in FIG. At the center of the door structure 24 ′ is an enlarged discharge channel 112 for the transport medium. This opens the ejection opening 34 'so that the substrate 12' is sent into the passage 64 'and positioned between these channels 112 and temporarily remains in a double floating state. If the discharge channel 112 is then closed, the substrate immediately moves through the passage 64 '.

Moreover, it is possible for the same conveyor to extend towards the door structure and the conveyor is used in the module 14 with the processing chamber in between. Thereby, the discharge channel is located between successive conveyors and the transfer medium is supplied.

Claims (24)

a. A vacuum module in which the substrate is processed under vacuum; b. A pressure drop module connected to the inlet of the vacuum module and c. And a pressure rising module connected to the outlet of the vacuum module, wherein each of the pressure drop module and the pressure rise module has at least one door in their passage. The vacuum module of claim 1, further comprising a vacuum module including at least one passage including a series of conveyors disposed along a longitudinal direction of the passage to transfer the substrate by a gaseous medium to the inlet and outlet sections of the vacuum module. Characterized in that the device. 2. The flow path of claim 1, further comprising a confined longitudinal passage, a series of fluid medium supply channels disposed along the longitudinal direction of the passage and extending into the passage on both sides of the passage, and between the series of fluid medium supply channels. The pressures arranged along the length of and consisting of fluid medium discharge channels extending from the passage to both sides of the passage and combining the channels such that the substrate is held in the passage at least temporarily in a partially floating state. Apparatus characterized in that the drop module and the pressure rise module. 4. The apparatus of claim 3, wherein the processing of the wafer is applied in a passage in which the double floating state is maintained by at least a portion of the fluid medium. 5. The apparatus of claim 4, wherein at least a portion of the fluidic medium is a gaseous medium. 6. The apparatus of claim 5, wherein the pressure drop module and / or the pressure rise module is configured to at least clean the wafer by a fluid medium and dry the wafer by at least a gaseous medium. 3. The apparatus of claim 2, comprising a gaseous medium discharge channel disposed between the series of gaseous medium supply channels extending into the passageway on both sides of the passageway and a subsequent supply channel, wherein at least a vacuum is used to transfer the substrate in the passageway. And a combination of said channels arranged so that a partial double floating state is at least temporarily maintained. 2. The device of claim 1, wherein the door means has at least one sealable doorway for temporarily closing the passageway of the door. 9. An apparatus according to claim 8, characterized by the door means having a sealable outlet near the outlet and a sealable inlet near the entrance of the door. The substrate is supplied to the passageway of the door means with the inlet part open and the outlet part closed, and at least one detector located at the door means moves the passageway below the inlet part. Activated by the substrate to close the inlet and then open the outlet at intervals. 10. The device according to claim 9, characterized in that said door means consist of at least one separate release duct for the release of the transfer medium. 12. The device according to claim 11, wherein said duct consists of a valve for temporarily sealing said duct in response to a command of said detector disposed in said door. 13. The inlet according to claim 12, wherein as the substrate is fed through the passageway of the door with the inlet open and the outlet closed, the valve in the discharge duct is in an open position and thereafter an activation of the detector disposed in the door. And the outlet is closed at a distance thereafter. 10. The apparatus of claim 9, further comprising a detector positioned in front of the door in the passage of the pressure application module to sense a direction of movement of the wafer and to transmit an impulse to the control means of the inlet and the outlet by passage of the substrate. . 15. An apparatus according to claim 14, wherein the sensor imparts an impulse to the control means of the valve in the separate discharge duct. 16. The pressure drop module according to claim 15, wherein the conveying medium is discharged from the door passage through the discharge duct in the pressure drop module with the inlet portion open and the outlet portion closed, and is temporarily lower than that of the inlet portion of the module in the door passage. Pressure is obtained so that the substrate is temporarily lowered into the door passage, allowing the substrate to enter the door passage, and after the substrate enters the passage, the inlet is closed and the pressure in the door passage The vacuum is depressurized and thereafter the outlet is opened and the substrate exits the doorway to the vacuum module, after which the outlet is closed and the inlet is opened so that the pressure at the door receives the next substrate. Ascending to the method. 16. The method of claim 15, wherein the discharge duct is opened in the pressure rise module in which the inlet portion of the door passage is open to close the outlet portion to release the transfer medium to obtain a vacuum state, and the degree of vacuum in the conveyor section of the vacuum module. Larger than the substrate enters the doorway from the module, after which the board enters the doorway, the valve and the inlet of the discharge duct are closed and the pressure of the doorway is raised and the board is opened after the outlet is opened. Entering the passage of the outlet section of the pressure raising module, after which the valve and the inlet in the discharge duct are opened and the outlet is closed so that the cycle can be repeated for the next substrate. 10. The apparatus of claim 9, further comprising gas phase buffer means in said passageway for temporary storage of said substrate. 19. A door passage according to claim 18, comprising a doorway area having a set of discharge channels on either side of said passage extending from said passage, wherein the pressure at the inlet of the gaseous buffer means and the pressure at the inlet of the discharge channel are maintained. A door passage area having a set of discharge channels on either side of the passage extending from the passage and at the inlet of the gaseous buffer means and the pressure maintained at the inlet of the discharge channel and extending from the passage; Apparatus characterized in that the buffer means. 20. The substrate of claim 19, wherein a substrate enters the door passage through an open inlet and is sent toward the passage area, at which time a low pressure is maintained to reverse the direction in which the transfer medium moves the wafer toward the passage area. To provide a reliable gas phase buffering to the substrate and to terminate the linear movement of the substrate towards the closed exit of the doorway, thereby maintaining the substrate in the double floating state for cushioning to the end. How to feature. 21. The method of claim 20, wherein after said outlet portion is opened said substrate is sent to said adjacent passageway of said module by said overpressure means through said outlet portion opened from said buffer zone. A pressure reducing module comprising a double floating wafer transfer section, a double floating wafer clean section, a double floating drying section, and a double floating pressure drop section and a double floating wafer moving section. A pressure rising module comprising a double floating wafer transfer section and a double floating pressure rise section including a door means, a double floating clean section, a double floating drying section and a double floating wafer transfer section. 24. The apparatus of any one of claims 1 to 23, wherein the substrate is transferred to a double floating state in the pressure adaptation section in the door passage.

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